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| Number | Title | Issue Date |
| 8181341 | Method of forming a multilayer printed wiring board having a bulged via A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of ... | 05/22/2012 |
| 8178790 | Interposer and method for manufacturing interposer An interposer and a method of manufacturing the same are provided. The interposer includes a substrate and a conductor portion formed inside the substrate. At least one insulating layer is formed on the substrate and on the conductor portion. A signal wiring portion... | 05/15/2012 |
| 8178789 | Wiring board and method of manufacturing wiring board A wiring board assembly and a method of making a wiring board assembly. The wiring board assembly includes a first wiring board having a first substrate, a non-pliable second substrate having a smaller mounting area than a mounting area of the first substrate and a ... | 05/15/2012 |
| 8177577 | Printed wiring board having a substrate with higher conductor density inserted into a recess of another substrate with lower conductor density A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a... | 05/15/2012 |
| 8173907 | Interposer and method for manufacturing interposer An interposer includes a first insulating layer made of an inorganic material and having a first land, a second land and a first wiring electrically connecting the first land and the second land, and a second insulating layer formed over a first surface of the first... | 05/08/2012 |
| 8172921 | Honeycomb structure A honeycomb structure is provided that includes a plurality of pillar-shaped honeycomb fired bodies, each having a number of cells longitudinally disposed in parallel with one another with a cell wall therebetween. An adhesive layer is interposed between adjacent ho... | 05/08/2012 |
| 8169792 | Multilayer printed wiring board A multilayer printed wiring board includes: a build-up layer that is formed on a core substrate and has a conductor pattern disposed on an upper surface; a low elastic modulus layer that is formed on the build-up layer; lands that are disposed on an upper surface of... | 05/01/2012 |
| 8168127 | Honeycomb structure, exhaust gas purifying apparatus and method for manufacturing honeycomb structure A honeycomb structure includes a honeycomb block which includes at least one honeycomb fired body having a first end face side and a second end face side in a longitudinal direction of the honeycomb fired body. The honeycomb fired body includes a plurality of cell w... | 05/01/2012 |
| 8168018 | Method for manufacturing honeycomb structure A method for manufacturing a honeycomb structure includes molding a ceramic raw material to manufacture honeycomb molded bodies. The honeycomb molded bodies are fired to manufacture honeycomb fired bodies. End faces of at least two of the honeycomb fired bodies are ... | 05/01/2012 |
| 8164920 | Printed wiring board A printed wiring board includes a mounting portion on which a dual core processor including two processor cores in a single chip can be mounted, power supply lines, ground lines, and a first layered capacitor and a second layered capacitor that are independently pro... | 04/24/2012 |
| 8163250 | Holding sealing material, method for rolling holding sealing material, and exhaust gas purifying apparatus A holding sealing material includes a mat including an inorganic fibrous material. In a plan view, the mat has a basic quadrangular shape consisting of long sides extending in a longitudinal direction and short sides substantially perpendicular to the long sides. Th... | 04/24/2012 |
| 8161642 | Holding apparatus and method for manufacturing honeycomb structure A holding apparatus includes a first holding unit including at least two supporting rollers rotatable around rotation shafts which extend substantially parallel with each other; a second holding unit including at least one supporting roller rotatable around a rotati... | 04/24/2012 |
| 8161637 | Manufacturing method for printed wiring board A manufacturing method for a printed wiring board includes forming an electroless plated film on an interlayer resin insulation layer, forming on the electroless plated film a plating resist with an opening to expose a portion of the electroless plated film, forming... | 04/24/2012 |
| 8157963 | Sheet member and manufacturing method of the same, and exhaust gas processing device The papermaking sheet member includes inorganic fibers, and the inorganic fibers include a lump-shaped cohered fiber which coheres as a lump. ... | 04/17/2012 |
| 8157456 | Optical interconnect device and method for manufacturing the same An optical interconnect device includes a first substrate, a second substrate, an optical waveguide, an electrical wiring and a switching device. The first substrate has an electrical wiring circuit, an electrical-optical converter for converting an electrical signa... | 04/17/2012 |
| 8157157 | Solder ball loading mask, apparatus and associated methodology A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the ... | 04/17/2012 |
| 8156647 | Method for manufacturing a multilayer printed wiring board A method for manufacturing a multilayer printed wiring board includes preparing a first resin insulative material having a first conductive circuit on or in the first resin insulative material, forming a second resin insulative material on the first resin insulative... | 04/17/2012 |
| 8156646 | Method for manufacturing printed wiring board A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesivenes... | 04/17/2012 |
