"Without question, the greatest invention in the history of mankind is beer. Oh, I grant you that the wheel was also a fine invention, but the wheel does not go nearly as well with pizza."
Dave Barry
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8141765 | Cutting blade for a wire bonding system A cutting blade for a wire bonding system is provided. The cutting blade comprises a body portion having an end portion. The end portion includes a blade tip configured to penetrate into a conductive material The end portion further includes a stepped portion proxim... | 03/27/2012 |
| 7934633 | Ribbon bonding tool and process An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underly... | 05/03/2011 |
| 7909228 | Ribbon bonding tool and process An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underly... | 03/22/2011 |
| 7745253 | Ribbon bonding in an electronic package A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliabl... | 06/29/2010 |
| 7537149 | Deep access large ribbon bond head A ribbon bond head capable of deep access bonding is configured to pass the bonding ribbon outside the transducer, e.g., in front of the transducer, instead of through the transducer. A clamping mechanism includes a stationary flat clamp base and a movable clamp arm... | 05/26/2009 |
| 7443018 | Integrated circuit package system including ribbon bond interconnect An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on... | 10/28/2008 |
| 7407079 | Automated filament attachment system for vacuum fluorescent display A filament attachment system includes a bond head comprising a de-spooling system with a spool and balanced dancer arm assembly, a clamp having a curved filament entry, a narrower gripping region, and a wider filament exit, and a bond tool comprising a guide portion... | 08/05/2008 |
| 7222737 | Die sorter with reduced mean time to convert An adapter frame has channels that hold multiple die carriers in each channel. The die carriers, such as 2″×2″ or 4″×4″ waffle packs or GEL-PAK die carriers, slide into the channels and are secured by a spring clip retention mechanism. In other embodiments... | 05/29/2007 |
| 6471116 | Wire bonding spool system A wire dereeler for an ultrasonic wire bonder with a bond head has a support for rotatably supporting a reel of wire driven by a stepper motor in incremental steps. Two rollers receive the wire therebetween and are driven by a motor drive for rotating or ... | 10/29/2002 |
| 6439448 | Large wire bonder head An ultrasonic wire bonder is disclosed having a bonding head for bonding wire to an electrical or electronic component with a bonding tool. A flexible support formed from at least one arcuate arm, supports the bonding tool for flexible movement of the bon... | 08/27/2002 |
| 5894981 | Integrated pull tester with an ultrasonic wire bonder An ultrasonic wire bonder including apparatus for testing a bond includes a bonding tool ultrasonically driven for welding a wire on an underlying substrate and a clamp for holding the wire to be bonded by the bonding tool. The same clamp or other pulling... | 04/20/1999 |
| 5868300 | Articulated wire bonder A wire bonding head supported for movement upwardly and downwardly having a wire bonding tool connected to an ultrasonic driver in order to sonically bond a wire to an underlying electrical component. The wire is fed to the bonding tool, and fed broken an... | 02/09/1999 |