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| Number | Title | Issue Date |
| 8117740 | Method and apparatus for manufacturing a probe card In a method of manufacturing a probe card, a plurality of probe modules, including a sacrificial substrate and probes on the sacrificial substrate, is prepared. The probe modules are mutually aligned to form a probe module assembly having the aligned probe modules a... | 02/21/2012 |
| 8114302 | Method of fabricating cantilever type probe and method of fabricating probe card using the same Disclosed is a method of fabricating a cantilever type probes. According to this method, after forming grooves each in tip portion and dummy tip portion regions of a substrate, the tip portion and dummy tip portion are formed with filling the grooves of the tip port... | 02/14/2012 |
| 8012331 | Probe and method of making same Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of ... | 09/06/2011 |
| 7975380 | Method of fabricating a probe card Provided is a probe card and method of fabricating the same. This method comprises forming soldering bumpers electrically connected to conductive patterns on a substrate, forming probes connected to the conductive patterns and supported by the soldering bumpers, and... | 07/12/2011 |
| 7886957 | Method of bonding probes and method of manufacturing a probe card using the same In a method of manufacturing bonding probes, bump layer patterns are formed on terminals of a multi-layered substrate. A first wetting layer pattern having a wettability with respect to a solder paste, and a non-wetting layer pattern having a non-wettability with re... | 02/15/2011 |
| 7867790 | Substrate of probe card and method for regenerating thereof Provided are a substrate of a probe card for installing a plurality of probes thereon to inspect an object by contacting the probes to the object, and a method for repairing the substrate. The substrate includes main channels electrically connected to the probes; an... | 01/11/2011 |
| 7859280 | Probe card for testing semiconductor devices A probe card is disclosed that is easily assembled and maintained and configured to prevent the controlled level of a space transformer from changing due to various causes such as a thermal deformation during a test process. The probe card includes an installation m... | 12/28/2010 |
| 7830162 | Vertical probe and methods of fabricating and bonding the same Disclosed is a vertical probe and methods of fabricating and bonding the same. The probe is comprised of a contactor equipped with two tips, a connector electrically linking with a measuring terminal of a measurement system, And a bump connecting the contactor to th... | 11/09/2010 |
| 7804312 | Silicon wafer for probe bonding and probe bonding method using thereof Disclosed herein are a silicon wafer for probe bonding and a probe bonding method using the same. The silicon wafer for probe bonding is improved in structure to facilitate probe bonding on a probe substrate. The probe bonding method involves bonding supporting beam... | 09/28/2010 |
| 7678587 | Cantilever-type probe and method of fabricating the same Disclosed is a cantilever-type probe and methods of fabricating the same. The probe is comprised of a cantilever being longer lengthwise relative to the directions of width and height, and a tip extending from the bottom of the cantilever and formed at an end of the... | 03/16/2010 |
| 7675305 | Vertical-type electric contactor and manufacture method thereof A vertical-type electric contactor connected to a bump of an electric contactor is provided. The vertical-type electric contactor includes a support beam, vertically bonded with the bump, in which at least two elastic parts are spaced apart from each other; a fixed ... | 03/09/2010 |
| 7602204 | Probe card manufacturing method including sensing probe and the probe card, probe card inspection system There is provided a method of manufacturing a probe card. A first passivation pattern for implementing a tip portion of an electrical inspection probe and a tip portion of a planarity sensing probe on a sacrificial substrate is formed, and an etching process using t... | 10/13/2009 |
| 7511524 | Contact tip structure of a connecting element The present invention relates to a contact tip structure of a connecting element designed for electric testing of electronic components. The connecting element comprises a fixing post coupled to a first electronic component; a beam extending away from said fixing po... | 03/31/2009 |
| 7503811 | Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same The present invention relates to a method of manufacturing an interconnect device for a printed circuit board. According to one aspect of the present invention, a method of manufacturing an interconnect device comprises forming a protective film pattern on a sacrifi... | 03/17/2009 |
| 7466833 | Bone vibrating speaker using the diaphragm and mobile phone thereby In a bone conduction speaker, a body has a shape of a cylinder, and a vibrating plate is inserted to a mastoid to close an upper opening portion of the body. An auxiliary vibrating plate is inserted to the mastoid under the vibrating plate. A vibrating coil is attac... | 12/16/2008 |
| 7452248 | Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same An interconnect assembly including a contact, a first guide film, a space transformer, a second guide film, and an interconnect device including a second contact section having an O-ring-like shape to be inserted into the contact hole by an interference fit, a suppo... | 11/18/2008 |
| 7319773 | Subminiature bone vibrating speaker using the diaphragm and mobile phone thereby The present invention relates to a subminiature bone conduction speaker by using a vibrating plate and a mobile phone having the subminiature bone conduction speaker. A subminiature bone conduction speaker using a vibrating plate according to the present invention c... | 01/15/2008 |
| 7306493 | Interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same The present invention relates to an interconnect device for a printed circuit board, a method of manufacturing the same and an inter-connect assembly having the same. According to one aspect of the present invention, the interconnect device for a printed circuit boa... | 12/11/2007 |
| 7285966 | Probe and method of making same Disclosed herein are a probe and a method of making the same, and more particularly to a probe having a minute pitch, with which a probe card corresponding to arrangement of pads formed with a massed shape or other various shapes on a wafer is made, and a method of ... | 10/23/2007 |
