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Assignee: Kabushi Kaisha Toshiba


Location: Tokyo, JP
No. of patents: 3

NumberTitleIssue Date
7387515Printed circuit board connection
An improved printed circuit board connection for connecting a first printed circuit board to a second printed circuit board in a manner that permits physical engagement at a different position than the electrical engagement, and a method for making the improved prin...
06/17/2008
6914429MR imaging system and data acquisition method
Magnetic resonance imaging uses a pulse sequence formed to include a pre-pulse, an RF excitation pulse, an encoding gradient pulse, and a reading gradient pulse. The encoding gradient pulse has an encoding amount determined to allow a data acquisition position in a ...
07/05/2005
6797551Semiconductor device having contact electrode to semiconductor substrate
An isolation region is embedded in a semiconductor substrate. The height of the upper face of the isolation region is substantially equal to the height of the surface of the semiconductor substrate. A gate electrode is formed on a gate insulating film and over the i...
09/28/2004
 
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