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| Number | Title | Issue Date |
| 6215011 | Silane compositions Silane compositions are described which comprise (A) a silane coupling agent; and (B) a tris(silylorgano)amine or alkane characterized by the formulae [(RO)3 SiR1 ]3 N (I) or [(RO)3 SiR1 ]3 CR | 04/10/2001 |
| 6086779 | Copper etching compositions and method for etching copper This invention relates to an aqueous etching composition for etching metallic copper comprising (a) an acid, (b) a copper complexing agent, (c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidatio... | 07/11/2000 |
| 6063172 | Aqueous immersion plating bath and method for plating It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating bath which comprises (A) at least one bath... | 05/16/2000 |
| 5928790 | Multilayer circuit boards and processes of making the same This invention relates to a process for improving the adhesion of copper circuitry to a dielectric layer and a method for forming a multilayer printed circuit board wherein the copper circuitry of the board is covered with a layer of an oxide, hydroxide, ... | 07/27/1999 |
| 5698087 | Plating bath and method for electroplating tin and/or lead It now has been found that a smooth and level deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises (A) at least one bath-soluble metal salt selected from the group consisting of a stannous sal... | 12/16/1997 |
| 5696072 | Pseudoplastic, shear thinned paint stripper A paint-stripper composition is described which comprises a mixture of (A) from about 5% to about 90% by weight of at least one organic solvent selected from the group consisting of benzyl alcohol, alkyl-substituted benzyl alcohols, furfuryl alcohol, alkyl-sub... | 12/09/1997 |
| 5639555 | Multilayer laminates Silane compositions are described which comprise (A) a silane coupling agent; and (B) a tris(silylorgano)amine or alkane characterized by the formulae [(RO)3 SiR1 ]3 N (I) or [(RO)3 SiR | 06/17/1997 |
| 5597975 | Mechanical plating of small arms projectiles The present invention relates to a process for mechanically plating small arms projectiles with a particulate plating metal to form jacketed small arms projectiles. The process comprises agitating a slurry comprising the small arms projectiles, an aqueous... | 01/28/1997 |
| 5554211 | Aqueous electroless plating solutions It has now been found that one or more metals selected from the group consisting of tin, lead, bismuth, indium, gallium and germanium may be deposited onto a metal surface utilizing an aqueous electroless plating solution which comprises (A) at least one ... | 09/10/1996 |
| 5487789 | Paint stripper A paint-stripper composition is described which comprises (A) at least one organic solvent selected from the group consisting of benzyl alcohol, alkyl-substituted benzyl alcohols, furfuryl alcohol, alkyl-substituted furfuryl alcohols and acetylenic alcohols co... | 01/30/1996 |
| 5417840 | Alkaline zinc-nickel alloy plating baths An aqueous alkaline plating bath for the electrodeposition of a zinc-nickel alloy coating on a substrate is described. The plating bath generally comprise (A) zinc ions; (B) nickel ions; and (C) at least one heterocyclic compound having the general formula RN | 05/23/1995 |
| 5417841 | Copper plating of gravure rolls The invention relates to a process for depositing copper on a gravure roll comprising the steps of: immersing a gravure roll in an electroplating bath comprising A) copper, B) sulfuric acid, C) at least one alkoxythio compound, D) at least one sulfonated,... | 05/23/1995 |
| 5415702 | Black chromium-containing conversion coatings on zinc-nickel and zinc-iron alloys A method is described for preparing a black chromium-containing conversion coating on a zinc-nickel alloy surface containing at least about 8% nickel in the alloy or on a zinc-iron alloy surface. The method of the invention comprises contacting said surfa... | 05/16/1995 |
| 5411595 | Post-etch, printed circuit board cleaning process A novel, environmentally innocuous, post-etch, pre-soldering cleaner and cleaning process is disclosed for removing contaminants from plated surfaces of printed circuit boards manufactured by the pattern plating method. The post-etch, cleaning process of ... | 05/02/1995 |
| 5411678 | Paint stripper A paint-stripper composition is described which comprises (A) at least one organic solvent selected from the group consisting of benzyl alcohol, alkyl-substituted benzyl alcohols, furfuryl alcohol, alkyl-substituted furfuryl alcohols and acetylenic alcohols co... | 05/02/1995 |
| 5407749 | Iridescent chromium coatings and method A method is described for producing an iridescent chromium coating on a zinc-nickel alloy surface containing at least about 8% nickel in the alloy. The method of the invention comprises (A) contacting said surface with an aqueous acidic solution maintained at ... | 04/18/1995 |
| 5393353 | Chromium-free black zinc-nickel alloy surfaces A method is described for preparing a black zinc-nickel alloy surface containing at least about 8% nickel in the alloy. The method of the invention comprises contacting said surfaces with a chromium-free aqueous acidic solution of an inorganic acid. Prefe... | 02/28/1995 |
| 5393354 | Iridescent chromium coatings and method A method is described for producing an iridescent chromium coating on a zinc-nickel alloy surface containing at least about 8% nickel in the alloy. The method of the invention comprises (A) contacting said surface with an aqueous acidic solution maintained at ... | 02/28/1995 |
| 5232575 | Polymeric leveling additive for acid electroplating baths Acid, electroplating baths having consistent leveler activity contain levelers which are quaternized near-monodisperse polymers of acrylic or methacrylic trialkyl amine esters. The polymers may contain hydroxyalkyl acrylate or methacrylate ester component... | 08/03/1993 |
| 5221328 | Method of controlling orthophosphite ion concentration in hyphophosphite-based electroless plating baths This invention relates to a method of controlling orthophosphite ion concentration in a hypophosphite-based electroless metal plating bath, comprising the steps of contacting the plating bath with a yttrium or a lanthanide series metal salt, and removing ... | 06/22/1993 |
| 5217751 | Stabilized spray displacement plating process An efficient spray displacement tin plating process of copper printed circuit innerlayers is disclosed for the manufacture of multilayer printed circuit boards. The displacement tin plating solution is stabilized and replenished by incorporating free tin ... | 06/08/1993 |
