U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

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...that the inventor of the electric motor was a blacksmith named Thomas Davenport? Described as "a brilliantly unsuccessful inventor", Davenport invented the first rotary electric motor. In 1836 he headed out -- on foot -- from his Vermont home to file a patent application at the Patent Office in Washington, D.C. By the time he got there, he had squandered away his money and couldn't afford the $30 filing fee so he turned around and went home. When he later mailed in his application with money he'd raised, the Patent office was destroyed in a fire. He did finally get credit for his invention on Feb. 5, 1837.

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Assignee: Hitachi Chemical Co., Ltd.


Location: Tokyo, JP
No. of patents: 340

1                  
NumberTitleIssue Date
8179361Reflector and backlight device
A back light device realizing improvement in hotspots and bright line in the region of light incidence and of darkness arising in between light sources is provided by forming the reflective surface of the reflector as a structured face comprising an iteration of pri...
05/15/2012
8168541CMP polishing slurry and polishing method
The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,...
05/01/2012
8129467Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device
The present invention relates to a curing accelerating compound-silica composite material capable of giving excellent storage stability to a curable resin composition, which is obtained by subjecting one or more compounds selected from compounds represented by the g...
03/06/2012
8115105Prepreg and its application products for low thermal expansion and low dielectric tangent
A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the ther...
02/14/2012
8106385Organic siloxane film, semiconductor device using the same, flat panel display device, and raw material liquid
Disclosed is materials design for prolonging the duration of the low relative dielectric constant of an organic siloxane film having a low relative dielectric constant. Specifically, in an organic siloxane film having a relative dielectric constant of not more than ...
01/31/2012
8098419Light control film and light control glass
The present invention relates to a light control film, comprising: two transparent electroconductive resin substrates; and a light control layer sandwiched by the two transparent electroconductive resin substrates,...
01/17/2012
8096693Light guide plate and backlight unit
A light guide plate includes: a plate surrounded by two main surfaces and a plurality of end surfaces connecting the main surfaces, one of the end surfaces designated as an entrance surface, one of the main surfaces designated as a reflection surface; a first reflec...
01/17/2012
8084363Polishing slurry and polishing method
The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polishe...
12/27/2011
8084362Polishing slurry and polishing method
The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polishe...
12/27/2011
8084130Epoxy resin molding material for sealing and electronic component device
The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. T...
12/27/2011
8075943Purification process for organic electronics material
Objects of the present invention are to provide a purification process that enables Pd contained in an organic electronics material to be removed effectively, to provide an electroluminescent device middle layer material purified by the process, and to provide an el...
12/13/2011
8075800Polishing slurry and polishing method
A polishing slurry containing a slurry dispersing particles of tetravalent metal hydroxide in a medium therein and an additive, characterized in that the additive is a polymer containing at least one kind of monomer component selected from a group of monomers repres...
12/13/2011
8059331Light control film and light control glass
The present invention relates to a light control film, comprising: two transparent electroconductive resin substrates; and a light control layer sandwiched by the two transparent electroconductive resin substrates,...
11/15/2011
8044379Well-aligned, high aspect-ratio, high-density silicon nanowires and methods of making the same
A method of producing silicon nanowires includes providing a substrate in the form of a doped material; formulating an etching solution; and applying an appropriate current density for an appropriate length of time. Related structures and devices composed at least i...
10/25/2011
8043709Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating l...
10/25/2011
8034545Radiation curable composition, storing method thereof, forming method of cured film, patterning method, use of pattern, electronic components and optical waveguide
The present invention provides a radiation curing composition comprising (a): a siloxane resin, (b): a photoacid generator or photobase generator, and (c): a solvent capable of dissolving component (a) and containing an aprotic solvent. ...
10/11/2011
8034427Friction material composition and friction material produced therewith
Disclosed is a friction material composition, comprising a fiber matrix, a binder, an organic filler, and an inorganic filler, wherein the fiber matrix contains at least two types of mineral fibers different in average fiber length from each other, and the differenc...
10/11/2011
8029701Mixed conductive powder and use thereof
There are disclosed a highly packed, mixed conductive powder with a relative packing density of at least 68%, a process for producing the same, a conductive paste using the mixed conductive powder and a process for producing the same, as well as a sheet and a sheet ...
10/04/2011
