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Wearable Device For Feeding and Observing Birds and Other Flying Animals
A device for feeding and observing flying animals comprising a hat, a support mounted on the hat and extending outward from the hat, and a feeder mounted on the support.
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| Number | Title | Issue Date |
| 7457034 | High NA system for multiple mode imaging A system for multiple mode imaging is disclosed. The catadioptric system has an NA greater than 0.65, and preferably greater than 0.9, highly corrected for low and high order monochromatic aberrations. The system employs unique illumination entrances and optics to c... | 11/25/2008 |
| 7456964 | Detector configurations for optical metrology An apparatus is disclosed for obtaining ellipsometric measurements from a sample. A probe beam is focused onto the sample to create a spread of angles of incidence. The beam is passed through a quarter waveplate retarder and a polarizer. The reflected beam is measur... | 11/25/2008 |
| 7453571 | Dimensional calibration standards A calibration standard, for calibrating lateral or angular dimensional measurement systems, is provided. The standard may include a first substrate spaced from a second substrate. The standard may be cross-sectioned in a direction substantially perpendicular or subs... | 11/18/2008 |
| 7453562 | Ellipsometry measurement and analysis A method of performing a measurement of properties of a sample, by directing a first beam of light at the sample, where a combination of the wavelength, energy, and length of time is sufficient to cause temporary damage to the sample. The first beam is reflected fro... | 11/18/2008 |
| 7446416 | Barrier material formation in integrated circuit structures A method of forming an electrically conductive via. A first electrically conductive layer is formed, and a second layer is formed on the first layer. The second layer has desired barrier layer properties. A third non electrically conductive layer is formed on the se... | 11/04/2008 |
| 7440607 | Outlier substrate inspection A method of detecting anomalies in a test image. Test features of pixels within the test image are selected, and reference features of pixels within at least one reference image are also selected. A signal distribution of test features and reference features in a mu... | 10/21/2008 |
| 7440640 | Image data storage A system having a sensor array adapted to provide image data. A process node is connected to the sensor array, and analyzes portions of the image data. A job manager is connected to the process node, and instructs the process node to send the portions of the image d... | 10/21/2008 |
| 7436506 | Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first po... | 10/14/2008 |
| 7433047 | Runout characterization Runout characterization is performed on a moving body by positioning a light source and optical sensor at a nominal distance from the moving body, with a beam directed from the light source against a surface of the moving body. The reflected light is detected at a s... | 10/07/2008 |
| 7423805 | Ultra-broadband UV microscope imaging system with wide range zoom capability An ultra-broadband ultraviolet (UV) catadioptric imaging microscope system with wide-range zoom capability. The microscope system, which comprises a catadioptric lens group and a zooming tube lens group, has high optical resolution in the deep UV wavelengths, contin... | 09/09/2008 |
| 7399950 | Confocal wafer inspection method and apparatus using fly lens arrangement A semiconductor wafer inspection system and method is provided which uses a multiple element arrangement, such as an offset fly lens array. The preferred embodiment uses a laser to transmit light energy toward a beam expander, which expands the light energy to creat... | 07/15/2008 |
| 7394534 | Process excursion detection A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis t... | 07/01/2008 |
| 7381975 | In plane drift compensation A microscope that produces magnified images of a sample. An observing component generates image data from the sample, and a moving component generates relative movement between the sample and the observing component. A sensor independently generates position data di... | 06/03/2008 |
| 7382940 | Fast bus image coprocessing An inspection system having a sensor array that provides image data. A process node includes a memory to receive the image data, a commercially available central processing unit to receive and coprocess at least a first portion of the image data within the memory, a... | 06/03/2008 |
| 7379847 | High bandwidth image transfer The above and other needs are met by an inspection system having a sensor array that is connected to a high speed network connection, and is adapted to provide image data in regard to images of a substrate. A process node is also connected to the high speed network ... | 05/27/2008 |
| 7379838 | Programmable image computer An inspection system for detecting anomalies on a substrate. A first network is coupled to a sensor array and communicates data. Process nodes are coupled to the first network, and process the data to produce reports. Each process node has an interface card that for... | 05/27/2008 |
| 7379173 | High throughput brightfield/darkfield wafer inspection system using advanced optical techniques The broadband brightfield/darkfield wafer inspection system provided receives broadband brightfield illumination information via a defect detector, which signals for initiation of darkfield illumination. The defect detector forms a two dimensional histogram of the d... | 05/27/2008 |
| 7375828 | Modal method modeling of binary gratings with improved eigenvalue computation A method of determining actual properties of layered media. An incident beam of light is directed towards the layered media, such that the incident beam of light is reflected from the layered media as a reflected beam of light. The actual properties of the reflected... | 05/20/2008 |
| 7375810 | Overlay error detection An overlay target with gratings thereon is illuminated and radiation scattered by the target is imaged onto detectors. A phase difference is then detected between the outputs of the detectors to find the mis-alignment error. In another aspect, an overlay target with... | 05/20/2008 |
| 7369235 | Method and system for measuring deep trenches in silicon A spectroscopic ellipsometry system directs a near infra-red (NIR) probe beam at a test sample to allow metrology to be performed on vertical structures within the test sample. Because silicon is relatively transparent to NIR light, structural information can be det... | 05/06/2008 |
| 7362441 | Modulated reflectance measurement system using UV probe A modulated reflectance measurement system includes lasers for generating an intensity modulated pump beam and a UV probe beam. The pump and probe beams are focused on a measurement site within a sample. The pump beam periodically excites the measurement site and th... | 04/22/2008 |
