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| Number | Title | Issue Date |
| 7019959 | Method for forming a printed circuit board and a printed circuit board formed thereby Upper, inner and lower sections (182, 180 and 184) of a PCB (100) are formed with each section having a substrate (140, 150 and 160) having patterned layers of metallization (105 and 110, 115 and 120, and 12... | 03/28/2006 |
| 6533849 | Electroless gold plated electronic components and method of producing the same An neutral electroless gold plating method that minimises "black band" corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to al... | 03/18/2003 |
