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Assignee: New Wave Research


Location: Fremont, CA
No. of patents: 9

NumberTitleIssue Date
7169688Method and apparatus for cutting devices from substrates
A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafe...
01/30/2007
7112518Method and apparatus for cutting devices from substrates
A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafe...
09/26/2006
7052976Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
A method and system for cutting a wafer comprising a conductive substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer d...
05/30/2006
6960813Method and apparatus for cutting devices from substrates
A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafe...
11/01/2005
6960739Scribing sapphire substrates with a solid state UV laser
A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage including a vacuum chuck; and directing UV pulses of laser energy directed a...
11/01/2005
6940888Dual head laser system with intra-cavity polarization, and particle image velocimetry system using same
A laser system includes a resonator having two gain modules generating pulses, coupled with intra-cavity polarization into a single beam line, using a single output coupler. A laser controller controls the laser heads to emit pulses in rapid succession, such as puls...
09/06/2005
6806544Method and apparatus for cutting devices from conductive substrates secured during cutting by vacuum pressure
A method and system for cutting a wafer comprising a conductive substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer d...
10/19/2004
6580054Scribing sapphire substrates with a solid state UV laser
A process and system scribe sapphire substrates, by performing the steps of mounting a sapphire substrate, carrying an array of integrated device die, on a stage such as a movable X-Y stage including a vacuum chuck; and directing UV pulses of laser energy...
06/17/2003
6573702Method and apparatus for cleaning electronic test contacts
A method and device for cleaning an electrical contact. Semiconductor testing device. Process of manufacturing integrated circuits. The electrical contact is used for contacting an integrated circuit and accumulates debris during use. The method comprises...
06/03/2003
 
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