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| Number | Title | Issue Date |
| 7763969 | Structure with semiconductor chips embeded therein An embedded semiconductor chip structure and a method for fabricating the same are proposed. The structure comprises: a carrier board, therewith a plurality of through openings formed in the carrier board, and through trenches surrounding the through openings in the... | 07/27/2010 |
| 7719853 | Electrically connecting terminal structure of circuit board and manufacturing method thereof An electrically connecting terminal structure of a circuit board and a manufacturing method thereof are disclosed. The method includes: providing a circuit board defined with first and second predetermined areas; forming the first electrically connecting pad in the ... | 05/18/2010 |
| 7719104 | Circuit board structure with embedded semiconductor chip and method for fabricating the same The present invention provides a circuit board structure with an embedded semiconductor chip and a method for fabricating the same. The circuit board structure includes a carrier board having a first surface, a second surface, and a through hole penetrating the carr... | 05/18/2010 |
| 7718470 | Package substrate and method for fabricating the same A package substrate and a method for fabricating the same are provided according to the present invention. The package substrate includes: a substrate body with a die attaching side and a ball implanting side lying opposite each other, having a plurality of wire bon... | 05/18/2010 |
| 7706148 | Stack structure of circuit boards embedded with semiconductor chips A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wh... | 04/27/2010 |
| 7705471 | Conductive bump structure of circuit board and method for forming the same A conductive bump structure of a circuit board and a method for forming the same are proposed. A conductive layer is formed on an insulating layer on the surface of the circuit board. A first resist layer is formed on the conductive layer and a plurality of first op... | 04/27/2010 |
| 7705456 | Semiconductor package substrate A semiconductor package substrate includes a main body with a surface having a first circuit layer thereon and a dielectric layer covering the first circuit layer, with a plurality of vias on a portion of the first circuit layer; a plurality of first conductive vias... | 04/27/2010 |
| 7674986 | Circuit board structure having capacitor array and embedded electronic component and method for fabricating the same A circuit board structure having a capacitor array and an embedded electronic component and a method for fabricating the same are proposed. Two carrier boards and a high dielectric constant material layer are provided, wherein the carrier boards have electronic comp... | 03/09/2010 |
| 7674362 | Method for fabrication of a conductive bump structure of a circuit board A method for fabricating a conductive bump structure of a circuit board is disclosed. The circuit board with a plurality of electrical connection pads is provided. An insulating protective layer and a resist layer are successively applied on the circuit board, where... | 03/09/2010 |
| 7659193 | Conductive structures for electrically conductive pads of circuit board and fabrication method thereof Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first ... | 02/09/2010 |
| 7656040 | Stack structure of circuit board with semiconductor component embedded therein A stack structure of circuit boards embedded with semiconductor components therein is proposed, which includes at least two semiconductor components embedded circuit boards, a plurality of conductive bumps, and at least one adhesive layer. The circuit boards are eac... | 02/02/2010 |
| 7656015 | Packaging substrate having heat-dissipating structure Provided is a packaging substrate with a heat-dissipating structure, including a core layer with a first surface and an opposite second surface having a first metal layer and a second metal layer respectively. Portions of the first metal layer are exposed from a sec... | 02/02/2010 |
| 7629204 | Surface roughening method for embedded semiconductor chip structure A surface roughening method for an embedded semiconductor chip structure is proposed. The method includes providing a carrier board with an opening and mounting a semiconductor chip in the opening of the carrier board, the semiconductor chip having a plurality of el... | 12/08/2009 |
| 7627946 | Method for fabricating a metal protection layer on electrically connecting pad of circuit board This invention discloses a method for electroplating nickel/gold on electrically connecting pads on a substrate for chip package and structure thereof. The method comprises: forming a conductive film on a substrate circuit-patterned and defined with a circuit layer;... | 12/08/2009 |
| 7614146 | Method for fabricating circuit board structure The present invention provides a circuit board structure and a method of fabricating circuit board structure the same, the circuit board structure consisting of a carrier board having a first surface and an opposed second surface, the carrier board being formed with... | 11/10/2009 |
| 7608929 | Electrical connector structure of circuit board and method for fabricating the same An electrical connector structure of circuit board and a method for fabricating the same are proposed. A circuit board having a conductive layer is formed with a first resist layer and a second resist layer thereon, so as to form electrical connection pads and metal... | 10/27/2009 |
| 7592706 | Multi-layer circuit board with fine pitches and fabricating method thereof A method for fabricating a multi-layer circuit board with fine pitch is provided. First, a plurality of contact pads is disposed on a core substrate. Next, a first dielectric layer, a second dielectric layer, and a third dielectric layer are formed on the core circu... | 09/22/2009 |
| 7579690 | Semiconductor package structure A semiconductor package structure relates to a chip-embedded semiconductor package electrically connected to a second semiconductor component. The semiconductor package structure comprises a first packaging substrate having a first surface, a second surface and at l... | 08/25/2009 |
| 7554131 | Chip embedded package structure and fabrication method thereof A chip embedded package structure and a fabrication method thereof are proposed. An adhesive layer is formed on a bottom surface of a carrier board having at least one cavity to seal one end of the cavity. At least one semiconductor chip is mounted via its non-activ... | 06/30/2009 |
| 7553750 | Method for fabricating electrical conductive structure of circuit board A method for fabricating an electrical conductive structure of a circuit board is disclosed. The method includes providing a circuit board having a plurality of first and second electrically conductive pads; forming on the circuit board an insulating protection laye... | 06/30/2009 |
