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| Number | Title | Issue Date |
| 8104663 | Solder ball mounting method and apparatus The periphery of a mask (3) is formed higher than a region where a ball holding hole (3a) is formed, a work (1) is arranged at a lower section of the ball holding hole (3a) of the mask (3), and the ball holding hole (... | 01/31/2012 |
| 8102061 | Semiconductor device bonding wire and wire bonding method It is an object of the present invention to provide a copper-based bonding wire whose material cost is low, having excellent ball bondability, reliability in a heat cycle test or reflow test, and storage life, enabling an application to thinning of a wire used for f... | 01/24/2012 |
| 8096858 | Polishing pad conditioner The invention provides a polishing pad conditioner that enables stabilization of brazing metal melting point, minimization of abrasive grain detachment by uniformizing and stabilizing abrasive grain brazing condition, and enhancement of flatness by minimizing therma... | 01/17/2012 |
| 8038973 | High purity silicon production system and production method The present invention provides a high purity silicon production system and production method suitable for using inexpensive metallurgical grade metal silicon as a material and using the slag refining method to produce high purity silicon with a purity of 6N or more ... | 10/18/2011 |
| 8004094 | Copper alloy bonding wire for semiconductor device The present invention provides a semiconductor-device copper-alloy bonding wire which has an inexpensive material cost, ensures a superior ball joining shape, wire joining characteristic, and the like, and a good loop formation characteristic, and a superior mass pr... | 08/23/2011 |
| 7952028 | Bonding wire for semiconductor device A high-performance bonding wire that is suitable for semiconductor mounting technology, such as stacked chip bonding, thinning, and fine pitch mounting, where wire lean (leaning) at an upright position of a ball and spring failure can be suppressed and loop linearit... | 05/31/2011 |
| 7951458 | Coating solution for forming flat-surface insulating film, flat-surface insulating film-coated substrate, and production method of a flat-surface insulating film-coated substrate A coating solution for forming a flat-surface insulating film, which is a coating solution obtained by dissolving a poly(diorgano)siloxane A having a mass average molecular weight of 900 to 10,000 and a metal alkoxide B in an organic solvent C and further adding wat... | 05/31/2011 |
| 7830008 | Gold wire for connecting semiconductor chip Gold wire for connecting a semiconductor chip basically containing praseodymium in 0.0004 mass % to 0.02 mass % in range and, considering the bonding characteristics, containing beryllium or aluminum or both in limited ranges and, considering the precipitates formed... | 11/09/2010 |
| 7820913 | Bonding wire for semiconductor device The present invention provides a bonding wire improved in formability of a ball part, improved in bondability, good in loop controllability, improved in bonding strength of a wedge connection, securing industrial production ability as well, and mainly comprised of c... | 10/26/2010 |
| 7772149 | Exhaust gas purification apparatus for an internal combustion engine and a catalyst for purifying exhaust gas A Cr trapping agent is disposed so that it contacts with constituting components of the substrate containing Cr. As the Cr trapping agent, an element or Ag is used, wherein the element is stronger in basicity than alkali metals or alkaline earth metals. Since the Cr... | 08/10/2010 |
| 7662356 | Method of refining Si The present invention provides a method of refining low purity Si by a slag, in particular removing B, which suppresses wear of the reaction vessel due to the slag and produces high purity Si used for solar battery materials etc. at a low cost, comprising adding SiO... | 02/16/2010 |
| 7615202 | Method for producing high purity silicon An object of the invention is to provide a method for producing a large amount of inexpensive high purity silicon useful for a solar battery. Disclosed is a method for producing high purity silicon by migrating impurities in silicon to slag including performing a fi... | 11/10/2009 |
| 7285486 | Ball transferring method and apparatus Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily ar... | 10/23/2007 |
