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| Number | Title | Issue Date |
| 8152043 | Ultrasonic horn An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft rela... | 04/10/2012 |
| 8143155 | Wire bonding method and semiconductor device After forming a pressure-bonded ball and a ball neck by bonding an initial ball to a pad, a capillary is moved upward, away from a lead, and then downward, thereby the ball neck is trodden on by a face portion that is on the lead side of the capillary. Subsequently,... | 03/27/2012 |
| 8052026 | Ultrasonic horn An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft rela... | 11/08/2011 |
| 7934634 | Wire bonding method A wire bonding method with the process of performing a first bonding to a pad of a die that is a first bond point, and the process of performing a second bonding to an interconnect wiring (or a lead) that is a second bond point, thus connecting the pad and the inter... | 05/03/2011 |
| 7929152 | Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion A detecting apparatus used in a bonding apparatus including a capillary and a detection camera disposed with a certain amount of offset from the capillary and capable of detecting a press-bonded ball at a bonding portion after bonding. For a pad in which two edges o... | 04/19/2011 |
| 7910472 | Method of manufacturing semiconductor device A semiconductor device with improved bondability between a wire and a bump and cutting property of the wire to improve the bonding quality. In the semiconductor device, a wire is stacked on a pad as a second bonding point to form a bump having a sloped wedge and a f... | 03/22/2011 |
| 7893383 | Bonding apparatus and method for cleaning tip of a bonding tool A wire bonding apparatus for manufacturing, for instance, semiconductor devices, including a cleaning case in which a microplasma generating section comprised of a plasma torch, which has a plasma nozzle 38 at the end, and capacitive coupling electrodes compo... | 02/22/2011 |
| 7848022 | Imaging device and method for a bonding apparatus An imaging device and method of a bonding apparatus in which the imaging device includes: a high-magnification optical system having first and second high-magnification optical paths that extend to multiple imaging planes through a high-magnification lens and have d... | 12/07/2010 |
| 7857190 | Wire bonding apparatus, record medium storing bonding control program, and bonding method A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and w... | 12/28/2010 |
| 7851347 | Wire bonding method and semiconductor device Wire bonding method for reducing height of a wire loop in a semiconductor device, including a first bonding step of bonding an initial ball formed at a tip end of a wire onto a first bonding point using a capillary, thereby forming a pressure-bonded ball; a wire pus... | 12/14/2010 |
| 7842897 | Bonding apparatus A wire bonding apparatus including a joining machine unit for joining a wire to a subject device, a measurement unit for measuring the connection state between the subject device and the wire, and a control unit for controlling the operation of the entire apparatus.... | 11/30/2010 |
| 7808116 | Semiconductor device and wire bonding method A semiconductor device with improved bondability between a wire and a bump and cutting property of the wire to improve the bonding quality. In the semiconductor device, a wire is stacked on a pad as a second bonding point to form a bump having a sloped wedge and a f... | 10/05/2010 |
| 7780056 | Horn attachment arm A horn attachment arm for a bonding apparatus that performs high speed bonding with high accuracy to a large sized workpiece is provided. The horn attachment arm includes a fixing bracket fixed to a moveable member of a driving motor and a ultrasonic horn attaching ... | 08/24/2010 |
| RE41506 | Offset measuring mechanism and offset measuring method in a bonding apparatus An offset measuring mechanism and method used in a bonding apparatus, in which the object plane of a position detection camera is set on a hypothetical bonding working plane, and the image of imaging elements within the imaging plane is projected onto a bonding work... | 08/17/2010 |
| 7735707 | Wire bonding apparatus A wire bonding apparatus including a bonding arm provided at a tip end thereof with an ultrasonic horn that has a capillary at its tip end, wherein the bonding arm is provided therein with a pressure sensor that detects the pressing load applied by the capillary on ... | 06/15/2010 |
| 7699209 | Wire bonding apparatus, record medium storing bonding control program, and bonding method A bonding method involving detection of non-bonding of a bonding wire to a first bonding point, the method including an electrical non-bonding detection step and an optical non-bonding detection step, wherein data on whether the respective first bonding points are p... | 04/20/2010 |
