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...During the Civil War, the Confederacy established its own Patent Office which issued 266 patents, a third of which concerned implements of war.
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| Number | Title | Issue Date |
| 7374471 | Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cups An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more pivotable load-and-unload cups to transfer the objects to and/or from one or more object carriers to polish the objects. Each pivotable load-and-unload cup may be confi... | 05/20/2008 |
| 7367866 | Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups a... | 05/06/2008 |
| 7364496 | Polishing head for polishing semiconductor wafers A polishing head and method for handling and polishing semiconductor wafers uses a base structure with at least one recess region and an outer flexible membrane that can conform to the at least one recess region to form at least one depression to hold a semiconducto... | 04/29/2008 |
| 7238614 | Methods for fabricating one or more metal damascene structures in a semiconductor wafer Methods for fabricating one or more metal (e.g., copper) damascene structures in a semiconductor wafer use at least three polishing steps to reduce erosion topography in the resulting metal damascene structures and/or increase throughput. The polishing steps may be ... | 07/03/2007 |
| 7223153 | Apparatus and method for polishing semiconductor wafers using one or more polishing surfaces An apparatus and method for polishing objects, such as semiconductor wafers, utilizes one or more polishing surfaces, multiple wafer carriers and at least one load-and-unload cup. The load-and-unload cup may be configured to move to and from the wafer carriers in a ... | 05/29/2007 |
