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| Number | Title | Issue Date |
| 8085059 | RF chip test method An RF chip test method is disclosed. The RF chip test method includes disposing an RF chip within a chip socket, with the RF chip having at least one RF pin and at least one non-RF pin, the chip socket having conductive elements, and the conductive elements contacti... | 12/27/2011 |
| 8066113 | Segregating apparatus An apparatus for segregating electronic components that engages and stops each of a plurality of electronic packages passing down a singulation tube is disclosed. In addition, the segregating apparatus is cable of segregating the electronic packages even though some... | 11/29/2011 |
| 8030944 | Method for continuity test of integrated circuit The present invention provides a method for continuity test of integrated circuit. By using both pins of integrated circuit to measure a current of an electrostatic discharge device, the contact resistance of the integrated circuit can be obtained by calculating. Th... | 10/04/2011 |
| 8010468 | Method for wafer analysis with artificial neural network and system thereof A method for wafer analysis with artificial neural network and the system thereof are disclosed. The method of the system of the present invention has several steps, including: first of all, providing a test unit for wafer test and generating a plurality of test dat... | 08/30/2011 |
| 8008938 | Testing system module A testing system module for testing printed circuit board (PCB) includes at least one robot having a pogo pin for moving to a testing point of the PCB; a pressure detecting unit for detecting a current pressure value on the printed circuit board; and a control syste... | 08/30/2011 |
| 7938611 | Feeding apparatus of test equipment In the present invention, a feeding apparatus comprising a plurality of feeding mechanisms is provided. The feeding apparatus comprises a power source, a base, a rotating axle, a plurality of feeding mechanisms, a plurality of connecting units and a plurality of fix... | 05/10/2011 |
| 7821277 | Parallel test fixture for mixed signal integrated circuits The present invention provides a parallel test fixture for mixed signal integrated circuits (ICs). The fixture includes a multi-layer printed circuit board (PCB). The fixture includes: a test area, which is disposed on a central area of the multi-layer PCB and inclu... | 10/26/2010 |
| 7786744 | Probe card assembly and test probes therein Discloses are a probe card assembly and test probes used therein. The probe card assembly includes a main body, a probe base disposed in a central portion of the main body and a plurality of test probes connected between the probe base and the main body. Each of the... | 08/31/2010 |
| 7737711 | Test apparatus having pogo probes for chip scale package A pogo-type probe to be installed in a probe socket and a probe card for testing chip scale package of a semiconductor device is characterized in that the pogo probe has a hollow main body for receiving at least one resilient element internally and the main body com... | 06/15/2010 |
| 7701233 | Heat-resistant lens kit A heat-resistant lens kit configured within the pogo tower of the wafer tester is disclosed. The heat-resistant lens kit has two parallel lenses and a main body with a through hole. The main body and two parallel lenses enclose a vacuum room within the through hole.... | 04/20/2010 |
| 7688087 | Test apparatus An under testing device interface with mixed-signal processing circuit is disclosed. The under testing device interface with mixed signal processing circuit software of integrates the mixed-signal processing circuit into the probe card or device under testing card, ... | 03/30/2010 |
| 7639028 | Probe card assembly with ZIF connectors This invention discloses a probe card assembly with adjustable ZIF connectors. The probe card assembly comprises a substrate, a plurality of ZIF connectors and a plurality of adjustable fastening means for assembling and disassembling the ZIF connectors on the subst... | 12/29/2009 |
| 7591495 | Pick-up head device with a pushing mechanism A pick-and-place head device with a pushing mechanism for handling electronic components is disclosed in this invention. The pick-and-place head device includes a fixing base connected to a robot arm and a cylinder member disposed on the fixing base, the cylinder me... | 09/22/2009 |
| 7501809 | Electronic component handling and testing apparatus and method for electronic component handling and testing The present invention discloses an electronic testing apparatus and a continuous test method for electronic component, which includes multiple test areas, each area possesses respective pick and place module. The apparatus includes multiple shuttles located between ... | 03/10/2009 |
| 7454885 | Tray to tube manual exchanger A tray to tube manual exchanger is disclosed herein. The manual exchanger includes a tray-fastening module and a bi-axle-rotating module. The tray-fastening module includes a tray-fastening member, a buffer-rail substrate, and a tube-inserting member. The buffer-rai... | 11/25/2008 |
| 7369957 | Method and system for generating test pulses to test electronic elements A method and system for generating test pulses to test electronic elements are disclosed. After determining a transmission clock, which is smaller than a test clock, and a serial of predetermined pulses, the serial of data bits corresponding to the serial of predete... | 05/06/2008 |
| 7303125 | Apparatus and method of automatically counting a carrier tape The present invention is directed to apparatus and method of automatically counting the loaded electronic components in a carrier tape. A pair of detectors is arranged respectively above and below the carrier tape, and a counting wheel having teeth on the periphery ... | 12/04/2007 |
