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Assignee: Freudenberg Nonwovens Ltd.


Location: Lowell, MA
No. of patents: 3

NumberTitleIssue Date
7186166Fiber embedded polishing pad
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free f...
03/06/2007
7086932Polishing pad
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally co...
08/08/2006
6964604Fiber embedded polishing pad
A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free f...
11/15/2005
 
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