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| Number | Title | Issue Date |
| 8182960 | Metal separator for fuel cells and fabricating method thereof A metal separator for fuel cells formed with a metal plate and provided between cells accumulated, in which the metal plate is formed like trapezoidal irregularities to separate channels for a fuel gas from ones for an oxidant gas. Slope portions are formed after fo... | 05/22/2012 |
| 8182278 | Connector A connector includes a first terminal housing for housing a plurality of aligned first connecting terminals, a second terminal housing for housing a plurality of aligned second connecting terminals, and a connecting member for collectively fixing and electrically co... | 05/22/2012 |
| 8182275 | Lever connector with a connecting member manipulating mechanism for turning a turn lever to manipulate a connecting member A lever connector includes a first connector portion including a first terminal housing with a plurality of first connecting terminals, a second connector portion including a second terminal housing with a plurality of second connecting terminals, a plurality of iso... | 05/22/2012 |
| 8179620 | Optical module An optical module according to the present invention comprises an optical element; and a multilayer insulating substrate which is a lamination of a plurality of single-layer insulating substrates and has a light transmission hole for passing light emitted from the o... | 05/15/2012 |
| 8178786 | Radiation-proof sheath material and radiation-proof cable A radiation-proof sheath material includes a polymer material containing molecular chains of ethylene units as a main component in which side chain groups are randomly distributed and cross-linked, an antioxidant, a processing aid, and a flame retardant. The polymer... | 05/15/2012 |
| 8178191 | Multilayer wiring board and method of making the same A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first... | 05/15/2012 |
| 8173905 | Wiring structure and method for fabricating the same A wiring structure has a silicon layer, a backing layer provided on the silicon layer, the backing layer comprising a copper alloy containing a nickel, and a copper layer provided on the backing layer, and a diffusion barrier layer having an electrical conductivity,... | 05/08/2012 |
| 8163999 | Insulation-coated wire An insulation-coated wire has a conductor, and a semiconductive layer provided at an outer periphery of the conductor. The semiconductive layer has a resin coating including metal fine particles dispersed in a base resin, in which an average particle diameter of the... | 04/24/2012 |
| 8163110 | Superfine copper alloy wire and method for manufacturing same A superfine copper alloy wire has a copper-silver alloy wherein the superfine copper alloy wire has a final wire diameter of 0.05 mm or less, and the copper-silver alloy has a copper-silver eutectic crystal phase whose volume ratio to a whole volume of the superfine... | 04/24/2012 |
| 8155493 | Flexible optical waveguide and process for its production The invention provides a flexible optical waveguide in which an optical waveguide film is directly formed on a substrate without using an adhesive and which is excellent in flexibility of the optical waveguide film, including the substrate, and excellent in adhesive... | 04/10/2012 |
| 8150225 | Optical fiber mounting waveguide device and method for fabricating same An optical fiber mounting waveguide device includes a substrate, an optical fiber mounting groove provided on a part of the substrate for mounting an optical fiber, an under cladding layer and a core sequentially formed on the substrate, and an over cladding layer f... | 04/03/2012 |
| 8143702 | Group III-V nitride based semiconductor substrate and method of making same A group III-V nitride-based semiconductor substrate includes a group III-V nitride-based semiconductor crystal. A surface area of the substrate is greater than or equal to 45 cm2. A thickness of the substrate is greater than or equal to 200 μm. An in-pla... | 03/27/2012 |
| 8143525 | Solar cell lead wire and production method therefor and solar cell using same A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder t... | 03/27/2012 |
| 8143517 | Extra-fine copper alloy wire, extra-fine copper alloy twisted wire, extra-fine insulated wire, coaxial cable, multicore cable and manufacturing method thereof An extra-fine copper alloy twisted wire including a plurality of copper alloy wires with a wire diameter of 0.010 to 0.025 mm twisted together, each of the copper alloy wires including 1 to 3 weight % of silver (Ag) and a balance consisting of a copper and an inevit... | 03/27/2012 |
| 8138606 | Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of its surface, and the Sn-based material part includes a base metal doped with an oxidation control element. The oxidation control element is at least one element selected from a ... | 03/20/2012 |
| 8138516 | Light emitting diode A light emitting diode is provided, comprising: a substrate; a metal wiring layer disposed on the substrate; alight emitting element provided on the metal wiring layer; wherein the light emitting element comprises: a semiconductor light emitting layer having a first... | 03/20/2012 |
| 8137489 | Copper alloy material and a method for fabricating the same A copper alloy material has a rolled surface having a plurality of crystal faces parallel to the rolled surface. The crystal faces includes at least one crystal face selected from a group consisted of {011}, {1nn} (n is an integer, n≧1), {11m} (m is an integer, mâ... | 03/20/2012 |
| 8137125 | Conductor connection structure A conductor connection structure includes a cable including a stranded conductor composed of twisted plural wire conductors, and an insulating layer formed around the perimeter of the stranded conductor, the cable being connected to a male terminal member; a female ... | 03/20/2012 |
| 8129439 | Aqueous absorptive polymer-containing resin composition-producing method, aqueous absorptive polymer-containing resin composition, and porous substance-producing method using same and porous substance, insulated electric cable-producing method, insulated electric cable and coaxial cable A method for producing an aqueous absorptive polymer-containing resin composition in which a resin composition is doped with an aqueous absorptive polymer includes causing the aqueous absorptive polymer to absorb and be swollen by water beforehand, and milling and m... | 03/06/2012 |