| 7355708 | Normal incidence rotating compensator ellipsometer A normal incidence rotating compensator ellipsometer includes an illumination source that produces a broadband probe beam. The probe beam is redirected by a beam splitter to be normally incident on a sample under test. Before reaching the sample, the probe beam is p... | 04/08/2008 |
| 7352457 | Multiple beam inspection apparatus and method Disclosed is an optical inspection system for inspecting the surface of a substrate. The optical inspection system includes a light source for emitting an incident light beam along an optical axis and a first set of optical elements arranged for separating the incid... | 04/01/2008 |
| 7352451 | System method and structure for determining focus accuracy Within a lithography process having a critical dimension, a method, system and structure for determining a focus deviation value relative to an ideal focus position said is disclosed. By projecting a series of lines or spots characterized by the constant pitch size ... | 04/01/2008 |
| 7342672 | Detection system for nanometer scale topographic measurements of reflective surfaces A linear position array detector system is provided which imparts light energy to a surface of a specimen, such as a semiconductor wafer, receives light energy from the specimen surface and monitors deviation of the retro or reflected beam from that expected to map ... | 03/11/2008 |
| 7330260 | Method for measuring ion-implanted semiconductors with improved repeatability The repeatability of wafer uniformity measurements can be increased by taking spatially averaged measurements of wafer response. By increasing the time over which measurements are obtained, the amount of noise can be significantly reduced, thereby improving the repe... | 02/12/2008 |
| 7324198 | Edge bead removal inspection by reflectometry A method and apparatus for enhancing image contrast between resist-covered and bare silicon regions of a wafer, applicable to Edge Bead Removal inspection. The wafer is illuminated separately by s-polarized light and p-polarized light impinging at near the Brewster ... | 01/29/2008 |
| 7315365 | System and methods for classifying anomalies of sample surfaces Two or more defect maps may be provided for the same sample surface at different detection sensitivities and/or processing thresholds. The defect maps may then be compared for better characterization of the anomalies as scratches, area anomalies or point anomalies. ... | 01/01/2008 |
| 7259844 | High throughput darkfield/brightfield wafer inspection system using advanced optical techniques The broadband brightfield/darkfield wafer inspection system provided receives broadband brightfield illumination information via a defect detector, which signals for initiation of darkfield illumination. The defect detector forms a two dimensional histogram of the d... | 08/21/2007 |
| 7230443 | Non-contact mobile charge measurement with leakage band-bending and dipole correction Corona charges are used to bias a wafer to push down mobile charges and then pull them up during temperature cycles. Mobile charge is measured from the drops in the corona voltage due to the mobile charges. Corrections are made in the measurements for dipole potenti... | 06/12/2007 |
| 7209227 | Backside contamination inspection device A system for simultaneously inspecting the frontsides and backsides of semiconductor wafers for defects is disclosed. The system rotates the semiconductor wafer while the frontside and backside surfaces are generally simultaneously optically scanned for defects. Rot... | 04/24/2007 |
| 6614520 | Method for inspecting a reticle Disclosed is a method of inspecting a reticle for defects that occur over time. The invention accomplishes this by generating and storing a "baseline" image of the reticle and then periodically generating a "current" image of the reticle and comparing the... | 09/02/2003 |
| 6606153 | Process and assembly for non-destructive surface inspections A light beam is directed towards a surface along a direction normal to the surface. The surface is caused to move so that the beam scans the surface along a spiral path. An ellipsoidal mirror is placed with its axis along the surface normal to collect lig... | 08/12/2003 |
| 6570650 | Apparatus and methods for reducing thin film color variation in optical inspection of semiconductor devices and other surfaces Disclosed are methods and apparatus for designing an optical spectrum of an illumination light beam within an optical inspection system. A set of conditions for inspecting a film on a sample by directing an illumination light beam at the sample is determi... | 05/27/2003 |
| 6411390 | Interferometric system for measurement disturbance of a sample A pump beam is modulated at a first frequency and a modulated pump beam is used to periodically heat the surface of a semiconductor wafer at a location, thereby generating a disturbance at such location. Two probe beams are provided which are coherent wit... | 06/25/2002 |
| 6384408 | Calibration of a scanning electron microscope A scanning electron microscope (SEM) is calibrated for the effects of local charging on a measured critical dimension (CD) of a wafer by first calibrating the microscope with respect to a calibration wafer with a known CD. Local charging on a wafer may be... | 05/07/2002 |
| 6271916 | Process and assembly for non-destructive surface inspections A light beam is directed towards a surface along a direction normal to the surface. The surface is caused to move so that the beam scans the surface along a spiral path. An ellipsoidal mirror is placed with its axis along the surface normal to collect lig... | 08/07/2001 |
| 6267005 | Dual stage instrument for scanning a specimen A dual stage scanning instrument includes a sensor for sensing a parameter of a sample and coarse and fine stages for causing relative motion between the sensor and the sample. The coarse stage has a resolution of about 1 micrometer and the fine stage has... | 07/31/2001 |
| 6268916 | System for non-destructive measurement of samples The surface of a doped semiconductor wafer is heated locally by means of a pump beam whose intensity is modulated at a first frequency. The heated area is sampled by a probe beam whose intensity is modulated at a second frequency. After the probe beam has... | 07/31/2001 |
| 6211518 | Electron beam dose control for scanning electron microscopy and critical dimension measurement instruments A system and method for controlling electron exposure on image specimens by adjusting a raster scan area in-between scan frame cycles. A small, zoomed-in, scan area and the surrounding area are flooded with positive charge for a number of frame cycles bet... | 04/03/2001 |
