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Patent No. 5678617

Method and apparatus for making a drink hop along a bar or counter

A method for generating a drink which appears to hop from a remote spot on the bar or counter and take one or more leaps, before landing in a patron's glass.

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Assignee: Formfactor, Inc.


Location: Livermore, CA
No. of patents: 221

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NumberTitleIssue Date
8154315Self-referencing voltage regulator
A voltage regulator includes an input terminal for receiving a power input having a first voltage level, and an output terminal for generating a power output. A reference signal having a second voltage level is derived from the first voltage level adjusted with a pr...
04/10/2012
8149007Carbon nanotube spring contact structures with mechanical and electrical components
A composite spring contact structure includes a structural component and a conduction component distinct from each other and having differing mechanical and electrical characteristics. The structural component can include a group of carbon nanotubes. A mechanical ch...
04/03/2012
8148646Process of positioning groups of contact structures
A contact apparatus can be made by providing a first substrate with electrically conductive terminals and second substrates each of which can have contact structures. Each of the contact structures can have a contact tip. The second substrates can be aligned such th...
04/03/2012
8145349Pre-aligner search
Methods and systems, in one embodiment, for receiving a warped flexible wafer to be transferred between a first mechanism and a second mechanism are described. The method and system senses a first vacuum suction between the warped flexible wafer and the first mechan...
03/27/2012
8138859Switch for use in microelectromechanical systems (MEMS) and MEMS devices incorporating same
Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact ...
03/20/2012
8130007Probe card assembly with carbon nanotube probes having a spring mechanism therein
Columns comprising a plurality of vertically aligned carbon nanotubes can be configured as electromechanical contact structures or probes. The columns can be grown on a sacrificial substrate and transferred to a product substrate, or the columns can be grown on the ...
03/06/2012
8130005Electrical guard structures for protecting a signal trace from electrical interference
A method of fabricating a guard structure can include depositing an insulating material over at least a portion of electrical signal conductors disposed on a component of a probe card assembly, and depositing an electrically conductive material onto the insulating m...
03/06/2012
8122309Method and apparatus for processing failures during semiconductor device testing
Methods and apparatus for processing failures during semiconductor device testing are described. Examples of the invention can relate to testing a device under test (DUT). Fail capture logic can be provided, coupled to test probes and memory, to indicate only first ...
02/21/2012
8120373Stiffener assembly for use with testing devices
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurali...
02/21/2012
8120304Method for improving motion times of a stage
Methods and systems for, in one embodiment, accelerating a stage through a clearance height in a first direction and decelerating the stage in the first direction while accelerating in a second direction are shown. The stage is moved in a third direction and a deter...
02/21/2012
8115504Microspring array having reduced pitch contact elements
Embodiments of microspring arrays and methods for fabricating and using same are provided herein. In some embodiments, a microspring array may include at least two lithographically formed resilient contact elements, each resilient contact element having a beam and a...
02/14/2012
8098076Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test
Apparatus for terminating a test signal applied to multiple semiconductor loads under test is described—for example apparatus for interfacing a test signal between a tester and a semiconductor device under test (DUT). In some examples, a probe card assembly may in...
01/17/2012
8095841Method and apparatus for testing semiconductor devices with autonomous expected value generation
Method and apparatus for testing semiconductor devices with autonomous expected value generation is described. Examples of the invention can relate to apparatus for interfacing a tester and a semiconductor device under test (DUT). An apparatus can include output pro...
01/10/2012
8067951Method of expanding tester drive and measurement capability
A probe card assembly can comprise an interface, which can be configured to receive from a tester test signals for testing an electronic device. The probe card assembly can further comprise probes for contacting the electronic device and electronic driver circuits f...
11/29/2011
8033838Microelectronic contact structure
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrifici...
10/11/2011
8015536Process and apparatus for adjusting traces
Traces routed through a computer depiction of a routing area of an electronics system comprise a plurality of connected nodes. Forces are assigned to the nodes, and the nodes are moved in accordance with the forces. The forces may be based on such things as the prox...
09/06/2011
8011089Method of repairing segmented contactor
A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled ...
09/06/2011
7999375Electronic device with integrated micromechanical contacts and cooling system
An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals...
08/16/2011
7994803Calibration substrate
