Did You Know...
...that two musicians were responsible for the invention of color print film? Fascinated by photography, Leopold Godowsky and Leopold Mannes worked together to produce an easy-to-use, practical color film. They worked full time as music teachers and gave concerts while experimenting during their off hours in Mannes' kitchen. Their success earned them full-time, well-paying jobs at Kodak and their efforts resulted in Kodachrome film, which was introduced in 1935.
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| Number | Title | Issue Date |
| 7700239 | Graphite particles and lithium secondary battery using the same as negative electrode A graphite particle obtained by assembling or binding together a plurality of flat-shaped particles so that the planes of orientation are not parallel to one another, or a graphite particle in which aspect ratio is 5 or less or specific surface area is 8 m2 | 04/20/2010 |
| 7692296 | Semiconductor device and multilayer substrate therefor A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an... | 04/06/2010 |
| 6568073 | Process for the fabrication of wiring board for electrical tests The present invention provides a process for the fabrication of a wiring board, which comprises the following steps: (a) forming a first wiring pattern on a first side of a self-supporting carrier metal foil so as to obtain a self-supporting wiring sheet ... | 05/27/2003 |
| 6492203 | Semiconductor device and method of fabrication thereof A semiconductor device fabrication process comprising an encapsulation step of carrying out encapsulation by vacuum pressure differential printing by the use of a liquid resin encapsulant containing a solvent in an amount of from 5% by weight to 50% by we... | 12/10/2002 |
| 6365432 | Fabrication process of semiconductor package and semiconductor package A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals o... | 04/02/2002 |
| 6331729 | Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them In the present invention, an insulating film adhesive material is attached onto the wirings in the form of a tent so that an empty space communicating with a vent hole is provided. Use of this chip-supporting substrate makes it possible to produce small-s... | 12/18/2001 |
| 6248613 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part betwe... | 06/19/2001 |
| 6235842 | Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structur... | 05/22/2001 |
| 6236108 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that co... | 05/22/2001 |
| 6223429 | Method of production of semiconductor device To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental ... | 05/01/2001 |
| 6221118 | Cerium oxide abrasive and method of polishing substrates This invention provides a cerium oxide abrasive with which the surfaces of substrates such as SiO2 insulating films can be polished at a high rate without causing scratches. The abrasive of the present invention comprises a slurry comprising ce... | 04/24/2001 |
| 6184577 | Electronic component parts device In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive fi... | 02/06/2001 |
| 6165478 | DNA encoding Chlamydia pneumoniae antigenic polypeptide Chlamydia pneumoniae antigenic polypeptides, which comprise polypeptide A containing a sequence of at least 5 consecutive amino acids in the polypeptide of SEQ ID NO: 1; DNAs encoding said antigenic polypeptides, or DNAs complementary thereto; recombinant... | 12/26/2000 |
| 6046072 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part betwe... | 04/04/2000 |
| 6025113 | Photosensitve polymide precursor and its use for pattern formation A polyimide precursor having repeating units of the formula: ##STR1## wherein R1 is a tetravalent organic group having 4 or more carbon atoms; R2 is a trivalent or tetravalent organic group having one or more aromatic rings; R | 02/15/2000 |
| 5915757 | Electrostatic protective device and method for fabricating same Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the ... | 06/29/1999 |
| 5834575 | Compounds and polymers, resin compositions, nonlinear optical element and nonlinear optical devices, and production process therefor As a heteroaromatic compound made functional so as to be used in nonlinear optical materials, the present invention provides a heteroaromatic compound represented by the following Formula (1), (2), (3) or (4), a polymer obtained from any of these, a nonli... | 11/10/1998 |
| 5728213 | Method of growing a rare earth silicate single crystal A method of growing a rare earth silicate single crystal from a melt of a starting material containing a rare earth oxide and a silicon oxide, wherein the starting material in which a density of Fe as an impurity is not more 0.1 ppm, a density of Al as an... | 03/17/1998 |
| 5714794 | Electrostatic protective device Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the ... | 02/03/1998 |
| 5690731 | Method of growing single crystal A method of growing a crack-free single crystal is disclosed which comprises heating raw materials in a crucible to thereby obtain a melt of the raw materials, contacting a lower end of a seed crystal with the melt and pulling the seed crystal to thereby ... | 11/25/1997 |
| 5605763 | Electrically conductive bonding films Described is an electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhyd... | 02/25/1997 |
| 5532105 | Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board A photolithographically viahole-forming photosensitive element is formed of a light-transmitting base material and a photosensitive resin composition laminated as a layer on the light-transmitting base material. The photosensitive resin composition compri... | 07/02/1996 |
| 5510425 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides A polymide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for t... | 04/23/1996 |
| 5508357 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of polyimides A polyimide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process... | 04/16/1996 |
| 5504992 | Fabrication process of wiring board The object of the present invention is to provide a wiring board fabrication process which is, not only so smooth on the surface that a fine wiring pattern can be formed thereon, but also suitable for mounting electronic parts having fine pitch terminals.... | 04/09/1996 |
| 5262277 | Photosensitive resin composition and photosensitive element using the same A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoin... | 11/16/1993 |
| 5187490 | Stripline patch antenna with slot plate A stripline patch antenna having a slot plate which is capable of obtaining higher antenna gain, while reducing the loss due to the feed lines. The antenna includes at least one radiating element for transmitting and receiving radio waves; a feed line for... | 02/16/1993 |
| 5003457 | Simultaneous data and electric power transmitting/receiving system A data and power transmitting/receiving system applicable to a home automation system. Plural terminal units and associated communication units are connected via a common signal bus. Each terminal unit may operate an electrical load to be controlled remot... | 03/26/1991 |