| 8153905 | Method for manufacturing printed wiring board and printed wiring board A method for manufacturing a printed wiring board includes forming a metal film on a surface of an insulative board, a plating resist on the metal film, and a plated-metal film on the metal film exposed from the plating resist, covering a portion of the plated-metal... | 04/10/2012 |
| 8153073 | Honeycomb filter, exhaust gas purifying apparatus and method for manufacturing honeycomb filter A honeycomb filter includes a ceramic block which includes a plurality of honeycomb fired bodies, an adhesive layer, and irregularities on a peripheral face of the ceramic block. Each honeycomb fired body has a longitudinal direction and cell walls extending along t... | 04/10/2012 |
| 8148645 | Wiring substrate and method of manufacturing the same A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacit... | 04/03/2012 |
| 8148643 | Multilayered printed circuit board and manufacturing method thereof An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an... | 04/03/2012 |
| 8147764 | Honeycomb structure and exhaust gas treating apparatus A honeycomb structure includes four honeycomb units each including inorganic particles, an inorganic binder, and cell walls extending from a first end face to a second end face along a longitudinal direction to define a plurality of cells. The cell walls includes a ... | 04/03/2012 |
| 8147634 | Honeycomb structure and method for manufacturing honeycomb structure A honeycomb structure includes a ceramic block and a sealing material layer. The ceramic block includes a plurality of honeycomb fired bodies each having a large number of cells longitudinally disposed substantially in parallel with one another with a cell wall betw... | 04/03/2012 |
| 8141413 | Particulate matter concentration measuring apparatus A particulate matter concentration measuring apparatus is configured to measure a concentration of particulate matter in exhaust gas flowing through an exhaust line of a diesel engine. The apparatus includes an exhaust gas extraction line diverging from the exhaust ... | 03/27/2012 |
| 8129625 | Multilayer printed wiring board In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance i... | 03/06/2012 |
| 8128790 | Plating apparatus and plating method An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-... | 03/06/2012 |
| 8128722 | Honeycomb filter for purifying exhaust gases, adhesive, coating material, and manufacturing method of honeycomb filter for purifying exhaust gases An object of the present invention is to provide a honeycomb filter for purifying exhaust gases which makes it possible to alleviate a thermal stress generated due to occurrence of a local temperature change and which is less likely to generate cracks and superior i... | 03/06/2012 |
| 8127592 | Particulate matter detection sensor A particulate matter sensor includes a particulate matter detection filter having a volumetric soot storage capacity smaller than the volumetric soot storage capacity of a diesel particulate filter, and a differential pressure measuring part measuring a differential... | 03/06/2012 |
| 8124882 | Multilayer printed wiring board A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32, etc.; and a capacitor portion 40 having a high diel... | 02/28/2012 |
| 8124023 | Holding sealing material, method for manufacturing holding sealing material and exhaust gas purifying apparatus A holding sealing material includes a needle mat, a sheet-processed mat, and a sheet-processed mat. The needle mat includes entangled first inorganic fibers and a binder. The sheet-processed mat includes a binder and second inorganic fibers processed into a sheet. T... | 02/28/2012 |
| 8124002 | Extrusion-molding machine, extrusion-molding method, and method for manufacturing honeycomb structured body An extrusion-molding machine according to the present invention comprises: a screw having a blade portion for extruding a molding material, the screw disposed in a tightly-closed space; and a die for molding an extruded molding material, wherein the space is maintai... | 02/28/2012 |
| 8120040 | Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting... | 02/21/2012 |
| 8119920 | Multilayer printed wiring board An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 μm and a conductor circuit on an interlayer resin insu... | 02/21/2012 |
| 8116091 | Printed circuit board A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure h... | 02/14/2012 |
| 8115113 | Multilayer printed wiring board with a built-in capacitor A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insul... | 02/14/2012 |
| 8115111 | Multilayer printed wiring board with filled viahole structure A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an... | 02/14/2012 |
| 8110917 | Package substrate with a conductive connecting pin A package substrate 310 incorporating a substrate provided with a conductor layer 5, a conductive connecting pin 100 arranged to establish the electrical connection with a motherboard and secured to the surface of the substrate, wherein a pad | 02/07/2012 |
| 8110752 | Wiring substrate and method for manufacturing the same A method for manufacturing a wiring substrate includes forming a conductor circuit on an insulating layer, the conductor circuit including a pad, a circuit pattern connected to the pad, and a lead pattern connected to the pad. A solder resist layer is formed on the ... | 02/07/2012 |
| 8110750 | Multilayer printed wiring board A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing electrical connection between the conductive layers. The conductive ... | 02/07/2012 |
