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| Number | Title | Issue Date |
| 8182649 | Fixed jig, chip pickup method and chip pickup apparatus It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed ... | 05/22/2012 |
| 8178198 | Adhesive sheet An adhesive sheet includes a substrate and an energy-ray curable adhesive layer formed on the substrate. The energy-ray curable adhesive layer includes an energy-ray curable acrylic copolymer and a urethane acrylate. The energy-ray curable acrylic copolymer is forme... | 05/15/2012 |
| 8174130 | Laser dicing sheet and manufacturing method for chip body Disclosed herein is a laser dicing sheet comprising a base material comprising a polyurethane acrylate film and a shape-restoring film; and an adhesive layer formed on a surface of said polyurethane acrylate film of the base material. ... | 05/08/2012 |
| 8171977 | Sheet peeling apparatus and peeling method A sheet peeling apparatus 10 comprises: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a feeding means 12 for feeding out a peeling tape T; a sticking means 14 for sticking the peeling tape T ... | 05/08/2012 |
| 8168851 | Adhesive skin patch sheet An adhesive skin patch sheet comprises a support, a pressure-sensitive adhesive layer and a release sheet laminated in that order, the release sheet is divided by a cut line into a small first release sheet and a large second release sheet, the cut line is formed so... | 05/01/2012 |
| 8148442 | Pressure sensitive adhesive for polarizing plates, polarizing plate with pressure sensitive adhesive and production process for polarizing plate The disclosed a pressure sensitive adhesive for polarizing plates which has a storage elastic modulus (G′) at 23° C. of at least 0.3 MPa; a polarizing plate having a pressure sensitive adhesive; a process for producing the above polarizing plate which comprises s... | 04/03/2012 |
| 8142595 | Mounting apparatus and mounting method To provide a mounting apparatus for uniting a semiconductor wafer with a ring frame, the wafer having an adhesive sheet stuck on one surface thereof. In the mounting apparatus, a portion of the adhesive sheet is preliminarily peeled off through a preliminary peeling... | 03/27/2012 |
| 8129010 | Adhesive sheet An adhesive sheet applicable to a delivery slip and the like includes a first sheet having a first sheet base of which both surfaces are formed as printable surfaces; and a second sheet having a second sheet base of which one surface is formed as a printable surface... | 03/06/2012 |
| 8114520 | Laser dicing sheet and process for producing chip body An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the pres... | 02/14/2012 |
| 8113914 | Treating method for brittle member An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wa... | 02/14/2012 |
| 8110271 | Adhesive sheet and release sheet There is provided an adhesive sheet comprising an adhesive base sheet, an adhesive layer, and a release sheet laminated in sequence from the adhesive base sheet. The release sheet comprises a release agent layer and a release base material laminated in sequence from... | 02/07/2012 |
| 8106522 | Adhesive sheet for a stealth dicing and a production method of a semiconductor wafer device An adhesive sheet is provided enabling to efficiently produce the very small size semiconductor chip by a stealth dicing method. An adhesive sheet for a stealth dicing includes a substrate and an adhesive layer formed on one side of the substrate, wherein a Young's ... | 01/31/2012 |
| 8101884 | Method for production of a pressure-sensitive adhesive sheet A pressure sensitive adhesive sheet 1 includes a base material 11 and a pressure sensitive adhesive layer 12. A plurality of through holes 2 pass through one face of the pressure sensitive adhesive sheet 1 to the other face. The ho... | 01/24/2012 |
| 8080604 | Adhesive containing ladder-type polysilsesquioxane and adhesive sheet An adhesive containing a ladder-type polysilsesquioxane which firmly bonds metals and synthetic resins and an adhesive sheet having an adhesive layer formed by using the adhesive on at least one side of a substrate are provided. An adhesive comprises a ladder-type p... | 12/20/2011 |
| 8071126 | Percutaneous absorption type patch A percutaneous absorption type patch adapted to be applied to a skin surface of a patient. The percutaneous absorption type patch comprises: a stratum-corneum release member constituted from a sheet-like first supporting substrate and a pressure-sensitive adhesive l... | 12/06/2011 |
| 8038824 | Sheet peeling apparatus and peeling method A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pul... | 10/18/2011 |
| 8034667 | Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same A semiconductor sealing resin sheet is composed of a supporting sheet and a sealing resin layer releasably laminated on the supporting sheet, wherein the sealing resin layer has a thermosetting property, the elastic modulus of the sealing resin layer before thermose... | 10/11/2011 |
| 8034417 | Process film for use in producing ceramic green sheet and method for production thereof There can be provided a casting film for producing a ceramic green sheet which film comprises a substrate film, an undercoat layer and a cured layer, wherein the undercoat layer is composed of a condensation polymer from a metal alkoxide and/or a partially hydrolyze... | 10/11/2011 |
| 8026332 | Sealing material for optical element and sealed optical element A sealing material for optical elements with excellent transparency, crack resistance, and heat resistance which can produce a cured product of the sealing material and a sealed optical element are provided. The sealing material for optical elements comprising a com... | 09/27/2011 |
| 8020600 | Sheet sticking apparatus A sheet sticking apparatus includes a first feeding device for feeding out a first sheet having an adhesive layer on one surface thereof, a second feeding device for feeding out a second sheet, and a folding device for folding the second sheet. The sheet sticking ap... | 09/20/2011 |
