Assignee: Innovative Micro Technology

Location: Goleta, CA
No. of patents: 39

Number	Title	Issue Date
8088651	System and method for providing access to an encapsulated device A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially ab...	01/03/2012
7972683	Wafer bonding material with embedded conductive particles A material for bonding a first wafer to a second wafer, which includes an insulating adhesive with conductive particles embedded in the adhesive substance. When the adhesive is applied and melted or fused, and pressure is applied between the first wafer and the seco...	07/05/2011
7968986	Lid structure for microdevice and method of manufacture A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared transmitting, hermetic lid for a microdevice. The lid may be manufactured by first forming small, subwavelen...	06/28/2011
7960208	Wafer level hermetic bond using metal alloy with raised feature Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first subst...	06/14/2011
7944113	Hysteretic MEMS thermal device and method of manufacture A MEMS hysteretic thermal actuator may have a plurality of beams disposed over a heating element formed on the surface of the substrate. The plurality of beams may be coupled to a passive beam which is not disposed over the heating element. One of the plurality of b...	05/17/2011
7893798	Dual substrate MEMS plate switch and method of manufacture Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at...	02/22/2011
7872432	MEMS thermal device with slideably engaged tether and method of manufacture A MEMS thermal switch is disclosed which couples a hot, expanding beam to a cool flexor beam using a slideably engaged tether, and bends the cool, flexor beam by the expansion of the hot beam. A rigidly engaged tether ties the distal ends of the hot, expanding beam ...	01/18/2011
7864006	MEMS plate switch and method of manufacture Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a ...	01/04/2011
7812703	MEMS device using NiMn alloy and method of manufacture A material for forming a conductive structure for a MEMS device is described, which is an alloy containing about 0.01% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical properties. In particular, the sheet...	10/12/2010
7807547	Wafer bonding material with embedded rigid particles A material for bonding a lid wafer to a device wafer, which includes an adhesive substance with rigid particles embedded in the adhesive substance. The rigid particles may be particles or spheres of alumina, silica, or diamond, for example. The adhesive substance ma...	10/05/2010
7785913	System and method for forming moveable features on a composite substrate A method for forming moveable features suspended over a substrate is described, wherein a cavity beneath the moveable feature is first formed using a liquid etchant applied through one or more release holes. After formation of the cavity, the outline of the moveable...	08/31/2010
7759218	Indented lid for encapsulated devices and method of manufacture A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid wafer. The gettering material is then deposited over the indentation feat...	07/20/2010
7759152	MEMS thermal actuator and method of manufacture A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive be...	07/20/2010
7724121	Singly attached MEMS thermal device and method of manufacture An improved MEMS thermal actuator has a cantilevered beam and a conductive circuit having two driving arms, an inner arm adjacent to the cantilevered beam, and an outer arm adjacent to the inner arm. Current flows through the inner and outer arms to heat the conduct...	05/25/2010
7688167	Contact electrode for microdevices and etch method of manufacture A contact electrode for a device is made using an etching process to etch the surface of the contact electrode to form a corrugated contact surface wherein the outer edges of at least one grain is recessed from the outer edges of adjacent grains and is recessed by a...	03/30/2010
7687304	Current-driven device using NiMn alloy and method of manufacture A material for forming a conductive structure for a micromechanical current-driven device is described, which is an alloy containing about 0.025% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical propertie...	03/30/2010
7675162	Interconnect structure using through wafer vias and method of fabrication A device and a method are described which hermetically seals at least one microstructure within a cavity. Electrical access to the at least one microstructure is provided by through wafer vias formed through a via substrate which supports the at least one microstruc...	03/09/2010
7626311	Hysteretic MEMS two-dimensional thermal device and method of manufacture A MEMS hysteretic thermal device may have two passive beam segments driven by a current-carrying loop coupled to the surface of a substrate. The first beam segment is configured to move in a direction having a component perpendicular to the substrate surface, wherea...	12/01/2009
7622783	MEMS thermal actuator and method of manufacture A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive be...	11/24/2009
7582969	Hermetic interconnect structure and method of manufacture A hermetic interconnect is fabricated on a substrate by forming a stud of conductive material over a metallization layer, and then overcoating the stud of conductive material and the metallization layer with a layer of compliant dielectric material. In one embodimen...	09/01/2009
7569926	Wafer level hermetic bond using metal alloy with raised feature Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first subst...	08/04/2009
