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Assignee: Fu Zhun Industry (Shen Zhen) Co., Ltd.


Location: Shenzhen, Guangdong Province, CN
No. of patents: 2

NumberTitleIssue Date
7443677Heat dissipation device
A heat dissipation device comprises a first heat sink (10) for thermally contacting with an electronic device, a second heat sink (20) mounted on the first heat sink, heat pipes (40) connecting with both the first and second heat sinks. The heat...
10/28/2008
7385822Clip assembly
A clip assembly (30) for mounting a heat sink (20) on a printed circuit board (10) includes a closed annular positioning portion (32) interferingly engaging with the heat sink, a securing portion (34) secured to the positioning por...
06/10/2008
 
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