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| Number | Title | Issue Date |
| 7470295 | Polishing slurry, method of producing same, and method of polishing substrate Disclosed herein is a polishing slurry for chemical mechanical polishing. The polishing slurry comprises polishing particles, which have a particle size distribution including separated fine and large polishing particle peaks. The polishing slurry also comprises pol... | 12/30/2008 |
| 7364600 | Slurry for CMP and method of polishing substrate using same Disclosed herein is a polishing slurry and a method of producing the same. The polishing slurry has high selectivity in terms of a polishing speed of an oxide layer to that of a nitride layer used in CMP of an STI process which is essential to produce ultra highly i... | 04/29/2008 |
