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Assignee: Orthodyne Electronics Corporation


Location: Irvine, CA
No. of patents: 12

NumberTitleIssue Date
8141765Cutting blade for a wire bonding system
A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proxim...
03/27/2012
7934633Ribbon bonding tool and process
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underly...
05/03/2011
7909228Ribbon bonding tool and process
An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underly...
03/22/2011
7745253Ribbon bonding in an electronic package
A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliabl...
06/29/2010
7537149Deep access large ribbon bond head
A ribbon bond head capable of deep access bonding is configured to pass the bonding ribbon outside the transducer, e.g., in front of the transducer, instead of through the transducer. A clamping mechanism includes a stationary flat clamp base and a movable clamp arm...
05/26/2009
7443018Integrated circuit package system including ribbon bond interconnect
An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on...
10/28/2008
7407079Automated filament attachment system for vacuum fluorescent display
A filament attachment system includes a bond head comprising a de-spooling system with a spool and balanced dancer arm assembly, a clamp having a curved filament entry, a narrower gripping region, and a wider filament exit, and a bond tool comprising a guide portion...
08/05/2008
7222737Die sorter with reduced mean time to convert
An adapter frame has channels that hold multiple die carriers in each channel. The die carriers, such as 2″×2″ or 4″×4″ waffle packs or GEL-PAK die carriers, slide into the channels and are secured by a spring clip retention mechanism. In other embodiments...
05/29/2007
6471116Wire bonding spool system
A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire therebetween and are driven by a motor drive for rotating or ...
10/29/2002
6439448Large wire bonder head
An ultrasonic wire bonder is disclosed having a bonding head for bonding wire to an electrical or electronic component with a bonding tool. A flexible support formed from at least one arcuate arm, supports the bonding tool for flexible movement of the bon...
08/27/2002
5894981Integrated pull tester with an ultrasonic wire bonder
An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling...
04/20/1999
5868300Articulated wire bonder
A wire bonding head supported for movement upwardly and downwardly having a wire bonding tool connected to an ultrasonic driver in order to sonically bond a wire to an underlying electrical component. The wire is fed to the bonding tool, and fed broken an...
02/09/1999
 
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