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| Number | Title | Issue Date |
| 8123107 | Method for forming sputter target assemblies The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, atta... | 02/28/2012 |
| 8097129 | Multilayer nitride-containing coatings This invention relates to erosion resistant coatings comprising at least 2 sublayer systems in which each sublayer system is separated from another by an interlayer, wherein (i) each sublayer system is the same or different and comprises at least 4 layers, (ii) said... | 01/17/2012 |
| 8017230 | Ceramic powders and thermal barrier coatings made therefrom This invention relates to ceramic powders comprising a zirconia-based component, e.g., yttria-stabilized zirconia, and an (alumina+silica)-based component, e.g., mullite. The ceramic powders are useful for forming thermal shock resistant coatings having the same com... | 09/13/2011 |
| 7993438 | High temperature resistant coating compositions An aqueous phosphoric bonding solution consists essentially of phosphoric acid, a source of magnesium ions, and a leachable corrosion inhibitor. The bonding solution is stable with respect to inorganic metal particles, such as aluminum, which are admixed to the bond... | 08/09/2011 |
| 7910225 | Low thermal expansion bondcoats for thermal barrier coatings This invention relates to low thermal expansion bondcoats for thermal barrier coatings. The bondcoats comprise: (i) an inner layer comprising an inner layer alloy of MCrAlM′, and (ii) an outer layer comprising an outer layer alloy of MCrAlM′, wherein M is an ele... | 03/22/2011 |
| 7901799 | Multilayer nitride-containing coatings This invention relates to erosion resistant coatings comprising at least 2 sublayer systems in which each sublayer system is separated from another by an interlayer, wherein (i) each sublayer system is the same or different and comprises at least 4 layers, (ii) said... | 03/08/2011 |
| 7789953 | High temperature resistant coating compositions An aqueous phosphoric bonding solution consists essentially of phosphoric acid, a source of magnesium ions, and a leachable corrosion inhibitor. The bonding solution is stable with respect to inorganic metal particles, such as aluminum, which are admixed to the bond... | 09/07/2010 |
| 7718102 | Froth and method of producing froth Foam for making pads and belts with controlled, reproducible microcellular structure and method of making such foam in a fast and efficient manner. Under constant pressure and temperature, a prepolymer is mixed with the nucleation surfactant in a tank in the presenc... | 05/18/2010 |
| 7655601 | Enhanced melt-textured growth A method for the enhanced melt-textured growth of superconducting crystals is disclosed for a sample having a first material capable of exhibiting superconducting properties. The sample is heated above a peritectic temperature of the first material, cooled below the... | 02/02/2010 |
| 7608172 | High-purity ferromagnetic sputter targets and method of manufacture The method manufactures high-purity ferromagnetic sputter targets by cryogenic working the sputter target blank at a temperature below at least −50° C. to impart at least about 5 percent strain into the sputter target blank to increase PTF uniformity of the targe... | 10/27/2009 |
| 7431195 | Method for centering a sputter target onto a backing plate and the assembly thereof A method for aligning the sputter target onto a backing plate having a peripheral arcuate-shaped flange on its bonding surface to provide an aligned and uniform solder bonded interface; and the sputter target/backing plate assembly so produced. ... | 10/07/2008 |
| 7235143 | Controlled-grain-precious metal sputter targets A precious metal sputter target has a composition selected from the group consisting of platinum, palladium, rhodium, iridium, ruthenium, osmium and single-phase alloys thereof. The sputter target's grain structure is at least about 99 percent recrystallized and has... | 06/26/2007 |
| 7220706 | Enhanced melt-textured growth A method for the enhanced melt-textured growth of superconducting crystals is disclosed for a sample having a first material capable of exhibiting superconducting properties. The sample is heated above a peritectic temperature of the first material, cooled below the... | 05/22/2007 |
| 7081148 | Textured-grain-powder metallurgy tantalum sputter target The sputter target includes a tantalum body having tantalum grains formed from consolidating tantalum powder and a sputter face. The sputter face has an atom transport direction for transporting tantalum atoms away from the sputter face for coating a substrate. The ... | 07/25/2006 |
| 7045172 | Method of shielding effluents in spray devices This invention provides a unique gas shield or shroud surrounding the effluent of a thermal spray device that effectively can extend the working distance or standoff between the thermal spray device and the surface being coated. This invention provides a method of s... | 05/16/2006 |
| 6982116 | Coatings on fiber reinforced composites The invention is a coating and a method for applying coatings to fiber reinforced composite materials. A first polymeric layer, free of fibers and particulate, coats a fiber reinforced polymer substrate. The first layer joins the fiber reinforced polymer substrate t... | 01/03/2006 |
| 6942763 | Textured-metastable aluminum alloy sputter targets and method of manufacture An aluminum alloy sputter target having a sputter target face for sputtering the sputter target is disclosed. The sputter target face has a textured-metastable grain structure. The textured-metastable grain structure has a grain orientation ratio of at least 35 perc... | 09/13/2005 |
| 6896748 | Ultrafine-grain-copper-base sputter targets The sputter target has a composition selected from the group consisting of high-purity copper and copper-base alloys. The sputter target's grain structure is at least about 99 percent recrystallized; and the sputter target's face has a grain orientation ratio of at ... | 05/24/2005 |
| 6863995 | Method for brazing components using a Ni-Au-P ternary brazing alloy, the assembly so produced and the ternary alloy A method for using a novel ternary nickel-gold-phosphorus brazing alloy for joining nickel-based components together and the assembly so formed. ... | 03/08/2005 |
| 6835251 | High-purity aluminum sputter targets and method of manufacture The high-purity aluminum sputter target is at least 99.999 weight percent aluminum and has a grain structure. The grain structure is at least 99 percent recrystallized and has a grain size of less than 200 μm. The method forms high-purity aluminum sputter targets b... | 12/28/2004 |
| 6780526 | Process for producing graded coated articles The invention relates to a novel thermal spray process for the deposition of coatings with a graded or layered composition and the coated articles produced thereby. More particularly, the invention relates to feeding mixtures of coating materials to a thermal spray ... | 08/24/2004 |
| 6770154 | Textured-grain-powder metallurgy tantalum sputter target The sputter target includes a tantalum body having tantalum grains formed from consolidating tantalum powder and a sputter face. The sputter face has an atom transport direction for transporting tantalum atoms away from the sputter face for coating a substrate. The ... | 08/03/2004 |
| 6754062 | Hybrid ceramic electrostatic clamp The invention is a hybrid chuck for securing workpieces with an electrostatic charge. The hybrid chuck includes a dielectric base for supporting the hybrid chuck. The dielectric base has a top surface and a conductive layer covers at least a portion of the top surfa... | 06/22/2004 |
| 6736714 | Polishing silicon wafers An endless belt for a belt type polishing machine comprises a support fabric and a polymer layer of relatively low hardness. The polymer layer is formed with drainage grooves. The support fabric may comprise a non woven or woven material, or a membrane with oriented... | 05/18/2004 |
| 6708870 | Method for forming sputter target assemblies The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, atta... | 03/23/2004 |
