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Assignee: JH Rhodes Company, Inc.


Location: Tempe, AZ
No. of patents: 2

NumberTitleIssue Date
7252582Optimized grooving structure for a CMP polishing pad
A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad sa...
08/07/2007
7189156Stacked polyurethane polishing pad and method of producing the same
A polishing pad has a sublayer; a top layer attached to the sublayer, the sublayer having a modulus of elasticity between 300 and 5000 psi and a compressibility of less than 30% at 73 psi, wherein the top pad has a modulus of elasticity which is greater than the mod...
03/13/2007
 
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