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...that to encourage use of his new invention, the shopping cart, market owner Sylvan Goldman hired fake shoppers to push the carts around his store in Oklahoma City? Seems his customers were reluctant to give up their hand-carried baskets.
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| Number | Title | Issue Date |
| 7777078 | Copper electrolytic solution and electrolytic copper foil produced therewith The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a catho... | 08/17/2010 |
| 7651783 | Surface treated copper film A surface treated copper foil with improved adhesion to the insulating resin of a copper-clad laminate for higher frequency applications contains a copper foil provided with a heat-resistant layer and an olefin-based silane coupling agent layer sequentially on at le... | 01/26/2010 |
| 7045871 | II-VI compound semiconductor crystal and photoelectric conversion device Since a ZnTe-base compound semiconductor crystal was designed so as to have, on a ZnTe-base compound semiconductor layer, an n-type contact layer which includes a superlattice layer having n-type CdSe and n-type ZnTe grown with each other or a ZnCdSeTe-graded layer,... | 05/16/2006 |
| 6933519 | II-VI compound semiconductor crystal The present invention relates to a II-VI compound semiconductor crystal comprising an n-type contact layer which includes a superlattice layer comprising n-type CdSe and n-type ZnTe stacked with each other, on a ZnTe-base compound semiconductor layer; a A II-VI comp... | 08/23/2005 |
| 7432335 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carbox... | 10/07/2008 |
| 7419536 | Electroless gold plating liquid There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The electroless gold plating liquid contains a cyanide-free water-solubl... | 09/02/2008 |
| 7390354 | Electroless gold plating solution A cyanide-free immersion type electroless gold plating solution that is less toxic can be used at near neutrality and gives an excellent and improved solder adhesion and plated film adhesion is provided. The electroless gold plating solution contains a cyanid... | 06/24/2008 |
| 7378160 | Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In parti... | 05/27/2008 |
| 7300501 | Electroless gold plating liquid The object is to provide an electroless gold plating liquid which has an adequate deposition speed for practical use without containing any thallium or other heavy metal ions, excellent stability of the plating liquid and contains a non-cyanide gold salt as a gold s... | 11/27/2007 |
| 7288242 | Lithium-containing complex oxide and method of producing same A lithium-containing complex oxide exhibits a high performance as a cathode active material of a lithium secondary cell or the like and having a high tap density. A granular lithium-containing complex oxide, such as lithium manganese complex oxide, is made up of “... | 10/30/2007 |
| 7179741 | Electroless plating method and semiconductor wafer on which metal plating layer is formed It is an object of the present invention to provide a semiconductor wafer on which a thin, smooth, uniform and good adhesive electroless plating layer that can be suitable for a seed layer is formed, and to provide an electroless plating method which is suitable for... | 02/20/2007 |
| 7144491 | Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith It is an object of the present invention to obtain a low-profile electrolytic copper foil with a small surface roughness on the side of the rough surface (the opposite side from the lustrous surface) in the manufacture of an electrolytic copper foil using a cathode ... | 12/05/2006 |
| 7109273 | Solid silane coupling agent composition, process for producing the same, and resin composition containing the same It is an object of the present invention to provide a non-gelling solid silane coupling agent which enhances adhesion of a resin composition to metals and so forth when added to the resin composition, and which has excellent storage stability and molten fluidity. | 09/19/2006 |
| 7094845 | Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic ... | 08/22/2006 |
| 7045461 | Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method. According to the metal plating method of the present invention, electroless plating is performed after the surface of a ob... | 05/16/2006 |
| 7005055 | Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In parti... | 02/28/2006 |
| 7002230 | CdTe-base compound semiconductor single crystal for electro-optic element In case of chlorine doping, a CdTe-base compound semiconductor single crystal used for an electro-optic element has a crystal which is set to chlorine concentration ranging from 0.1 ppmwt to 5.0 ppmwt and has no precipitation having diameter of 2 μm or above. In ca... | 02/21/2006 |
