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| Number | Title | Issue Date |
| 7211205 | High conductivity inks with improved adhesion Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates. ... | 05/01/2007 |
| 7141185 | High conductivity inks with low minimum curing temperatures Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a subs... | 11/28/2006 |
| 7115218 | Low temperature method and composition for producing electrical conductors A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive elect... | 10/03/2006 |
| 7014727 | Method of forming high resolution electronic circuits on a substrate A method of forming high resolution electronic circuits (10) on a substrate (12) is provided. The method includes the steps of laminating a dielectric layer (14) on a substrate (12), laser drilling channels (16 and 18) in th... | 03/21/2006 |
| 6824603 | Composition and method for printing resistors, capacitors and inductors A composition of matter comprising a mixture of an oxide powder or powders and a Reactive Organic Medium (ROM) which can be used to create electronic components on a suitable. The materials are applied to conventional polymer-based circuit substrates by any convenie... | 11/30/2004 |
