Quotables
"What, sir, would you make a ship sail against the wind and currents by lighting a bonfire under her deck? I pray you, excuse me, I have not the time to listen to such nonsense."
Napoleon Bonaparte ; When told of the Robert Fulton steamboat
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| Number | Title | Issue Date |
| 7470622 | Fabrication and use of polished silicon micro-mirrors A method of fabricating silicon micro-mirrors includes etching from opposite sides of a silicon wafer with a polished surface on at least one of the opposite sides, to form silicon bars each having a parallelogram-shaped cross-section and including a portion of the ... | 12/30/2008 |
| 7467897 | Light transmitting modules with optical power monitoring An optical module, such as a package for a vertical cavity surface emitting laser diode (VCSEL) or other light emitting device, includes monitoring of the emitted optical power by tapping the transmitted beam. The module includes a substrate, which carries the light... | 12/23/2008 |
| 7419853 | Method of fabrication for chip scale package for a micro component A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example, CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor ca... | 09/02/2008 |
| 7415180 | Accurate positioning of components of an optical assembly A passive alignment technique is disclosed to facilitate accurate positioning of components of an optical assembly. In one aspect, a method includes directing light onto components of an optical assembly in which a first component includes a first pattern of marks w... | 08/19/2008 |
| 7388285 | Hermetically sealed package for optical, electronic, opto-electronic and other devices Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate... | 06/17/2008 |
| 7253388 | Assembly with self-alignment features to position a cover on a substrate that supports a micro component The substrate includes an alignment slot in at least one of its side edges, and includes metallization coupled electrically to the micro component and extending from the front surface of the substrate to its back surface via at least one of the alignment slots. The ... | 08/07/2007 |
| 7213978 | Optical device receiving substrate and optical device holding carrier An optical structure includes a substrate for receiving an optical device. The substrate may hold waveguide reference surfaces for vertical alignment of the device to a waveguide core of the substrate. A carrier for holding the optical device has contact surface par... | 05/08/2007 |
| 7209235 | Accurate positioning of components of a optical assembly A passive alignment technique is disclosed to facilitate accurate positioning of components of an optical assembly. In one aspect, a method includes directing light onto components of an optical assembly in which a first component includes a first pattern of marks w... | 04/24/2007 |
| 7165896 | Light transmitting modules with optical power monitoring An optical module, such as a package for a vertical cavity surface emitting laser diode (VCSEL) or other light emitting device, includes monitoring of the emitted optical power by tapping the transmitted beam. The module includes a substrate, which carries the light... | 01/23/2007 |
| 7109580 | Hermetically sealed package for optical, electronic, opto-electronic and other devices Techniques are disclosed for hermetically sealing one or more devices within a package. According to one aspect, a lid is attached to a substrate on which one or more devices are provided such that the devices are encapsulated within an area defined by the substrate... | 09/19/2006 |
| 6832013 | Hybrid integration of active and passive optical components on an Si-board The present invention relates to an assembly structure and a method for assembling active and passive photonic and/or optoelectronic devices on a silicon board. The invention relates in particular to an assembly structure and a method for aligning the photonic devic... | 12/14/2004 |
