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| Number | Title | Issue Date |
| 6932896 | Method and apparatus for avoiding particle accumulation in electrodeposition Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary meth... | 08/23/2005 |
| 6908374 | Chemical mechanical polishing endpoint detection The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical processing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during... | 06/21/2005 |
| 6867136 | Method for electrochemically processing a workpiece The present invention relates to a process for forming a near-planar or planar layer of a conducting material, such as copper, on a surface of a workpiece using an ECMPR technique. The process preferably uses at least two separate plating solution chemistries to for... | 03/15/2005 |
| 6858121 | Method and apparatus for filling low aspect ratio cavities with conductive material at high rate The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive dis... | 02/22/2005 |
| 6852208 | Method and apparatus for full surface electrotreating of a wafer Deposition of conductive material on or removal of conductive material from a workpiece frontal side of a semiconductor workpiece is performed by providing an anode having an anode area which is to face the workpiece frontal side, and electrically connecting the wor... | 02/08/2005 |
| 6833063 | Electrochemical edge and bevel cleaning process and system The present invention provides an edge cleaning system and method in which a directed stream of a mild etching solution is supplied to an edge area of a rotating workpiece, including the front surface edge and bevel, while a potential difference between the workpiec... | 12/21/2004 |
| 6815354 | Method and structure for thru-mask contact electrodeposition A process for forming a conductive structure on a substrate is provided. The substrate has a copper seed layer that is partially exposed through a plurality of openings in a masking layer such as a photoresist. The masking layer is formed on the seed layer. The proc... | 11/09/2004 |
| 6797132 | Apparatus for plating and polishing a semiconductor workpiece The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber can be used f... | 09/28/2004 |
| 6780772 | Method and system to provide electroplanarization of a workpiece with a conducting material layer Systems and methods to operate upon a nonplanar top surface of a conductive surface layer of a workpiece, so as to, for example, preserve the structural integrity of a dielectric film layer disposed below the conductive surface layer, are presented. According to an ... | 08/24/2004 |
| 6777338 | Edge and bevel cleaning process and system The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, ... | 08/17/2004 |
| 6773576 | Anode assembly for plating and planarizing a conductive layer A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within ... | 08/10/2004 |
| 6736929 | Distributed control system for semiconductor manufacturing equipment A semiconductor workpiece processing tool includes process modules having a robot loading window and a manual loading window, and a control system for managing a production route defining movement of the workpiece among a number of the process modules. The control s... | 05/18/2004 |
| 6722946 | Advanced chemical mechanical polishing system with smart endpoint detection The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical polishing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during ... | 04/20/2004 |
| 6716084 | Carrier head for holding a wafer and allowing processing on a front face thereof to occur The present invention uses some type of inflatable membrane during processing to establish a vacuum and/or provide a resilient cushion on which the backside of the wafer can rest. In one aspect, the present invention provides an outer vacuum that allow for attachmen... | 04/06/2004 |
| 6692588 | Method and apparatus for simultaneously cleaning and annealing a workpiece The present invention is directed to a method and apparatus for simultaneously cleaning and annealing a plated semiconductor workpiece. A chamber for simultaneously cleaning and annealing a semiconductor workpiece is provided herein. The method according ... | 02/17/2004 |
| 6676822 | Method for electro chemical mechanical deposition The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer usin... | 01/13/2004 |
| 6666959 | Semiconductor workpiece proximity plating methods and apparatus The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achiev... | 12/23/2003 |
| 6649523 | Method and system to provide material removal and planarization employing a reactive pad Systems and methods to remove a first material located on a top surface of a workpiece are presented according to one aspect of the present invention. According to an exemplary method, the pad including a second material is positioned proximate to the wor... | 11/18/2003 |
| 6634935 | Single drive system for a bi-directional linear chemical mechanical polishing apparatus Described is a method and apparatus for producing bi-directional linear polishing that uses a flexible pad. In one aspect, a horizontal drive assembly moves a horizontal slide member that is horizontally moveable over rails attached to a single casting. O... | 10/21/2003 |
| 6630059 | Workpeice proximity plating apparatus The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achiev... | 10/07/2003 |
| 6610190 | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate A system for depositing materials on a surface of a wafer or removing materials from the surface of a wafer includes an electrode, a shaping plate, a liquid solution contained between the electrode and the wafer surface, and electrical contact members con... | 08/26/2003 |
| 6604988 | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing ... | 08/12/2003 |
| 6589105 | Pad tensioning method and system in a bi-directional linear polisher The present invention describes a chemical mechanical polishing apparatus and method that uses a portion of a polishing pad that is disposed under tension between a supply spool and a receive spool, with a motor providing the tension to either the supply ... | 07/08/2003 |
| 6582579 | Methods for repairing defects on a semiconductor substrate The present invention relates to methods for repairing defects on a semiconductor substrate. This is accomplished by selectively depositing the conductive material in defective portions in the cavities while removing residual portions from the field regio... | 06/24/2003 |
| 6534116 | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one a... | 03/18/2003 |
| 6482307 | Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafe... | 11/19/2002 |
| 6471847 | Method for forming an electrical contact with a semiconductor substrate The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conduc... | 10/29/2002 |
| 6468139 | Polishing apparatus and method with a refreshing polishing belt and loadable housing The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete fl... | 10/22/2002 |
| 6464571 | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing ... | 10/15/2002 |
| 6409904 | Method and apparatus for depositing and controlling the texture of a thin film The present invention provides a method and apparatus for plating a conductive material to a substrate and also modifying the physical properties of a conductive film while the substrate is being plated. The present invention further provides a method and... | 06/25/2002 |
| 6402925 | Method and apparatus for electrochemical mechanical deposition The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer and thereafter electropolishes the wafer. The steps that are used when making this application include applying the conductive material to... | 06/11/2002 |
| 6355153 | Chip interconnect and packaging deposition methods and structures The present invention relates to a method for fabricating high performance chip interconnects and packages by providing methods for depositing a conductive material in cavities of a substrate in a more efficient and time saving manner. This is accomplishe... | 03/12/2002 |
| 6352623 | Vertically configured chamber used for multiple processes The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present in... | 03/05/2002 |
| 6328872 | Method and apparatus for plating and polishing a semiconductor substrate The present invention provides a method and apparatus that plates/deposits a conductive material on a semiconductor substrate and then polishes the same substrate. This is achieved by providing multiple chambers in a single apparatus, where one chamber ca... | 12/11/2001 |
| 6207572 | Reverse linear chemical mechanical polisher with loadable housing The present invention is directed to a method and apparatus for polishing a surface of a semiconductor wafer using a pad moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness ... | 03/27/2001 |
| 6176992 | Method and apparatus for electro-chemical mechanical deposition The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer usin... | 01/23/2001 |
| 6103628 | Reverse linear polisher with loadable housing The present invention is directed to a method and apparatus for polishing a surface of a semiconductor wafer using a pad moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness ... | 08/15/2000 |
