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Assignee: Gasonics International


Location: SanJose, CA
No. of patents: 3

NumberTitleIssue Date
5914278Backside etch process chamber and method
A modular semiconductor wafer processing system comprises a chamber with a wafer support and gas manifold structure that supplies reactive gases through a showerhead delivery system to one side of a wafer-being-processed and that exhausts both the reactiv...
06/22/1999
5667592Process chamber sleeve with ring seals for isolating individual process modules in a common cluster
A modular semiconductor wafer processing system comprises a plurality of detachable process reactors and other types of generators that can be attached to any of several ports on the lid of a circular wafer handling chamber. A multiple-spoke single-axis r...
09/16/1997
5662143Modular gas box system
A modular gas box system comprises a series of modules that each connect into upper and lower manifolds that distribute reactive and purge gases through weldments and monoblock valves. A motherboard distributes power, control signals, and pneumatics air t...
09/02/1997
 
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