Did You Know...
...that the Eveready Battery began as an invention called the "electric flowerpot," which was a tube with a battery and light bulb inside? The idea was to fasten this gizmo to the side of a flowerpot so it would illuminate the flowers from the bottom. The idea died on the vine and the businessman who licensed the flower pot, Conrad Huber, was left with a pile of useless tubes -- until he found a way to market them as batteries to light the world!
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| Number | Title | Issue Date |
| 8075706 | Paste composition for aluminum brazing A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a methacrylic acid ester type polymer (c), and 10 to 40% by weight of an o... | 12/13/2011 |
| 7988826 | Cationic surface sizing agent and paper coated with the same The invention improves a sizing effect even on paper containing no internal sizing agent and improves productivity by making solution polymerization in a small amount of an organic solvent. The invention provides a cationic surface sizing agent composed of a copolym... | 08/02/2011 |
| 7902276 | Surface sizing agent and use thereof A surface sizing agent is provided which has excellent dispersion stability, enables impartation of high sizing performance under a wide range of use conditions, irrespective of the characteristics of water used for sizing (hardness, pH, etc.) and the type of paper,... | 03/08/2011 |
| 7820232 | Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the co... | 10/26/2010 |
| 7798389 | Flux for soldering, soldering method, and printed circuit board A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the ... | 09/21/2010 |
| 7669752 | Flux for soldering and circuit board A flux contains resin having film forming ability, activator, solvent and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plati... | 03/02/2010 |
| 7569164 | Solder precoating method A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste com... | 08/04/2009 |
| 7524893 | Conductive adhesive The present invention provides a conductive adhesive that is applicable as means for forming conductive junction to process for surface mounting of electronic parts for vehicle loading and process for the manufacture of the electronic parts per se for the purpose of... | 04/28/2009 |
| 7503958 | Method of manufacturing the SnZnNiCu solder powder and the SnZnNiCu solder powder The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500° C., in particular, not less than 900° C. The raw material metal used as raw material of the so... | 03/17/2009 |
| 7452797 | Solder deposition method and solder bump forming method The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the el... | 11/18/2008 |
| 7291517 | Method for removing resin mask layer and method for manufacturing solder bumped substrate Using a dry film resist that is a photosensitive resin, a resin mask layer is formed around electrodes on a substrate. A solder precipitating composition is applied on the substrate, and this solder precipitating composition is heated to precipitate solder on the su... | 11/06/2007 |
| 7081214 | Electroconductive metal paste and method for production thereof This invention provides a low-temperature sintering conductive paste for high density circuit printing which can form a fine circuit having good adhesive force, a smooth surface and low resistance when applied on a substrate and then baked; the conductive paste of t... | 07/25/2006 |
| 7070829 | Production method of gas sensor To provide a method for producing a sensing film for gas sensors by sintering particles comprising a metal or a metal oxide on a substrate, where the sensing film for gas sensors having excellent sensor properties such as sensitivity and responsibility can be easily... | 07/04/2006 |
| 6894096 | Method of producing resin varnish for printing ink A resin varnish for printing ink is produced by condensing phenol and formaldehyde in an ink solvent to obtain an ink solvent solution of resole initial condensate, after which the resole initial condensate and a rosin ester containing 30-60 wt % non-aromatic conjug... | 05/17/2005 |
| 5824722 | Stabilizer and resin composition containing the same The present invention provides a stabilizer comprising a substituted cyclohexene compound of a hindered piperidine type wherein the 1- and 2-positions on a cyclohexene ring are doubly bonded, a carbon atom situated at the 4-position and/or the 5-position ... | 10/20/1998 |
| 5453582 | Circuit board to be precoated with solder layers and solder circuit board A large number of pads, to which component leads are to be soldered, are formed on an insulating substrate so as to constitute a pad array. Colder layers are precoated on the pads. Each of the pads has a component lead mounting portion where a component l... | 09/26/1995 |
| 5399660 | Sizing agent composite for papermaking The invention provides a sizing agent with good stability, particularly which is rapid in getting started in the neutral zone and a method of producing the same. A sizing agent for papermaking in neutral zone is characterized by a main component of said s... | 03/21/1995 |
| 5296649 | Solder-coated printed circuit board and method of manufacturing the same A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H | 03/22/1994 |
| 5201944 | Size composition for papermaking The present invention relates to a size composition which shows an excellent sizing effect in neutral to weakly acidic papermaking. Alkanol tertiary amine and fortified rosin, incorporated in the size composition of the present invention, even when prepared as... | 04/13/1993 |
| 5167729 | Soldering flux Disclosed is a soldering flux which prevents a release of an active ion contained in an activator when exposed to a high-temperature atmosphere maintaining at a temperature higher than 80° C., for example, an atmosphere of an engine room of an automobile... | 12/01/1992 |
| 5158697 | Deinking agent for reproduction of printed waste papers The present invention relates to an deinking agent used for reproduction of printed waste papers such as newspapers, magazines, leaflets and the like, and mainly contains one or more additives selected from the group comprising (a) additives made by addin... | 10/27/1992 |
| 5059272 | Method for the manufacture of electronic circuits utilizing a composition with insulating and electroconductive properties A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the metal salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and... | 10/22/1991 |
| 5021269 | Method for forming a metal film on the surface of a substrate metal A method for forming a metal film on the surface of a substrate metal, which comprises soaking a substrate metal or a non-metal support carrying the substrate metal thereon in a solution of a metal salt in a high boiling point solvent under heating condit... | 06/04/1991 |
| 4851153 | Conductive high molecular weight composition A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the melt salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and ... | 07/25/1989 |