8028402Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof
Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating...
10/04/2011
8008418High-molecular copolymer containing metal coordination compound and organic electroluminescence element using the same
It is an object of the present invention to provide a copolymer containing a metal coordination compound that has blue phosphorescence emission with excellent color purity and, furthermore, to provide a copolymer containing a metal coordination compound that has lum...
08/30/2011
8002860CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a metho...
08/23/2011
7994058Polishing slurry and polishing method
The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polishe...
08/09/2011
7991248Optical waveguide substrate and substrate mounting photoelectric hybrid circuit
There are provided a substrate mounted with a photoelectric hybrid circuit having an optical path conversion mirror structure and optical waveguide wiring by reducing the number of parts and the number of fabrication steps, as well as most effectively implement high...
08/02/2011
7982322Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same
The present invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability ...
07/19/2011
7981977Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler
The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at le...
07/19/2011
7981608Device and method for high-throughput quantification of MRNA from whole blood
Disclosed are a method, device kit, and automated system for simple, reproducible, and high-throughput quantification of mRNA from whole blood. More particularly, the method, device, kit and automated system involve combinations of leukocyte filters attached to olig...
07/19/2011
7973125Method of evaluating polymide dissolution rate, method of producing polymide, and polymide obtained using same methods
A method of evaluating the dissolution rate of a polyimide by Raman spectroscopy, wherein the Raman spectral intensity I(a) of imide groups contained within the polyimide is measured, and I(a) is then compared with the Raman spectral intensity I(b) of imide groups c...
07/05/2011
7968288Device and method for high-throughput quantification of mRNA from whole blood
Disclosed are a method, device kit, and automated system for simple, reproducible, and high-throughput quantification of mRNA from whole blood. More particularly, the method, device, kit and automated system involve combinations of leukocyte filters attached to olig...
06/28/2011
7968195Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; ...
06/28/2011
7968194Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler
The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; ...
06/28/2011
7955716Metal coordination compound, polymer composition, and organic electroluminescent device employing same
It is an object of the present invention to provide a phosphorescence-emitting material that emits light in a wide visible light range from blue to red and has excellent color purity and reliability, etc. The present invention relates to a metal coordination compoun...
06/07/2011
7955466Method of and apparatus for manufacturing polarization plate
When a polarization plate is manufactured by laminating and laminating at least two types of retarder films onto a polarizer film by a laminating apparatus, with the two films of at least the two types of retarder films and at least the polarizer films being laminat...
06/07/2011
7947394Non-aqueous electrolyte secondary battery-use cathode material, production method therefor, non-aqueous electrolyte secondary battery-use cathode and non-aqueous electrolyte secondary battery using the cathode material
In order to provide a nonaqueous electrolyte secondary battery negative electrode material that has an excellent discharging capacity, the charge/discharge efficiency and the charge load characteristics, a manufacturing method thereof, a nonaqueous electrolyte secon...
05/24/2011
7932341Polypropylene polymer film and adhesive film using the same
An object of the present invention is to provide a polypropylene polymer film superior in convenience in handling that does not generate troubles such as wrinkling, elongation or breakage during processing at a high temperature of 80° C. to 120° C., independently ...
04/26/2011
7914871Composition for friction material and friction material using same
The present invention relates to a composition for a friction material that is suitable for the production of friction materials such as disc brake pads or brake linings used for braking automobiles or the like, and also relates to a friction material that uses the ...
03/29/2011
7906240Negative electrode for lithium secondary battery and lithium secondary battery
A negative electrode for a lithium secondary battery, comprising a layer of a mixture containing graphite powder and an organic binder on a current collector, wherein a diffraction intensity ratio (002)/(110) measured by X-ray diffractometry of the layer of a mixtur...
03/15/2011
7887609Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the same
A polishing slurry for polishing an aluminum film used for LSI or the like and a method for polishing an aluminum film using the same are provided. A polishing slurry for polishing an aluminum film comprising a polyvalent carboxylic acid having a first stage acid di...
02/15/2011
7846998Sealant epoxy-resin molding material, and electronic component device
Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame r...
12/07/2010
7867303Cerium oxide abrasive and method of polishing substrates
A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m.2/...
01/11/2011
7862889Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm....
01/04/2011
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