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Assignee: Japan Laser Corporation


Location: Tokyo, JP
No. of patents: 5

NumberTitleIssue Date
7927935Method for crystallizing semiconductor with laser beams
Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles betwe...
04/19/2011
7660042Apparatus for crystallizing semiconductor with laser beams
Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles betwe...
02/09/2010
7528023Apparatus for crystallizing semiconductor with laser beams
Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles betwe...
05/05/2009
7410508Apparatus for crystallizing semiconductor with laser beams
Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles betwe...
08/12/2008
7115457Method for crystallizing semiconductor with laser beams
Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles betwe...
10/03/2006
 
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