| 6989059 | Process for producing single crystal of compound semiconductor and crystal growing apparatus In a production method for producing a compound semiconductor single crystal by LEC method using a crystal growth apparatus with a double crucible structure, it was made to grow up a crystal by covering the second crucible with a plate-like member having a pass-thro... | 01/24/2006 |
| 6960391 | Carrier-attached copper foil and printed board using the copper foil The present invention relates to a carrier-added copper foil and a print substrate using such copper foil characterized in comprising a resin layer and a functional material layer at least on a part of the copper foil. A carrier-added copper foil and a print substra... | 11/01/2005 |
| 6929772 | Manufacturing method of ito powder with tin dissolved in indium oxide, and manufacturing method of ito target A manufacturing method of ITO powder with tin dissolved in indium oxide, wherein the ITO powder is obtained by performing spray pyrolysis to a mixed solution or slurry of indium nitrate and tin chloride in which the concentration of indium and tin is 3.0 mol/L or mo... | 08/16/2005 |
| 6921577 | Water-based metal surface treatment agent A water-based metal surface treatment agent for the surface treatment of metals including aluminum products such as pre-coated aluminum sheets gives excellent coating film adhesion, flexibility and acid resistance. The water-based metal surface treatment agen... | 07/26/2005 |
| 6916865 | Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins The present invention provides an organic carboxylate composition that has long working life, cures epoxy resins, and improves adhesive properties, and also provides a method for producing the same. An organic carboxylate composition, obtained by heating and mixing ... | 07/12/2005 |
| 6900522 | Chamfered semiconductor wafer and method of manufacturing the same In a semiconductor wafer (W) having a periphery thereof chamfered, and having at least a main surface side thereof subjected to mirror finishing, an inclined surface (21) is formed on the periphery of the wafer, such that has an angle (θ) of inclination of t... | 05/31/2005 |
| 6875272 | Method for preparing GaN based compound semiconductor crystal In a method for growing a GaN based compound semiconductor on a front surface of a substrate to obtain the GaN based compound semiconductor crystal in one body, because the gas for reducing and decomposing the substrate is supplied to the rear surface of the substra... | 04/05/2005 |
| 6835241 | Surface treatment for copper foil The present invention provides a surface treatment agent that endows a copper foil with excellent adhesion to insulating resins. The surface treatment agent of the present invention has as its active components an organosilicic compound expressed by a followi... | 12/28/2004 |
| 6809138 | Adhesion accelerator for bonding rubber to metal and rubber composition An adhesion accelerator for bonding rubber to metal contains a metal organic compound containing nickel and another metal organic compound containing zinc. Further, there is provided a rubber composition containing the above adhesion accelerator in an amount of 0.1 ... | 10/26/2004 |
| 6780467 | Plating pretreatment agent and metal plating method using the same The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is trea... | 08/24/2004 |
| 6745092 | Product management system, and host computer and recorded medium used in the system The product management system for sputtering targets is configured between a target manufacturer and target customers via a computer network. The customer and the manufacturer share the various information relating to the product management, such as hysteresis infor... | 06/01/2004 |
| 6710181 | Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the same The present invention provides a novel imidazole/organic monocarboxylic acid salt derivative reaction product capable of improving the adhesion between a resin and a metal such as copper, steel or aluminum, or an inorganic material such as glass fiber, silica, alumi... | 03/23/2004 |
| 6605356 | Metal surface treatment agent, and metal material coated with same A metal surface treatment agent containing the following components (A) to (D), which securely adheres to a metal substrate such as aluminum, exhibits excellent corrosion preventive properties, even with a thin film thickness, and has excellent plasticity... | 08/12/2003 |
| 6562134 | Crystal growing device and method of manufacturing single crystal A crystal growth apparatus comprising a heating furnace capable of controlling uniformly the temperature distribution in the same horizontal plane, and a method for producing a single crystal by using the crystal growth apparatus are provided. In the crys... | 05/13/2003 |
