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Assignee: Nirei Industry Co., Ltd.


Location: Tokyo, JP
No. of patents: 2

NumberTitleIssue Date
5379494Binder for bundling electric wires or the like
Disclosed is a binder for bundling electric wires or the like, which comprises a long bundling band of synthetic resin which is to be wound like a loop around objects to be bundled such as electric wires or the like to thereby bundle the objects and which...
01/10/1995
5208948Apparatus for and method of binding electric cables
An apparatus for binding electric cables, etc. containing a series of prolonged binding bands wound round an object to be bound, like electric cables, etc., in a loop fashion, formed with a plurality of convex-like gears in a rack fashion on a surface of ...
05/11/1993
 
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