| 8017232 | Pressure-sensitive adhesive composition for plasma display and adhesive sheet prepared by forming the same Provided is a pressure-sensitive adhesive composition for a plasma display in which a moire phenomenon can be prevented without disposing an anti-glare film and the like in order to decrease a thickness of an optical filter in a plasma display, improve a productivit... | 09/13/2011 |
| 8003441 | Manufacturing method of semiconductor device A manufacturing method of a semiconductor device according to the present invention comprises: laminating a surface protective sheet to a circuit surface side of a wafer formed with grooves which divide each circuit wherein an adhe... | 08/23/2011 |
| 7989563 | Resin compositions, films using the same and process for producing the films The present invention provides a resin composition containing a reactive monomer and/or oligomer having allyl ester groups, a film of the resin composition which is excellent in transparency and heat resistance and has a high thickness precision, and a process for p... | 08/02/2011 |
| 7976921 | Release agent composition and release liner A release agent composition includes a poly(meth)acrylate (A) containing a structural unit (1) represented by the following formula (1); in which R1 represents hydrogen or a methyl group ... | 07/12/2011 |
| 7972990 | Process for recording into rewritable recording medium of non-contact type In a process for recording into a rewritable recording medium of a non-contact type, when adjacent lines or adjacent overlapping lines are drawn by scanning the medium having a reversible heat sensitive color developing layer on a substrate with laser light and a se... | 07/05/2011 |
| 7968039 | Method of producing pressure-sensitive adhesive sheet To produce a pressure-sensitive adhesive sheet according to which air entrapment and blistering can be prevented or eliminated through through-holes, and yet the through-holes are not readily visible at a substrate surface, a pressure-sensitive adhesive surface of a... | 06/28/2011 |
| 7967048 | Transferring device and transferring method A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit pro... | 06/28/2011 |
| 7963710 | Label printer The printer includes a printing unit 12 that performs printing on each of a label L1 and a second raw sheet M2 on the way of feeding out a first raw sheet M1, which is temporarily stuck with labels L1 on a release liner S, and a se... | 06/21/2011 |
| 7955703 | Silicone rubber based pressure sensitive adhesive sheet There are disclosed a silicone rubber based pressure sensitive adhesive sheet comprising a transparent substrate film and a silicone rubber layer which is formed by coating the surface of the transparent substrate film with silicone rubber in an amount of 5 to 100 g... | 06/07/2011 |
| 7954534 | Tape sticking apparatus and sticking method A tape sticking apparatus includes a feed-out device for feeding out a raw sheet in which a strip-shaped tape base material is temporarily stuck on one surface of a strip-shaped release liner. A cutting device is configured to form a closed-loop-shaped cut-line on t... | 06/07/2011 |
| 7954533 | Sheet cutting table A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner t... | 06/07/2011 |
| 7952527 | IC tag According to the present invention, there is disclosed an antenna circuit characterized by comprising: a substrate, a surface circuit consisting of a planar coil circuit portion and at least one pair of opposed ele... | 05/31/2011 |
| 7947361 | Release film and process for producing the film A film having an antistatic releasing agent layer comprising fiber-shaped carbon and disposed on at least one of the faces of a substrate film, a release film having a releasing agent layer disposed on one face of a substrate and an antistatic layer which comprises ... | 05/24/2011 |
| 7503995 | Peeling apparatus and peeling method A peeling apparatus 10 includes a peeling table 11 for supporting an object D to be peeled off and a peeling unit 12 disposed opposite to the peeling table 11. The peeling unit 12 pays out a peeling tape PT, attaches the peeling ta... | 03/17/2009 |
| 7384676 | Coating composition, hard coat film, and optical disk One side of a substrate film 11 is coated with a coating composition containing (A) a reactive particle produced by chemically bonding an organic compound having at least one polymerizable unsaturated group in its molecule to an inorganic oxide particle, (B) ... | 06/10/2008 |
| 7374630 | Film-supplying device and film-affixing system A film-supplying device is provided for supplying a ring-shape adhesive-film to a film-affixing device having an alignment shaft-member, where the ring-shape adhesive-film is attached on a release sheet. The device comprises a table and a sheet transport mechanism. ... | 05/20/2008 |
| 7232501 | Laminate sheet, laminate sheet roll, and producing methods therefor An adhesive sheet 301A having a predetermined form is laminated onto a long release sheet 2A, and a protective member 5A which is thicker than the adhesive sheet 301A is provided in a position so as not to overlap the adhesive sheet 30... | 06/19/2007 |
| 7005174 | Optical recording medium-producing sheet and optical recording medium An optical disc-producing sheet 1, which has an adhesive layer 11 having a specific heat capacity after curing of not more than 1.9 J/g·° C. at 80° C. and a protective sheet 12, is laminated onto an information recording layer 3 (a lam... | 02/28/2006 |
| 6977024 | Method for manufacturing semiconductor device using adhesive sheet with embedded conductor bodies A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a... | 12/20/2005 |
| 6911720 | Semiconductor device adhesive sheet with conductor bodies buried therein A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a... | 06/28/2005 |
