Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 8116091 | Printed circuit board A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure h... | 02/14/2012 |
| 8115113 | Multilayer printed wiring board with a built-in capacitor A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insul... | 02/14/2012 |
| 8115111 | Multilayer printed wiring board with filled viahole structure A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an... | 02/14/2012 |
| 8110917 | Package substrate with a conductive connecting pin A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad | 02/07/2012 |
| 8110752 | Wiring substrate and method for manufacturing the same A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the ... | 02/07/2012 |
| 8110750 | Multilayer printed wiring board A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing electrical connection between the conductive layers. The conductive ... | 02/07/2012 |
| 8110275 | Mixed particles and honeycomb structure for gas conversion apparatus Mixed particles including noble metal particles of a noble metal, first particles of one or more metal oxides, and second particles of a metal oxide. The first particles of one or more metal oxides are selected from Al2O3, SiO2, ZrO | 02/07/2012 |
| 8110139 | Method for manufacturing honeycomb structure A honeycomb structure is manufactured by molding a pillar-shaped honeycomb molded body having a large number of cells disposed in parallel with one another in a longitudinal direction with a cell wall therebetween by extrusion-molding a raw material composition incl... | 02/07/2012 |
| 8108990 | Method for manufacturing printed circuit board A printed circuit board including a conductor portion, an insulating layer formed over the conductor portion, a thin-film capacitor formed over the insulating layer and including a first electrode, a second electrode and a high-dielectric layer interposed between th... | 02/07/2012 |
| 8107776 | Optical interconnect device and method for manufacturing the same An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signa... | 01/31/2012 |
| 8107253 | Printed circuit board A printed circuit board includes a chip capacitor having electrodes and a metal film formed on one or more of the electrodes, an accommodating layer accommodating the chip capacitor inside the accommodating layer, a connection layer formed over the accommodating lay... | 01/31/2012 |
| 8106310 | Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board A multi-layer printed circuit board having interlayer resin insulating layers on both sides of a core substrate, respectively, through holes provided to penetrate the core substrate and filled with resin filler, the interlayer resin insulating layers and conductor c... | 01/31/2012 |
| 8105544 | Exhaust gas treating apparatus An exhaust gas treating apparatus includes an upstream honeycomb structure and a downstream honeycomb structure each provided along an exhaust gas flowing direction of the exhaust gas treating apparatus. Each of the plurality of honeycomb structures includes at leas... | 01/31/2012 |
| 8101868 | Multilayered printed circuit board and method for manufacturing the same A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating lay... | 01/24/2012 |
| 8101865 | Printed wiring board and a method of production thereof A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a f... | 01/24/2012 |
| 8093508 | Printed wiring board and method of manufacturing the same A printed wiring board including a first insulating layer, a second insulating layer formed over the first insulating layer, a capacitor portion including an upper electrode, a lower electrode and a ceramic high dielectric layer formed between the upper electrode an... | 01/10/2012 |
| 8093507 | Printed wiring board and method for producing the same A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulatin... | 01/10/2012 |
| 8093502 | Flex-rigid wiring board and manufacturing method thereof A flex-rigid printed wiring board is proposed which includes rigid substrates each formed from an insulative base material and a conductor circuit provided on the insulative base material, and a bendably flexible substrate formed from an insulative base material, co... | 01/10/2012 |
| 8091766 | Method and apparatus for loading solder balls A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board... | 01/10/2012 |
| 8091223 | Method for manufacturing board with built-in electronic elements A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conducti... | 01/10/2012 |
| 8087164 | Printed wiring board and a method of manufacturing a printed wiring board A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large aperture... | 01/03/2012 |
| 8083826 | Honeycomb filter and method for producing the honeycomb filter A honeycomb filter includes cell walls and cells. The cell walls extend along a longitudinal direction of the honeycomb filter to define the cells between the cell walls. The cells have first cells and second cells each having a substantially square shape in a cross... | 12/27/2011 |
| 8083123 | Method for manufacturing a printed wiring board A method of manufacturing a printed wiring board having at least one solder bump includes forming a solder resist layer on a conductor layer. The solder resist layer has at least one opening that exposes a connection pad of the conductor layer, and the at least one ... | 12/27/2011 |
| 8080211 | Honeycomb filter A honeycomb filter includes a honeycomb structure and a zeolite. The honeycomb structure has cell walls to define cells between the cell walls. The zeolite is supported on the cell walls. An amount of the zeolite is from about 80 g/L to about 150 g/L. A porosity of ... | 12/20/2011 |
| 8080082 | Honeycomb filter and method for producing the honeycomb filter A honeycomb filter includes an outer wall having a substantially cylindrical shape and a central axis of the substantially cylindrical shape, first walls provided at an inner side of the outer wall and extending along the central axis, and second walls provided at t... | 12/20/2011 |
| 8079142 | Printed circuit board manufacturing method A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer i... | 12/20/2011 |
| 8078024 | Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body An object of the present invention is to provide an optical transmission structural body capable of preferably transmitting an optical signal between an optical wiring and an optical waveguide irrespective of a shape of a portion of the optical wiring, the portion b... | 12/13/2011 |
| 8078017 | Method for manufacturing optical interface module and optical interface module An optical interface module and a method for manufacturing an optical interface module. One method includes forming a lower clad layer on a first surface of a substrate, forming a core layer on the lower clad layer and forming two grooves in part of the core layer t... | 12/13/2011 |
| 8076782 | Substrate for mounting IC chip An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the ... | 12/13/2011 |
| 8071883 | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the n... | 12/06/2011 |
| 8067699 | Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit b... | 11/29/2011 |
| 8065794 | Printed wiring board and its manufacturing method The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be c... | 11/29/2011 |
| 8062603 | Honeycomb structural body An object of the present invention is to provide a honeycomb structural body which is low in pressure loss and can prolong a period up to a regenerating process. The present invention is directed to a columnar honeycomb structural body comprising a large number of t... | 11/22/2011 |
| 8058563 | Interposer and method for manufacturing interposer An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic in... | 11/15/2011 |
| 8057766 | Exhaust gas purifying apparatus and method for purifying exhaust gas An exhaust gas purifying apparatus includes a metal casing and a honeycomb filter installed in the metal casing. The honeycomb filter includes cells, a first end face, and a second end face. The cells include a first cell and a second cell provided alternately. The ... | 11/15/2011 |
| 8056405 | Particulate matter concentration measuring apparatus A particulate matter concentration measuring apparatus configured to measure concentration of particulate matter in exhaust gas passing through an exhaust line includes an exhaust gas collecting line branched from the exhaust line, a particulate matter detection fil... | 11/15/2011 |
| 8048515 | Graphite material and a method of producing graphite material A graphite material includes a plurality of graphite particles and a plurality of pores which form a microstructure. When a cross-section of the microstructure is observed with a scanning electron microscope, the number of the pores appearing on the cross-section is... | 11/01/2011 |
| 8048382 | Honeycomb structure and exhaust gas treating apparatus A honeycomb structure includes a first end face, a second end face, a honeycomb unit, and an ammonia adsorbing material. The second end face is located opposite to the first end face along a longitudinal direction of the honeycomb structure. The honeycomb unit has p... | 11/01/2011 |
| 8047377 | Packaging material and method of transporting honeycomb structured body A packaging material of the present invention, which comprises a plate member, packages an object to be packaged by sandwiching the object, and the plate member is provided with an installation portion for the object to be packaged as well as a reinforcing portion. | 11/01/2011 |
| 8046914 | Method for manufacturing multilayer printed circuit board A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes... | 11/01/2011 |
