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| Number | Title | Issue Date |
| 6475353 | Apparatus and method for sputter depositing dielectric films on a substrate Apparatus and method for sputter depositing a layer of material comprises a sputtering chamber having an internal conductive wall which provides an electrical reference for plasma during sputter deposition. A conductive shield positioned in the processing... | 11/05/2002 |
| 6042777 | Manufacturing of high density intermetallic sputter targets There is provided a method for fabricating intermetallic sputter targets of two or more elements in which a mixture of two or more elemental powders are blended and synthesized within a pressing apparatus at a temperature below the melting point of the lo... | 03/28/2000 |
| 6039788 | Melting and casting of high purity chromium with controlled oxygen content The present invention relates to a method of manufacturing high purity chromium suitable for deposition onto a semiconductor wafer or other substrate by sputtering. The process increases productivity, expands melting capability and provides consistent hig... | 03/21/2000 |
| 6030514 | Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor A target for sputtering is subjected to a surface treatment process and special packaging after target manufacture for improved sputtering performance and process and yield by reducing particulates. The sputtering target is first surface treated to remove... | 02/29/2000 |
| 6010583 | Method of making unreacted metal/aluminum sputter target A high performance, high density sputtering target and a method of making. An aluminum and non-aluminum reactive metal powder blend is subjected to cold pressing under pressure, machining, evacuating, and hot pressing under pressure. The aluminum and non-... | 01/04/2000 |
| 5993734 | Method for making W/Ti sputtering targets and products in an inert atmosphere The invention relates to the manufacture of sputtering targets of tungsten-titanium alloy using high purity tungsten and titanium hydride powders. The powders are blended and placed in a containment vessel holding a die. The die is heated to a temperature... | 11/30/1999 |
| 5993575 | Method for fabricating randomly oriented aluminum alloy sputting targets with fine grains and fine precipitates A method is provided for fabricating aluminum alloy sputtering targets having fine precipitates of a second phase material in small, randomly oriented and uniform grains. The method provided includes the steps of homogenizing the aluminum alloy billet at ... | 11/30/1999 |
| 5989673 | Caromium-tantalum oxides (Cr-TaOx), sputtering targets and thin film seedlayer/sublayers for thin film magnetic recording media Chromium-tantalum oxides (Cr-TaOx), including chromium-tantalum pentoxide (Cr-Ta2 O5), chromium-tantalum tetrioxide (Cr-Ta2 O4 or Cr-TaO2), sputtering targets containing them, and their man... | 11/23/1999 |
| 5896553 | Single phase tungsten-titanium sputter targets and method of producing same A single phase W-Ti sputter target and a method of manufacturing the target are disclosed. The target is produced by mixing powders of tungsten and titanium and subjecting the mixed powders to a pressing operation for a time, temperature and pressure suff... | 04/20/1999 |
| 5858180 | Magnetic field generator, coating method and apparatus including same, and devices having coating aligned therewith Magnetic domains in a thin magnetic film on information storage devices are aligned during manufacture of the device, preferably at the time the film is deposited onto a substrate by sputtering. A compact magnetic field generator generates a parallel magn... | 01/12/1999 |
| 5857611 | Sputter target/backing plate assembly and method of making same A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coeffic... | 01/12/1999 |
| 5846389 | Sputtering target protection device A sputtering target protection device for covering and protecting the precisely machined and engineered surface of a sputtering target assembly during shipment, intermediate handling and installation of the target assembly. The protection device includes ... | 12/08/1998 |
| 5836506 | Sputter target/backing plate assembly and method of making same This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of ... | 11/17/1998 |
| 5804041 | Method and apparatus for forming a magnetically oriented thin film A method for forming a magnetically oriented thin film on a substrate is disclosed wherein deposition pulses are alternated with magnetic field pulses. In particular, the method includes sputtering a target to deposit a first incremental layer of target m... | 09/08/1998 |
| 5795448 | Magnetic device for rotating a substrate A device for rotating a substrate in a complex motion within a chamber which during a sputtering process. The device includes a first support element positioned within the chamber. The first support element includes a first rotating structure which is aff... | 08/18/1998 |
| 5785518 | Masking element fixture A fixture for holding a plurality of masking elements while the masking elements are being baked to remove impurities is disclosed. The masking elements are used to mask dies used for forming sputtering targets used to deposit thin films on a substrate. T... | 07/28/1998 |
| 5783795 | Bonding of sputtering target by variable polarity plasma arc welding A reusable aluminum sputter target support tube which is bonded to a replaceable sputter target by variable polarity plasma arc welding and a method of manufacturing such reusable sputtering target assemblies.... | 07/21/1998 |
| 5698158 | Vacuum distillation apparatus for producing ultra high purity material Ultra high purity materials, particularly metallic materials such magnesium and similarly high volatility materials, are produced by a vacuum distillation method and apparatus to increase purity by approximately five hundred times in a single step. For ex... | 12/16/1997 |
| 5674367 | Sputtering target having a shrink fit mounting ring A target assembly for use in a sputtering system used for forming a thin film on a substrate is disclosed. The target assembly includes a mounting element having an interior wall which defines an aperture. The target assembly further includes a target for... | 10/07/1997 |
| 5669975 | Plasma producing method and apparatus including an inductively-coupled plasma source An apparatus for processing at least a surface of an article with a uniform plasma includes a processing chamber in which the article is disposed and a plasma source. The plasma source includes a dielectric plate having a first surface forming part of an ... | 09/23/1997 |