| 5211831 | Process for extending the life of a displacement plating bath A stabilized spray displacement tin plating process of copper printed circuit innerlayers is disclosed for the manufacture of multilayer printed circuit boards. During prolonged use of spray tin plating, the plating solution becomes saturated with cupurou... | 05/18/1993 |
| 5200057 | Additive composition, acid zinc and zinc-alloy plating baths and methods for electrodedepositing zinc and zinc alloys An additive composition is described with comprises a mixture of (a) poly(N-vinyl-2-pyrrolidone), and p0 (b) at least one sulfur-containing compound selected from compounds of the formulae RS(R'O)n H (I) or S--[... | 04/06/1993 |
| 5196053 | Complexing agent for displacement tin plating An environmentally innocuous effective replacement for thiourea is disclosed for use as a complexing agent in displacement plating processes in which the plating solution is applied to the substrate surface to be plated by immersion or by spraying, cascad... | 03/23/1993 |
| 5174886 | High-throw acid copper plating using inert electrolyte Improved through-hole plating of printed circuit boards, wherein the ratio of the printed circuit board thickness to the diameter of at least one through hole is greater than 3 to 1, is achieved by a high-throw acid copper plating bath of this invention. ... | 12/29/1992 |
| 5156672 | Mechanical plating paste This invention relates to a paste composition, comprising: (A) at least 12% by weight of a paste forming compound and (B) at least one oxidizing agent which is a metal oxide or salt; (C) at least one reducing metal wherein (B) and (C) are capable of forming a metal... | 10/20/1992 |
| 5151170 | Acid copper electroplating bath containing brightening additive For acid copper plating baths containing a brightener used to produce smooth copper coatings of high brilliancy, it has been found that the "break-in" period normally needed after a brightener is added to the plating bath, has been virtually eliminated by... | 09/29/1992 |
| 4885064 | Additive composition, plating bath and method for electroplating tin and/or lead It now has been found that a smooth, level, matte and/or bright deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises (A) at least one bath-soluble metal salt selected from the group consisting ... | 12/05/1989 |
| 4880132 | Process for plating adherent co-deposit of aluminum, zinc, and tin onto metallic substrates, and apparatus A co-deposit of aluminum, zinc and tin can be deposited onto metallic substrates including small metal parts, and the co-deposit is strongly adherent to the substrate and exhibits improved corrosion resistant properties. The co-deposits are plated onto me... | 11/14/1989 |
| 4832802 | Acid zinc-nickel plating baths and methods for electrodepositing bright and ductile zinc-nickel alloys and additive composition therefor An aqueous acidic zinc-nickel plating bath is described. The plating baths generally comprise (A) zinc ions; (B) nickel ions; (C) an amount, sufficient to provide a level and bright zinc-nickel alloy electrodeposit, of at least one polymeric sulfur-containing ... | 05/23/1989 |
| 4792383 | Polymer compositions and alkaline zinc electroplating baths and processes Compositions are described which are useful particularly in improving the electrodeposition of zinc from aqueous alkaline plating baths. In one embodiment, the new composition comprises the reaction product of (A-1) at least one nitrogen-containing heterocycli... | 12/20/1988 |
| 4781801 | Method of copper plating gravure rolls A method of electropolating a layer of copper on gravure rolls is provided with the so-plated layer being especially adapted to receive electronic engraving. The method comprises the steps of placing a gravure roll in an electroplating bath comprising fro... | 11/01/1988 |
| 4730022 | Polymer compositions and alkaline zinc electroplating baths Compositions are described which are useful particularly in improving the electrodeposition of zinc from aqueous alkaline plating baths. In one embodiment, the new composition comprises a polymeric composition prepared by the process which comprises the s... | 03/08/1988 |
| 4717421 | Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids An improved method of producing a tin/palladium catalyst for use in electroless plating baths is disclosed. The method comprises the steps: (a) preparing a mixture of stannous halide, an alkali metal halide and water, (b) reacting said mixture with a palladium... | 01/05/1988 |
| 4673469 | Method of plating plastics A method is provided for electrodepositing a layer of copper on a plastic substrate which method comprises: positioning the plastic substrate on a supporting member, with the supporting member being in contact at a plurality of spaced apart points with th... | 06/16/1987 |
| 4662999 | Plating bath and method for electroplating tin and/or lead An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoride and fluoborate ions and comprise (A) at least one bath-soluble metal salt selected from the group cons... | 05/05/1987 |
| 4582576 | Plating bath and method for electroplating tin and/or lead An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoborate and comprise (a) at least one bath-soluble metal salt selected from the group consisting of a stanno... | 04/15/1986 |
| 4572792 | Stripper composition for a paint having a polysulfide basecoat A composition is provided which is especially adapted for use in stripping a polysulfide basecoat (sealant) from a surface. The composition comprises, as essential ingredients, a chlorinated solvent and an effective amount of at least one activator select... | 02/25/1986 |
| 4559269 | Composite puffed borax particles A composite particle is provided which comprises a matrix of puffed borax having a porous surface, with the matrix having retained on the porous surface thereof a plurality of individual grains of metal oxide. A method of producing such a composite partic... | 12/17/1985 |
| 4515765 | Method for the production of antimony oxide A process is provided for the production of antimony oxide from antimony sulfide which comprises the steps of comminuting the antimony sulfide to form a plurality of antimony sulfide containing particles, mixing the antimony sulfide containing particles w... | 05/07/1985 |
