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| Number | Title | Issue Date |
| 8185716 | Memory system and method for using a memory system with virtual address translation capabilities A memory system comprises a first memory having associated therewith a first local memory access controller configured to access the first local memory using physical memory addresses and a second memory having associated therewith a second local memory access contr... | 05/22/2012 |
| 8183676 | Memory circuit having memory chips parallel connected to ports and corresponding production method A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to t... | 05/22/2012 |
| 8178927 | Integrated circuits having a contact structure having an elongate structure and methods for manufacturing the same In an embodiment, an integrated circuit is provided. The integrated circuit may include an active area extending along a first direction corresponding to a current flow direction through the active area, a contact structure having an elongate structure. The contact ... | 05/15/2012 |
| 8178379 | Integrated circuit, resistivity changing memory device, memory module, and method of fabricating an integrated circuit According to one embodiment of the present invention, a memory device includes a composite structure including a resistivity changing layer and an electrode layer being arranged on or above the resistivity changing layer. The resistivity changing memory device furth... | 05/15/2012 |
| 8164915 | System for electronic components mounted on a circuit board A system for electronic components mounted on a circuit board is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conduct... | 04/24/2012 |
| 8161344 | Circuits and methods for error coding data blocks A description is given of a circuit for creating an error coding data block for a first data block, including a first error coding path adapted to create the error coding data block in accordance with a first error coding; and a second error coding path adapted to c... | 04/17/2012 |
| 8158485 | Integrated circuit device having openings in a layered structure An integrated circuit device includes a substrate with a first layer situated on the substrate. The first layer defines a first opening with a cover layer deposited on the first layer and coating a sidewall portion of the first opening. A second layer is situated on... | 04/17/2012 |
| 8143714 | Integrated circuit and method for producing the same An integrated circuit provides a carrier substrate, a wiring level above a carrier substrate, wherein the wiring level comprises a first conductor track composed of a first conductive material and a second conductor track composed of the first conductive material, a... | 03/27/2012 |
| 8138610 | Multi-chip package with interconnected stacked chips A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate a... | 03/20/2012 |
| 8138538 | Interconnect structure for semiconductor devices One embodiment relates to an integrated circuit formed on a semiconductor body having interconnect between source/drain regions of a first and second transistor. The interconnect includes a metal body arranged underneath the surface of the semiconductor body. A cont... | 03/20/2012 |
| 8130537 | Phase change memory cell with MOSFET driven bipolar access device Embodiments are directed to memory devices comprising a bipolar junction transistor having an emitter, a base and a collector; a first side of a resistance changing memory element coupled to the emitter of the bipolar junction transistor; and a MOSFET coupled to the... | 03/06/2012 |
| 8125812 | Method and device for transmitting outgoing useful signals and an outgoing clock signal Method and device for transmitting outgoing useful signals and an outgoing clock signal. Useful signals and a clock signal are transmitted from a transmitter via a first line pair and a second line pair to a receiver. A first useful signal is transmitted in the form... | 02/28/2012 |
| 8125006 | Array of low resistive vertical diodes and method of production An integrated circuit comprising an array of memory cells and a corresponding production method are described. Each memory cell comprises a resistively switching memory element and a vertical selection diode coupled to a selection line in a selection line trench for... | 02/28/2012 |
| 8124521 | Electrical through contact A method of fabricating an electrical contact through a through hole in a substrate, wherein the through hole is at least in part filled with a liquid conductive material and the solidified liquid conductive material provides an electrical contact through the throug... | 02/28/2012 |
| 8122320 | Integrated circuit including an ECC error counter An integrated circuit includes a memory array and an error correction code (ECC) circuit configured to provide a first signal indicating whether data read from the memory array has been corrected by the ECC circuit. The integrated circuit includes a mimic circuit co... | 02/21/2012 |
| 8120985 | Multi-bank memory device method and apparatus In one embodiment, a memory device comprises a semiconductor substrate, a first set of memory banks disposed on the semiconductor substrate and a second set of memory banks disposed on the semiconductor substrate. Each memory bank of the second set is split into a p... | 02/21/2012 |
| 8120958 | Multi-die memory, apparatus and multi-die memory stack The multi-die memory comprises a first die and a second die. The first die comprises a first group of memory banks, and the second die comprises a second group of memory banks. The first group of memory banks and the second group of memory banks are coupled to a com... | 02/21/2012 |
| 8120186 | Integrated circuit and method An integrated circuit and method of fabricating an integrated circuit. One embodiment includes a circuit chip, a contact pad, and a projecting top contact. A signal line couples the contact pad to the projecting top contact, the contact pad, the projecting top conta... | 02/21/2012 |
| 8120182 | Integrated circuit comprising conductive lines and contact structures and method of manufacturing an integrated circuit An integrated circuit comprises a first conductive lines and second lines as well as contact structures being in contact with the first and second conductive lines. The first conductive lines are arranged in a first metallization level, and second conductive lines a... | 02/21/2012 |
| 8117526 | Apparatus and method for generating a transmit signal and apparatus and method for extracting an original message from a received signal A method for extracting an original message from a received signal including data bits representing the original message or an inverted version thereof, an indicator indicating whether the data bits represent the original message or the inverted version thereof, and... | 02/14/2012 |
