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Assignee: Infineon Technologies Wireless Solutions Sweden AB


Location: Kista, SE
No. of patents: 7

NumberTitleIssue Date
7920660Method and arrangement for removing DC offset from data symbols
To remove DC offset from received data symbols having cyclic prefixes in a data communication system, means (5) are provided for determining the location of the cyclic prefixes, means (3) are provided for calculating the DC offset by calculating a mean...
04/05/2011
7231215Method and a central control unit for channel switching in a packet-based wireless communication network
In a packet-based communication network a central control unit indicates its presence on the first channel by in addition to data traffic transmits regular beacons with a specified time interval, and upon detecting radar signals on a first channel the central contro...
06/12/2007
7164328Direct digital amplitude modulator
Various embodiments of a direct digital amplitude modulator (DDAM) for modulating radio frequency (RF) or intermediate frequency (IF) or baseband signal with the invented interpolation technique are disclosed. The interpolation technique greatly reduces the amplitud...
01/16/2007
7162682Method of error control coding and decoding of messages in a packet-based data transmission system
Initially the message frame comprising a header with length information, a data portion and a check sequence is expanded with gaps inserted to the data portion and the frame check sequence and the frame length information is updated, the frame is then scrambled and ...
01/09/2007
7008836Method to provide a triple well in an epitaxially based CMOS or BiCMOS process
A method to provide a triple well in an epitaxially based CMOS or B:CMOS process comprises the step of implanting the triple well prior to the epitaxial deposition. ...
03/07/2006
6973181Method of generating a ring signal in a subscriber line interface circuit technical field
In a method and a device for controlling the magnitude of the generated ring signal in a the Subscriber Line Interface Circuit (SLIC) the voltage of the A and B lines to the subscriber from the SLIC is compared to a reference voltage. The device is arranged to contr...
12/06/2005
6913187Method and arrangement for providing Vias in printed circuit boards
A method of providing thermal vias in a printed circuit board that includes one or more layers of board material is disclosed. The vias provide for conducting heat from components mounted on the board. One or more holes (4) are provided in a printed circuit b...
07/05/2005
 
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