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| Number | Title | Issue Date |
| 6511866 | Use of diverse materials in air-cavity packaging of electronic devices Semiconductor circuit devices (dies) are incorporated into moisture-impenetrable electronic packages by forming enclosures around the die in three separate parts--base, sidewalls, and lid. The die is first soldered or otherwise bonded to the base, followe... | 01/28/2003 |
| 6214152 | Lead frame moisture barrier for molded plastic electronic packages Electronic packages that consist of dies sealed within hollow plastic enclosures with electrically conductive leads penetrating the enclosure walls to access the die circuitry are manufactured by applying a heat-curable adhesive to the leads at only those... | 04/10/2001 |
| 5816158 | Inverted stamping process Printing of a pattern from a die to a surface is performed by immersing the die in a bath of liquid print material with the die surface facing upward, then either lowering the bath liquid level or raising the die to expose the die surface wet with liquid ... | 10/06/1998 |
| 5706579 | Method of assembling integrated circuit package An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contain... | 01/13/1998 |
| 5572070 | Integrated circuit packages with heat dissipation for high current load An integrated circuit package capable of carrying high wattage and efficiently dissipating heat generated by the die is fabricated from a die, printed wiring board and metal lid, with a beta-stageable resin which is preapplied to the lid and which contain... | 11/05/1996 |