| 7546682 | Methods for repairing circuit board having defective pre-soldering bump A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micr... | 06/16/2009 |
| 7544599 | Manufacturing method of solder ball disposing surface structure of package substrate A manufacturing method of a solder ball disposing surface structure on a core board including: providing a core board with a first metal layer and an opposing metal bump-equipped second metal layer; forming resists on the first and second metal layers respectively; ... | 06/09/2009 |
| 7539022 | Chip embedded packaging structure A chip embedded packaging structure includes a first metal board, a second metal board having at least a through cavity, in which the second metal board is disposed on the upper surface of the first metal board to form a heat dissipating substrate, at least a semico... | 05/26/2009 |
| 7519244 | Circuit board with optoelectronic component embedded therein A circuit board structure with optoelectronic component embedded therein comprises a carrier board with at least two through openings; a first optoelectronic component and a second optoelectronic component disposed in the openings respectively, wherein a plurality o... | 04/14/2009 |
| 7514786 | Semiconductor chip electrical connection structure A semiconductor chip electrical connection structure includes electrode pads formed on a surface of a semiconductor chip, wherein the semiconductor chip is mounted via another surface thereof on a carrier; a plurality of conductive bumps formed on the electrode pads... | 04/07/2009 |
| 7514770 | Stack structure of carrier board embedded with semiconductor components and method for fabricating the same A stack structure of a carrier board embedded with semiconductor components and a method for fabricating the same are proposed. The stack structure includes first and second carrier boards having a through hole respectively, first and second semiconductors component... | 04/07/2009 |
| 7508006 | Circuit board structure of integrated optoelectronic component A circuit board structure of an optoelectronic component is proposed. A supporting structure has a first surface and a second surface. At least one optical transceiver has an active surface and an inactive surface. The inactive surface of the optical transceiver is ... | 03/24/2009 |
| 7507915 | Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same A stack structure of carrier boards embedded with semiconductor components and a method for fabricating the same are proposed. A first carrier board and a second carrier board, each of which having at least one through hole, are provided. A first protecting layer an... | 03/24/2009 |
| 7485970 | Semiconductor package substrate having contact pad protective layer formed thereon A semiconductor package substrate and a method for fabricating the same are proposed. An insulating layer has a plurality of blind vias to expose inner traces underneath the insulating layer. A conductive film is formed on the insulating layer and over the bind vias... | 02/03/2009 |
| 7453155 | Method for fabricating a flip chip package A flip chip packaging method is disclosed. First, a substrate is provided, in which the substrate comprises a plurality of integrated circuit (IC) package substrate units therein and the surface of each IC package substrate unit comprises a plurality of connecting p... | 11/18/2008 |
| 7450793 | Semiconductor device integrated with opto-electric component and method for fabricating the same A semiconductor device integrated with opto-electric component and method for fabricating the same provides a wafer with a plurality of optical transmitter/receiver components, and each of the optical transmitter/receiver components having an active surface and an o... | 11/11/2008 |
| 7449363 | Semiconductor package substrate with embedded chip and fabrication method thereof A semiconductor package substrate with embedded chip and a fabrication method thereof are provided. A first insulating layer is applied on a metallic board, and formed with at least one opening for exposing a portion of the metallic board. At least one semiconductor... | 11/11/2008 |
| 7446402 | Substrate structure with embedded semiconductor chip and fabrication method thereof A substrate structure with embedded semiconductor chip and a fabrication method thereof are provided. The method includes: providing a carrier board having a first surface and an opposing second surface, wherein a first opening and an opposing second opening are for... | 11/04/2008 |
| 7435618 | Method to manufacture a coreless packaging substrate A method for manufacturing a coreless packaging substrate is disclosed. The method can produce a coreless packaging substrate which comprises: at least a built-up structure having a first solder mask and a second solder mask, wherein a plurality of openings are form... | 10/14/2008 |
| 7417299 | Direct connection multi-chip semiconductor element structure A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit struc... | 08/26/2008 |
| 7399399 | Method for manufacturing semiconductor package substrate A method for manufacturing a semiconductor package is proposed. A circuit board with a circuit layer on at least one surface thereof is provided. The circuit board has at least one free area, and the circuit layer has a plurality of electrically connecting pads dist... | 07/15/2008 |
| 7396753 | Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same A semiconductor package substrate is provided having a plurality of bonding pads on at least one surface thereof and covered by a conductive film. A photoresist layer formed over the conductive film has a plurality of first openings for exposing portions of the cond... | 07/08/2008 |
| 7396700 | Method for fabricating thermally enhanced semiconductor device A method for fabricating a thermally enhanced semiconductor device. A support plate having at least one opening is mounted on a heat sink. At least one chip is mounted on the heat sink and received in the opening. An insulating layer is formed over the chip and the ... | 07/08/2008 |
| 7378345 | Metal electroplating process of an electrically connecting pad structure of circuit board and structure thereof A metal electroplating process of an electrically connecting pad structure of a circuit board and structure thereof are proposed. First, a circuit board with a patterned circuit layer formed on at least one surface thereof is provided, wherein the circuit layer defi... | 05/27/2008 |
| 7359590 | Semiconductor device integrated with optoelectronic components A semiconductor device integrated with optoelectronic components includes a carrier board with at least two openings; a first and a second optoelectronic component disposed in the openings respectively, each of them having an active surface and an opposite non-activ... | 04/15/2008 |