A calibration substrate includes a plurality of input terminals, a detector coupled to the input terminals, and an output terminal. The calibration substrate can be used for calibrating and/or deskewing communications channels. ...
08/09/2011
7990164Method of designing a probe card apparatus with desired compliance characteristics
A probe card apparatus is configured to have a desired overall amount of compliance. The compliance of the probes of the probe card apparatus is determined, and an additional, predetermined amount of compliance is designed into the probe card apparatus so that the s...
08/02/2011
7977959Method and apparatus for testing devices using serially controlled intelligent switches
Methods and apparatus for testing devices using serially controlled intelligent switches have been described. In some embodiments, a probe card assembly can be provided that includes a plurality of integrated circuits (ICs) serially coupled to form a chain, the chai...
07/12/2011
7977958Bi-directional buffer for interfacing test system channel
An emitter follower or source follower transistor is provided in the channel of a wafer test system between a DUT and a test system controller to enable a low power DUT to drive a test system channel. A bypass resistor is included between the base and emitter of the...
07/12/2011
7977956Method and apparatus for probe card alignment in a test system
Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting...
07/12/2011
7967621Electrical contactor, especially wafer level contactor, using fluid pressure
An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is couple...
06/28/2011
7965084Self-monitoring switch
Methods and apparatus for switching electrical signals are provided herein. In some embodiments a smart switch is provided, the smart switch may include a switch having a wipe capability; a monitor coupled to the switch for monitoring a performance characteristic th...
06/21/2011
7960990Closed-grid bus architecture for wafer interconnect structure
An interconnect structure employs a closed-grid bus to link an integrated circuit tester channel to an array of input/output (I/O) pads on a semiconductor wafer so that the tester channel can concurrently communicate with all of the I/O pads. The interconnect struct...
06/14/2011
7960989Mechanical decoupling of a probe card assembly to improve thermal response
A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the fra...
06/14/2011
7956635Stiffener assembly for use with testing devices
A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener for use with testing devices includes an inner member; an outer member disposed in a predominantly spaced apart relation to the inner member; and a plurality of al...
06/07/2011
7956633Stacked guard structures
Systems and methods for providing a stack with a guard plane embedded in the stack are disclosed. An electrical apparatus can be made by forming a stack comprising an electrically conductive signal structure, an electrical guard structure, and an electrically insula...
06/07/2011
7952375AC coupled parameteric test probe
A probe for contacting and testing ICs on a semiconductor device includes a dielectric insulating material tip. The dielectric tip does not contaminate the surface being probed unlike metal probe tips. A contact scrub is further not required with signals being capac...
05/31/2011
7948252Multilayered probe card
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with da...
05/24/2011
7944225Method and apparatus for providing a tester integrated circuit for testing a semiconductor device under test
Methods and apparatus for providing a tester integrated circuit (IC) for testing a semiconductor device under test (DUT) are described. Examples of the invention can relate to an apparatus for testing a semiconductor device under test (DUT). In some examples, the ap...
05/17/2011
7936177Providing an electrically conductive wall structure adjacent a contact structure of an electronic device
Devices and methods for providing, making, and/or using an electronic apparatus having a wall structure adjacent a resilient contact structure on a substrate. The electronic apparatus can include a substrate and a plurality of electrically conductive resilient conta...
05/03/2011
7930219Method and system for designing a probe card
A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set o...
04/19/2011
7928750Contactless interfacing of test signals with a device under test
An interface device receives test data from a tester. A signal representing the test data is transmitted to a device under test through electromagnetically coupled structures on the interface device and the device under test. The device under test processes the test...
04/19/2011
7924035Probe card assembly for electronic device testing with DC test resource sharing
A test system can include contact elements for making electrical connections with test points of a DUT. The test system can also include a DC test resource and a signal router, which can be configured to switch a DC channel from the DC test resource between individu...
04/12/2011
7920989Remote test facility with wireless interface to local test facilities
A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, whi...
04/05/2011
7898242Probe card assembly with an interchangeable probe insert
A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can ...
03/01/2011
7897435Re-assembly process for MEMS structures
Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the align...
03/01/2011
7893701Method and apparatus for enhanced probe card architecture
A technique for distributing power to a plurality of dies uses a probe card. The probe card can include a plurality of regulators, each regulator accepting a bulk power input and producing a regulated output. The regulated output can be controlled by a programmable ...
02/22/2011
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