Assignee: Hitachi Tohbu Semiconductor, Ltd.

Location: Iruma-gun, JP
No. of patents: 4

Number	Title	Issue Date
6943441	Semiconductor device In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connecte...	09/13/2005
6288924	Semiconductor device and process for manufacturing the same A memory module MM, in which a module wiring substrate 5 is equipped with function switching means KK1 and KK2 for arbitrarily switching function switching signals to be inputted to function switching pins FP0 and FP1 of memories 1. By these function swit...	09/11/2001
5845332	Non-volatile memory, memory card and information processing apparatus using the same and method for software write protect control of non-volatile memory A non-volatile memory, such as a flash memory card, using a rewritable non-volatile memory is provided with an improved write-protect arrangement. The non-volatile memory includes a collectively electrically erasable and writable memory (e.g., a flash mem...	12/01/1998
5587341	Process for manufacturing a stacked integrated circuit package In the present invention, memory chips are stuck together in stacked fashion by TAB (tape automated bonding), and a multiple memory chip and lead complex like an SOP (small out-line package) is formed of the chips and leads, whereby a memory module of hig...	12/24/1996

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