| 8116157 | Integrated circuit An integrated circuit is disclosed. One embodiment provides a sense amplifier; a first bit line; a second bit line. A first switch is configured to connect/disconnect the first bit line to/from the sense amplifier. A second switch is configured to connect/disconnect... | 02/14/2012 |
| 8115277 | Integrated circuit having a material structured by a projection A method of making an integrated circuit including structuring a material. The method includes providing an arrangement of three-dimensional bodies. The material is arranged between the bodies and structured directed radiation. The projection pattern of the three-di... | 02/14/2012 |
| RE43162 | Semiconductor memory module, electronic apparatus and method for operating thereof A semiconductor memory module (1) includes a circuit substrate (2), a first (100), a second (200), a third (300) and a fourth (400) rank of memory chips (3), a first register (10) and a second register (20 | 02/07/2012 |
| 8108643 | Semiconductor memory chip and memory system In a semiconductor memory system having a loop forward architecture, the command, address and write data stream and the separate read data stream in form of protocol-based frames transmitted to/from memory chips in the following order: memory controller to the first... | 01/31/2012 |
| 8106686 | Integrated circuit An integrated circuit includes an input terminal for applying an input signal, a further input terminal for applying a further input signal having a level differing from the level of the initial input signal, an output terminal for providing an output signal, a swit... | 01/31/2012 |
| 8105445 | Method and apparatus for fast and local anneal of anti-ferromagnetic (AF) exchange-biased magnetic stacks A method (and structure) of thermally treating a magnetic layer of a wafer, includes annealing, for a predetermined short duration, a magnetic layer of a single wafer. ... | 01/31/2012 |
| 8098086 | Integrated circuit and programmable delay Integrated circuit and programmable delay. One embodiment provides an integrated circuit including a programmable delay element having a plurality of single delay cells. The delay cells include a first input and a second input and a first output. The delay cells are... | 01/17/2012 |
| 8097955 | Interconnect structures and methods Interconnect structures and methods are disclosed. In one embodiment, an interconnect structure includes a via extendable through a workpiece from a first side of the workpiece to a second side of the workpiece. The via is partially filled with a conductive material... | 01/17/2012 |
| 8097915 | Semiconductor memory device A semiconductor memory device comprises a plurality of memory cells, each memory cell having a respective transistor. The transistor comprises a transistor body of a first conductivity type, a drain area and a source area each having a second conductivity type, wher... | 01/17/2012 |
| 8094654 | Information transfer in electronic modules An electronic assembly includes electronic modules connected in a series circuit such that a particular number of input connections of one of the electronic modules is connected with the particular number of output connections of another of the electronic modules. E... | 01/10/2012 |
| 8093696 | Semiconductor device According to one embodiment of the present invention, a semiconductor device is provided, that includes a semiconductor carrier; a cavity formed within the semiconductor carrier, the cavity extending from the top surface of the semiconductor carrier into the semicon... | 01/10/2012 |
| 8093641 | Storage capacitor and method of manufacturing a storage capacitor An integrated circuit including a storage capacitor suitable for use in a DRAM cell, as well as to a method of manufacturing such a storage capacitor is disclosed. The storage capacitor is formed at least partially above a semiconductor substrate surface. The invent... | 01/10/2012 |
| 8084799 | Integrated circuit with memory having a step-like programming characteristic A memory cell includes a first electrode, a second electrode, and phase change material between the first electrode and the second electrode. The phase change material has a step-like programming characteristic. The first electrode, the second electrode, and the pha... | 12/27/2011 |
| 8084759 | Integrated circuit including doped semiconductor line having conductive cladding An integrated circuit includes an array of memory cells and a doped semiconductor line formed in a semiconductor substrate. The doped semiconductor line is coupled to a row of memory cells. The integrated circuit includes conductive cladding contacting the doped sem... | 12/27/2011 |
| 8072792 | Integrated circuit with resistive memory cells and method for manufacturing same An integrated circuit including a resistive memory cell and a method of manufacturing the integrated circuit are described. The integrated circuit comprises a plurality of resistive memory cells and a plurality of voltage supply contacts, wherein at least four resis... | 12/06/2011 |
| 8072085 | Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic p... | 12/06/2011 |
| 8072084 | Integrated circuit, circuit system, and method of manufacturing An integrated circuit, a circuit system and method of manufacturing such is disclosed. One embodiment provides a circuit chip including a first contact field on a chip surface; and an insulating layer on the chip surface. The insulating layer includes a flexible mat... | 12/06/2011 |
| 8072072 | Integrated circuit including different types of gate stacks, corresponding intermediate integrated circuit structure and corresponding integrated circuit The present invention provides a manufacturing method for an integrated circuit and a corresponding integrated circuit. The integrated circuit comprises a plurality of first devices, each first device including a charge storage layer and a control electrode comprisi... | 12/06/2011 |
| 8064243 | Method and apparatus for an integrated circuit with programmable memory cells, data system A method and apparatus for an integrated circuit with programmable memory cells which are arranged between a first and a second conductor for supplying first and second voltage is provided. A control circuit is arranged between the memory cells and the second conduc... | 11/22/2011 |
| 8063394 | Integrated circuit According to an embodiment, an integrated circuit including a plurality of resistance changing memory cells is disclosed. Each memory cell includes a first electrode, a second electrode and resistance changing memory element arranged between the first electrode and ... | 11/22/2011 |
