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| Number | Title | Issue Date |
| 5376584 | Process of making pad structure for solder ball limiting metallurgy having reduced edge stress A two-step masking process is disclosed for forming a ball limiting metallurgy (BLM) pad structure for a solder joint interconnection used between a support substrate and a semiconductor chip. A solder non-wettable layer and a solder wettable layer are de... | 12/27/1994 |