| 7686204 | Wire bonding apparatus, record medium storing bonding control program, and bonding method A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and w... | 03/30/2010 |
| 7661576 | Wire bonding method A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises ... | 02/16/2010 |
| 7658314 | Tail wire cutting method and bonding apparatus A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circul... | 02/09/2010 |
| 7658313 | Ball forming device in a bonding apparatus and ball forming method A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off prove for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for... | 02/09/2010 |
| 7644852 | Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off probe for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for... | 01/12/2010 |
| 7621436 | Wire bonding method A wire bonding method including the steps of: descending a capillary 5 from above an external lead 1 to press a wire 10 to such an extent that the wire is not completely connected to the external lead 1, thus forming a thin part 16... | 11/24/2009 |
| 7617966 | Semiconductor device A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises ... | 11/17/2009 |
| 7578421 | Horn-holder pivot type bonding apparatus A horn-holder pivot type bonding apparatus including a horn holder for holding an ultrasonic horn, and a motor for driving the horn holder to pivot, with an imaginary pivot point of the horn holder being positionally fixed on a bonding surface. The motor is provided... | 08/25/2009 |
| 7576297 | Bonding apparatus and method A bonding apparatus including a capillary 40 having a high-frequency coil 50 on its tip end portion and allowing a bonding wire 2 to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supp... | 08/18/2009 |
| 7565994 | Wire bonding apparatus In an bonding apparatus, a piezoelectric element 4 being built into the vicinity of the capillary attachment portion of a bonding arm 1 so that the capillary 3 can be caused to vibrate in the axial direction of the bonding arm 1. The prep... | 07/28/2009 |
| 7458498 | Semiconductor device and a wire bonding method A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises ... | 12/02/2008 |
| 7405500 | Bonding apparatus A wire bonding apparatus 10 including an X table 18 guided to move in the X direction on an XY table base 14 and a driving motor 20 mounted on a motor base 16 with the movable element 22 of the driving motor 20 connec... | 07/29/2008 |
| 7389805 | Bonding arm swinging type bonding apparatus A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 | 06/24/2008 |
| 7370785 | Wire bonding method and apparatus A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical ... | 05/13/2008 |
| 7334754 | Guide rails for conveying band-form members Guide rails for guiding a band-form member such as a film carrier tape in a semiconductor manufacturing apparatus. The guide rails include a pair of rail main bodies with a plurality of guide assemblies provided on the upper surfaces of the rail main bodies so that ... | 02/26/2008 |
| 7330582 | Bonding program With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the posit... | 02/12/2008 |
| 7324683 | Bonding pattern discrimination device Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (... | 01/29/2008 |
| 7324684 | Bonding apparatus With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the posit... | 01/29/2008 |
| 7321681 | Bonding pattern discrimination program Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (... | 01/22/2008 |
| 7312541 | Actuator and bonding apparatus In an actuator of a bonding apparatus, a rotating body 16 that has a bonding head is rotatably supported on a supporting carrier having the same shape as magnetic path members 32L and 32R, and coil portions 40 and 42 are disposed o... | 12/25/2007 |
| 7306132 | Bonding apparatus A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion i... | 12/11/2007 |
| 7299966 | Initial ball forming method for wire bonding wire and wire bonding apparatus An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that contains, for instance, tin; and a direct-current high voltage power su... | 11/27/2007 |
| 7293686 | Bonding apparatus A wire bonder including two link driving mechanisms and a head supporting stage provided with a bonding head via fluid pressure so that the bonding head is movable in the horizontal plane. Each link driving mechanism is formed by a motor, a driving arm, and a movabl... | 11/13/2007 |
| 7265461 | Actuator and bonding apparatus In an actuator of a bonding apparatus, a rotating body 16 that has a bonding head is rotatably supported on a supporting carrier having the same shape as magnetic path members 32L and 32R, and coil portions 40 and 42 are disposed o... | 09/04/2007 |
