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| Number | Title | Issue Date |
| 6896788 | Method of producing a higher-purity metal A method of producing a higher purity metal comprising the step of electrolyzing a coarse metal material by a primary electrolysis to obtain a primary electrodeposited metal, the step of electrolyzing the material with the primary electrodeposited metal obtained in ... | 05/24/2005 |
| 6875325 | Sputtering target producing few particles A sputtering target having a sprayed coating at least on the side face thereof and producing few particles. The deposit produced on the side face of the sputtering target is prevented from separating and flying. ... | 04/05/2005 |
| 6861030 | Method of manufacturing high purity zirconium and hafnium The present invention relates to high-purity zirconium or hafnium with minimal impurities, particularly where the content of alkali metal elements such as Na, K; radioactive elements such as U, Th; transitional metals or heavy metals or high melting point metal elem... | 03/01/2005 |
| 6858116 | Sputtering target producing few particles, backing plate or sputtering apparatus and sputtering method producing few particles A sputtering target producing few particles, a backing plate or a sputtering apparatus, and a sputtering method producing few particles. An arc-spraying coating film and a plasma-spraying coating film over the former are formed on the sputtering target, a backing pl... | 02/22/2005 |
| 6843975 | Oxide sintered body and manufacturing method thereof The present invention relates to an oxide sintered body having a perovskite structure represented with a chemical formula of MRuO3 (M: one or more types among Ca, Sr, Ba), characterized in that the total content of alkali metals such as Na, K, and Fe, Ni,... | 01/18/2005 |
| 6844532 | MoSi2 arc-shaped heater, and method and device for manufacturing the heater A MoSi2 arc-shaped heater formed in a continuous waveform, characterized in that U-shaped heater members having parallel parts are connected alternately to each other at the end parts, and the parallel faces of the U-shaped heater members have an angle re... | 01/18/2005 |
| 6833198 | Copper clad laminate There is provided a copper clad laminate which makes laser beam drilling extremely easy and is suitable for forming an interlayer connection microhole by improving a surface of its copper foil, which is to be used as the surface which a laser beam enters, in the pro... | 12/21/2004 |
| 6793124 | Diffusion-joined target assemly of high-purity cobalt target and copper alloy backing plate and production method therefor The present invention relates to a diffusion bonding target assembly of a high purity cobalt target and a copper alloy backing plate diffusion bonded with an aluminum or aluminum alloy having a thickness of 0.5 mm or more as the insert material. Provided is a diffus... | 09/21/2004 |
| 6759143 | Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor A tantalum or tungsten target-backing plate assembly which comprises a tantalum or tungsten target and a copper alloy backing plate that are subject to diffusion bonding via an aluminum- or aluminum alloy-sheet insert material at least 0.5 mm thick, and which is pro... | 07/06/2004 |
| 6755948 | Titanium target for sputtering A titanium sputtering target that contains a concentration of oxygen in an amount of 20 ppm or less and has a maximum grain diameter of 20 μm or less. The target permits a sputtering operation to be accomplished substantially free from the formation of particles or... | 06/29/2004 |
| 6723183 | Silicide target for depositing less embrittling gate oxide and method of manufacturing silicide target The present invention relates to a non-brittle silicide target for forming a gate oxide film made of MSi0.8-1.2 (M: Zr, Hf), and provides a non-brittle silicide target suitable for forming a ZrO2.SiO2 film or HfO2.SiO... | 04/20/2004 |
| 6638642 | Copper foil excellent in laser beam drilling performance and production method therefor A copper foil with excellent laser drilling property, having a layer containing any one or more substances selected from indium, tin, cobalt, zinc, cobalt alloys, and nickel alloys on the face of the copper foil to be radiated with laser beams. A copper f... | 10/28/2003 |
| 6582535 | Tungsten target for sputtering and method for preparing thereof A tungsten powder having a powder specific surface of 0.4 m2 /g or more is hot-pressed at a temperature of 1,600° C. or more and then subjected to HIP at a temperature of 1,700° C. or more without capsuling, whereby a tungsten target for sput... | 06/24/2003 |
| 6562222 | Copper electroplating liquid, pretreatment liquid for copper electroplating and method of copper electroplating In filling fine via holes or trenches of the wiring (LSI) pattern formed on a semiconductor wafer, a copper electroplating is carried out by using a copper electroplating solution. containing an azole or a silane coupling agent, or a copper electroplating... | 05/13/2003 |
| 6528442 | Optical transparent film and sputtering target for forming optical transparent film To provide an optically transparent film containing 0.01 to 20% by weight glass forming oxide consisting of Nb2 O5, V2 O5, B2 O3, SiO2, and P2 O6 ; 0.01 to 20% b... | 03/04/2003 |
| 6497854 | Cathode material for a lithium secondary battery and method for manufacturing same A cathode material for a lithium secondary battery having a high capacity, an excellent cycle property, and an excellent thermal stability. The cathode material for the lithium secondary battery is a layered compound having a general formula: Lix | 12/24/2002 |
| 6464847 | Sputtering target The present invention relates to a sputtering target characterized in that a part of the direction or the tangential direction of grinding the top surface or the both surfaces of the target is parallel to, or within an angle range of &#b1;45 degrees to th... | 10/15/2002 |
| 6319621 | Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the same To establish a technique of further improving the oxidation resistance of the glossy surface of a copper foil that has a composite layer containing chromium, zinc, and phosphorus on its glossy surface is achieved by a copper foil having excellent oxidatio... | 11/20/2001 |
| 6284111 | Sputtering target free of surface-deformed layers A sputtering target is provided which provides early stabilization of the film-deposition rate of the sputtering target from its initial stage of use. The sputtering target surface subjected to erosion is formed with a surface-deformed layer. The surface-... | 09/04/2001 |
