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"There is practically no chance communications space satellites will be used to provide better telephone, telegraph, television, or radio service inside the United States."
T. Craven, FCC Commissioner ; 1961
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| Number | Title | Issue Date |
| 7566634 | Method for chip singulation The present invention is related to a method for singulating chips from a stack of layers, such as the layers on a wafer or substrate. The stack of layers includes a front end of line (FEOL) layer upon the substrate layer, with the substrate layer having a first sur... | 07/28/2009 |
| 7378297 | Methods of bonding two semiconductor devices A device and a method for bonding elements are described. A first solder ball is produced on a main surface of a first element. A second solder ball is produced on a main surface of a second element. Contact is provided between the first solder ball and the second s... | 05/27/2008 |
| 7368311 | Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated ... | 05/06/2008 |
| 7205177 | Methods of bonding two semiconductor devices A method of bonding two elements such as wafers used in microelectronics applications is disclosed. One inventive aspect relates to a method for bonding comprising producing on a first main surface of a first element a first solder ball, producing on a first main su... | 04/17/2007 |
