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...that Kleenex tissue was originally designed to be a gas mask filter? It was developed at the beginning of World War I to replace cotton, which was then in short supply as a surgical dressing.
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| Number | Title | Issue Date |
| 8025554 | Method of polishing work In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps of: changing a rotational speed of at least one of the sun gear, the in... | 09/27/2011 |
| 8021210 | Polishing head and polishing apparatus having the same The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber fil... | 09/20/2011 |
| 7195546 | Polishing apparatus and method of polishing work piece The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pres... | 03/27/2007 |
| 6991520 | Abrasive machine and method of abrading work piece The abrasive machine of the present invention is capable of changing pressure applied to a work piece and easily defining optimum abrading conditions. The abrasive machine comprises: a pressure vessel capable of increasing and reducing inner pressure; an abrasive pl... | 01/31/2006 |
| 7306510 | Method of adhering polishing pads and jig for adhering the same The method of adhering polishing pads is capable of easily exchanging polishing pads in a comfortable posture. The method comprises the steps of: setting a pad adhering carrier, which has a through-hole in which a roller unit for pressing polishing pads is fixed, in... | 12/11/2007 |
| 7278907 | Method of adhering polishing pads and jig for adhering the same The method of adhering polishing pads is capable of easily adhering the polishing pads without damages. The method comprises the steps of: tentatively adhering the polishing pads to polishing plates; attaching a roller unit having a shaft and a roller member, which ... | 10/09/2007 |
| 7255635 | Polishing apparatus In polishing apparatus of the present invention, collars can be easily exchange. The polishing apparatus comprises: an outer pin gear having an inner gear section; an inner pin gear having an outer gear section; and a carrier having outer gear teeth, which are engag... | 08/14/2007 |
| 7247083 | Polishing apparatus The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid in... | 07/24/2007 |
| 7235001 | Polishing apparatus The polishing apparatus is capable of transferring a work piece to a top ring without moving the work piece from the center and capable of precisely polishing the work piece. The polishing apparatus has a transfer unit for transferring the work piece to the top ring... | 06/26/2007 |
| 7201640 | Method of sucking water and water sucking device The method of sucking water is capable of easily removing excess water included in a backing member adhered on a plate of a polishing apparatus. In the method, the excess water is removed from the backing member by the steps of: pressing a water absorbing member ont... | 04/10/2007 |
| 7163053 | Heat exchanger A method for adjusting temperature of a machining liquid, e.g., slurry, etching liquid, by passing the machining liquid through a heat exchanger. The heat exchanger, which adjusts the temperature of the machining liquid, includes a ceramic heat exchanging tube which... | 01/16/2007 |
| 7115026 | Polishing apparatus An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member.... | 10/03/2006 |
| 7070486 | Polishing apparatus and method of polishing work piece The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pres... | 07/04/2006 |
| 7022001 | Polishing apparatus The small polishing apparatus is capable of simultaneously polishing both side faces of a work piece, and a lower polishing plate, an internal gear and a sun gear are respectively driven by direct drive (DD) motors. The polishing apparatus comprises: an upper and a ... | 04/04/2006 |
| 6982009 | Method and device for cleaning abrasive plates on an abrasive machine The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from sc... | 01/03/2006 |
| 6939204 | Abrasive machine and method of abrading work piece The abrasive machine is capable of feeding a proper amount of slurry and preventing a work piece from sticking on an upper abrasive plate. The abrasive machine comprises: the upper abrasive plate abrading an upper face of the work piece and having a plurality of slu... | 09/06/2005 |
| 6830505 | Polishing machine The polishing machine is capable of evenly applying a pressing force from an upper polishing plate to work pieces accommodated in through-holes of carriers. The polishing machine comprises: a plurality of the carriers provided around a center of gravity of an upper ... | 12/14/2004 |
| 6807701 | Method of cleaning abrasive plates of abrasive machine and cleaning device The method of the present invention cleans abrasive faces of an upper abrasive plate and a lower abrasive plate of an abrasive machine. The method is executed by a cleaning device including: a nozzle for jetting water; a brush for preventing the jetted water from sc... | 10/26/2004 |
| 6797626 | Method of polishing copper layer of substrate The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the s... | 09/28/2004 |
| 6770899 | Work piece feeding machine Work piece feeding machine capable of correctly and efficiently setting a work piece in a through-hole of a carrier. The machine includes a positioning unit which detects the amount of displacement of the work piece with respect to the through-hole and corrects the ... | 08/03/2004 |
| 6705929 | Cloth cleaning device and polishing machine Cloth cleaning device of a polishing machine which is capable of fully cleaning a polishing cloth including a part in the vicinity of a center roller. The cloth cleaning device includes an arm movable in a plane parallel to the polishing cloth between a first positi... | 03/16/2004 |
| 6692221 | Method of adhering wafer and wafer adhering device The method of the present invention is capable of adhering a wafer to a prescribed position of the carrier plate, which has been correctly positioned, in a short time. The method comprises the steps of: heating a carrier plate; detecting a mark provided t... | 02/17/2004 |
| 6692341 | Abrasive machine The abrasive machine of the present invention is capable of controlling a shape of an abrasive face of a small abrasive plate. The abrasive machine comprises: a plate holder holding an abrasive plate; a fixed engaging member being fixed to the plate holde... | 02/17/2004 |
| 6692342 | Wafer abrasive machine In the wafer abrasive machine of the present invention, a gravity center and a rotational axis of a wafer can be corresponded while abrading the wafer and a holding plate can be smoothly moved in a head member. The abrasive machine comprises: the head mem... | 02/17/2004 |
| 6648735 | Method of abrading both faces of work piece Method for abrading a work piece with a fixed load including a first abrading process in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted in order to apply first pressure to the work piece via the uppe... | 11/18/2003 |
| 6435955 | Abrasive machine The abrasive machine is capable of preventing deformation and bad abrasion of an abrasive cloth, maintaining flatness of an abrasive face of an abrasive plate and improving abrading accuracy. The abrasive machine comprises the abrasive plate and a holding... | 08/20/2002 |
| 6332828 | Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can ... | 12/25/2001 |
| 6113463 | Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can ... | 09/05/2000 |
| 5928066 | Apparatus for polishing peripheral portion of wafer A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the ... | 07/27/1999 |
| 5766065 | Apparatus for polishing peripheral portion of wafer A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the ... | 06/16/1998 |
| 5727990 | Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and ro... | 03/17/1998 |
| 5476413 | Apparatus for polishing the periphery portion of a wafer An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abr... | 12/19/1995 |
| 5458529 | Apparatus for polishing notch portion of wafer A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can e... | 10/17/1995 |
| 5429544 | Polishing apparatus for notch portion of wafer An polishing apparatus which can effectively polish a bottom wall of a wafer in a notch portion is disclosed. The apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the no... | 07/04/1995 |
| 4918869 | Method for lapping a wafer material and an apparatus therefor In an apparatus for lapping a wafer material, e.g., a semiconductor silicon wafer, by bonding the wafer to the lower surface of a pressing plate, mounting the pressing plate on a turn table to bring the wafer into contact with the turn table and pressing ... | 04/24/1990 |
| 4272924 | Method of ultrasonic control for lapping and an apparatus therefor A novel method and apparatus are provided by the invention for the precision-control of the thickness of thin work pieces under lapping in a lapping machine having an upper and lower lapping surface plates rotatable relative to each other sandwiching the ... | 06/16/1981 |