7550778	System and method for providing access to an encapsulated device A method for providing access to a feature on a device wafer, and located outside an encapsulation region is described. The method includes forming a cavity in the lid wafer, aligning the lid wafer with the device wafer so that the cavity is located substantially ab...	06/23/2009
7548145	Hysteretic MEMS thermal device and method of manufacture A MEMS hysteretic thermal device may have a cantilevered beam which bends about one or more points in at least two substantially different directions. In one exemplary embodiment, the MEMS hysteretic thermal device is made from a first segment coupled to an anchor p...	06/16/2009
7533792	Elastic interface for wafer bonding apparatus An apparatus for bonding a lid wafer to a device wafer includes an elastic interface having a first surface and a second surface. Relieved areas may be created in the elastic interface by removing at least some of the elastic material of the interface, leaving a mes...	05/19/2009
7528691	Dual substrate electrostatic MEMS switch with hermetic seal and method of manufacture Systems and methods for forming an electrostatic MEMS switch include forming a cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The hermetic seal may be a gold/indiu...	05/05/2009
7462931	Indented structure for encapsulated devices and method of manufacture A method for providing improved gettering in a vacuum encapsulated device is described. The method includes forming a plurality of small indentation features in a device cavity formed in a lid wafer. The gettering material is then deposited over the indentation feat...	12/09/2008
7276991	Multiple switch MEMS structure and method of manufacture A multiple switch MEMS structure has a higher resistance, higher durability switch arranged in parallel with a lower resistance, less durable switch. By closing the higher resistance, high durability switch before the lower resistance, less durable switch, the lower...	10/02/2007
7264972	Method and apparatus for sorting biological cells with a MEMS device A micromechanical actuator for sorting hematopoietic stem cells for use in cancer therapies. The actuator operates by diverting cells into one of a number of possible pathways fabricated in the fabrication substrate of the micromechanical actuator, when fluorescence...	09/04/2007
7233048	MEMS device trench plating process and apparatus for through hole vias A method for forming through hole vias in a substrate uses a partially exposed seed layer to plate the bottom of a blind trench formed in the front side of a substrate. Thereafter, the plating proceeds substantially uniformly from the bottom of the blind hole to the...	06/19/2007
7229838	MEMS actuator and method of manufacture for MEMS particle sorting device A micromechanical particle sorting chip uses an actuator divided into two parts to direct a component of interest into one of a plurality of possible exit paths, based on detection of a fluorescent signal emanating from the component of interest. The two-part actuat...	06/12/2007
7220594	Method and apparatus for sorting particles with a MEMS device A micromechanical particle sorting chip uses laser light directed through at least one of a reflective and refractive surface to come to a focus in an optically transparent layer. The laser light impinges on a particle of interest, causing it to fluoresce. Upon dete...	05/22/2007
7210352	MEMS teeter-totter apparatus with curved beam and method of manufacture A teeter-totter apparatus uses a curved beam to generate a differential output which may be indicative of an acceleration applied to the apparatus. The curved-beam teeter-totter apparatus can be combined with an x-axis and y-axis accelerometer, to produce a tri-axis...	05/01/2007
7141080	Method and apparatus for assembling an array of micro-devices The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical s...	11/28/2006
7057245	Method and apparatus for assembling an array of micro-devices The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical s...	06/06/2006
6838056	Method and apparatus for sorting biological cells with a MEMS device A micromechanical actuator for sorting hematopoietic stem cells for use in cancer therapies. The actuator operates by diverting cells into one of a number of possible pathways fabricated in the fabrication substrate of the micromechanical actuator, when fluorescence...	01/04/2005
6831380	Low inertia latching microactuator A surface micromachined micromagnetic actuator is described, wherein rotary actuation is accomplished by a member pivotably mounted on the surface of the substrate. Angular motion of the member about the pivot point is imparted by the interaction of a magnetic tab a...	12/14/2004
6812061	Method and apparatus for assembling an array of micro-devices The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical s...	11/02/2004
6593749	Wafer level method for probing micromechanical devices Pressurized fluid from a nozzle is applied against the movable member of a micromechanical device, in order to measure the mechanical properties of the device. The technique is non-destructive, non-invasive, can be applied at the wafer, row or die level, ...	07/15/2003
6351201	Microelectromechanical switch with braking algorithm A micromechanical switch having a plurality of stable positions, which can be driven between the stable positions with a minimum of residual oscillation. The low oscillation results from the application of a braking force of specific magnitude and duratio...	02/26/2002

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Assignee: Innovative Micro Technology