| 8124275 | Method of manufacturing catalyst carrier, catalyst carrier, and electrode of fuel cell battery To smoothly deliver a thermal energy required in an active site of a catalyst carried on a carrier. A method of manufacturing a catalyst carrier of the present invention includes the steps of: forming a mixed thin film in which at least metal and ceramics are mixed ... | 02/28/2012 |
| 8123573 | Connection structure A connection structure includes a first terminal housing with first connecting terminals, a second terminal housing with second connecting terminals, isolating plates in the first terminal housing, a connecting member to collectively fix the first connecting termina... | 02/28/2012 |
| 8123546 | Connector for large power transmission A connector includes a male terminal housing with a plurality of first connecting terminals aligned and accommodated therein, a female terminal housing with a plurality of second connecting terminals aligned and accommodated therein, a plurality of isolating plates ... | 02/28/2012 |
| 8121452 | Method for fabricating a hollow fiber A hollow fiber has a hollow tube, a reflecting film formed on an inner wall of the hollow tube, and the reflecting film is a first metal film formed by baking a first metal nano particle solution including a first metal nano particle. The hollow fiber may have a tra... | 02/21/2012 |
| 8121139 | Communication module and communication apparatus A communication module mounted on a communication apparatus which includes plural communication modules, plural apparatus side signal processing circuits for processing a communication signal which is transmitted to and received from the communication modules by a p... | 02/21/2012 |
| 8120059 | Nitride semiconductor substrate and method of fabricating the same A nitride semiconductor substrate includes a front surface, a rear surface on an opposite side to the front surface, and a first edge portion including a chamfered edge on the front surface. A ratio of an average surface roughness of the front surface to an average ... | 02/21/2012 |
| 8120051 | Semiconductor light emitting element A semiconductor light emitting element includes a group III-V compound semiconductor layer, a first main surface and a second main surface, a reflection metal film formed on the second main surface, a front surface electrode formed on the first main surface, and an ... | 02/21/2012 |
| 8120050 | Light-emitting element A light-emitting element includes a semiconductor substrate, a light emitting layer portion including an active layer on the semiconductor substrate, a first reflective layer between the semiconductor substrate and the active layer for reflecting light emitted from ... | 02/21/2012 |
| 8120046 | Light-emitting element A light-emitting element includes a semiconductor laminated structure including a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type different from the first conductivity type and an active layer sandwi... | 02/21/2012 |
| D654434 | Optical module | 02/21/2012 |
| 8116633 | Optical-electrical transceiver module An optical-electrical transceiver module is to connect an optical-electrical composite cable incorporating an optical fiber and an electric wire to a receptacle of external electrical equipment. The module comprises a base; an optical path conversion element provide... | 02/14/2012 |
| 8115125 | Cord switch A cord switch includes a hollow insulation having a restoring force, a plurality of inner electrode wires provided along an inner surface of the hollow insulation, and an outer electrode provided on an outer surface of the hollow insulation. The outer electrode incl... | 02/14/2012 |
| 8105540 | Method of treating polymer compound and treatment system for the same A method of treating a polymer compound has the steps of: mixing and agitating the polymer compound and a chemical agent in an extruder while controlling the inside of the extruder to be kept at a high temperature and a high pressure to have a reaction mixture conta... | 01/31/2012 |
| 8105099 | Lever connector A lever connector includes a first connector portion including a first terminal housing with a plurality of first connecting terminals, a second connector portion including a second terminal housing with a plurality of second connecting terminals, a plurality of iso... | 01/31/2012 |
| 8102026 | Group-III nitride semiconductor freestanding substrate and manufacturing method of the same To provide a group-III nitride semiconductor freestanding substrate, with carrier concentration of a peripheral part of a n-type group-III nitride semiconductor freestanding substrate set to be lower than the carrier concentration inside of the peripheral part. In t... | 01/24/2012 |
| 8101939 | GaN single-crystal substrate and method for producing GaN single crystal A GaN single-crystal substrate has a substrate surface in which polarity inversion zones are included. The number density of the polarity inversion zones in the substrate surface is not more than 20 cm−2. A GaN single crystal production method includes ... | 01/24/2012 |
| 8101864 | Electronic device substrate and its fabrication method, and electronic device and its fabrication method An electronic device substrate is provided with a thin-plate core substrate; a metal electrode provided on the core substrate and electrically connected to an electrode of an electronic component to be packaged thereon; and an electrical insulation layer on which is... | 01/24/2012 |
| 8100708 | Connection structure for a vehicle A connector has a first terminal housing with first connecting terminals aligned and accommodated therein, a second terminal housing with second connecting terminals aligned and accommodated therein, isolating plates and a connecting member. Each of the first connec... | 01/24/2012 |
| 8098987 | Optical transmitting and receiving apparatus and method for analyzing abnormality or failure of the optical transmitting and receiving apparatus An optical transmitting and receiving apparatus 1 has a transmitting circuit unit 20 including a light emitting element 2 and a driving circuit 3 which drives the light emitting element 2, a receiving circuit unit 30 includi... | 01/17/2012 |
| 8091615 | Heat transfer pipe with grooved inner surface A heat transfer pipe 21 with grooved inner surface is provided with a pipe body 22 having a pipe axis line â—¯ as a center axis line, a plurality of first fins 23 each having a fin height Hf, formed by providing a plurality of spiral grooves ... | 01/10/2012 |
| 8084925 | Piezoelectric thin film elemental device, sensor and actuator A piezoelectric thin film element has a piezoelectric thin film on a substrate, the piezoelectric thin film has a (K1-x,Nax)NbO3thin film expressed by a compositional formula (K1-xNax)NbO3(0 | 12/27/2011 |