| 5665640 | Method for producing titanium-containing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor A method and apparatus for depositing a film on a substrate by plasma-enhanced chemical vapor deposition at temperatures substantially lower than conventional thermal CVD temperatures comprises placing a substrate within a reaction chamber and exciting a ... | 09/09/1997 |
| 5641389 | Mechanically joined sputtering target and adapter therefor A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts) to an ada... | 06/24/1997 |
| 5620578 | Sputtering apparatus having an on board service module A system for sputtering a substrate is disclosed. The system includes a central housing having at least one process module for forming the layer, wherein the process module is in fluid communication with the central housing and includes a first device use... | 04/15/1997 |
| 5595241 | Wafer heating chuck with dual zone backplane heating and segmented clamping member A wafer heating chuck includes a backplane for mounting the wafer thereon. A rear surface of the backplane includes an outer annular recess with an outer angled wall. An outer annular heater is located within the recess and has an outer surface complement... | 01/21/1997 |
| 5589039 | In-plane parallel bias magnetic field generator for sputter coating magnetic materials onto substrates Magnetic domains in a thin magnetic film on information storage devices are aligned during manufacture of the device, preferably at the time the film is deposited onto a substrate by sputtering. A compact magnetic field generator generates a parallel magn... | 12/31/1996 |
| 5589041 | Plasma sputter etching system with reduced particle contamination A plasma processing system for sputter etching a substrate with reduced particle contamination comprises a plasma processing chamber having an interior surface which defines a processing space containing a substrate. An electrical element couples electric... | 12/31/1996 |
| 5584972 | Plasma noise and arcing suppressor apparatus and method for sputter deposition A plasma noise and arcing suppressor apparatus and method includes a suppressor circuit electrically coupled between a DC power supply and a sputter target inside of a deposition chamber. The suppressor circuit includes an inductive element electrically c... | 12/17/1996 |
| 5582630 | Ultra high purity magnesium vacuum distillation purification method Ultra high purity materials, particularly metallic materials such as magnesium and similarly high volatility materials, are produced by a vacuum distillation method and apparatus to increase purity by approximately five hundred times in a single step. For... | 12/10/1996 |
| 5575856 | Thermal cycle resistant seal and method of sealing for use with semiconductor wafer processing apparatus A semi conductor wafer processing apparatus has a wafer supporting susceptor having a sealing surface, a susceptor drive shaft for connection to the susceptor also having a sealing surface, a seal disposed between the susceptor and drive shaft sealing sur... | 11/19/1996 |
| 5573597 | Plasma processing system with reduced particle contamination The plasma processing system comprises a processing chamber with a processing space therein to contain a substrate. An electrical element is operable to couple electrical energy into the processing space to generate a plasma and is further operable to int... | 11/12/1996 |
| 5569361 | Method and apparatus for cooling a sputtering target Method and apparatus for cooling a sputtering target is provided. The method comprises the steps of providing a sputtering target and a cooling surface in operable conductive heat transfer contact with the sputtering target, introducing a cooling liquid o... | 10/29/1996 |
| 5569363 | Inductively coupled plasma sputter chamber with conductive material sputtering capabilities A shade is disposed on the inner wall of an inductively coupled plasma chamber, covering a protected zone of the wall generally opposite to the inductive coil driving the chamber, preventing accumulation of material sputtered from a wafer in this zone, an... | 10/29/1996 |
| 5567243 | Apparatus for producing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor A method and apparatus for depositing a film on a substrate by plasma-enhanced chemical vapor deposition at temperatures substantially lower than conventional thermal CVD temperatures comprises placing a substrate within a reaction chamber and exciting a ... | 10/22/1996 |
| 5562947 | Method and apparatus for isolating a susceptor heating element from a chemical vapor deposition environment An apparatus for efficiently heating a wafer within a CVD environment isolates the heating element of the apparatus from the CVD environment and includes a susceptor body defining a sealed space therein for containing the heating element and a surface cou... | 10/08/1996 |
| 5556521 | Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source Apparatus for sputter etching a substrate includes a processing chamber with a plasma source coupled to the top of the processing chamber to seal the chamber and create a plasma therein. The plasma source comprises a dielectric plate having a generally ce... | 09/17/1996 |
| 5553572 | Multi-valve engine An improved air spring arrangement for an internal combustion engine having three valves per cylinder which are disposed in surrounding relationship to a spark plug. The air spring arrangement is formed by a recess formed in the cylinder head that encompa... | 09/10/1996 |
| 5529673 | Mechanically joined sputtering target and adapter therefor A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts) to an ada... | 06/25/1996 |
| 5520784 | Ultrasonic enhancement of aluminum step coverage and apparatus A method and apparatus for sputter depositing aluminum onto a semiconductor substrate to fill micron and submicron vias utilizes ultrasonic energy to ensure adequate filling of the vias. The semiconductor is supported on a block and heated and subjected t... | 05/28/1996 |
| 5516732 | Wafer processing machine vacuum front end method and apparatus A carrousel type wafer processing machine in which wafers are held in vertical orientations in holders on a rotatable plate and sequenced through a plurality of processing stations for processing, such as by the application of a sputtered film thereto, is... | 05/14/1996 |
| 5505544 | Chamber temperature uniformity test fixture A fixture for measuring the temperature of a chamber at a number of locations includes a body sized for placement within the chamber, and a number of temperature probes mounted on the body in orientations such that, when the body is placed within the cham... | 04/09/1996 |
