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| Number | Title | Issue Date |
| 7735711 | Method of testing bonded connections, and a wire bonder A method of testing wire-bond connections between a bonding wire and a substrate surface. The wire-bond connections are produced by a bonding head with a bonding tool and a wire clamp associated with the bonding tool under pressure and the action of ultrasound and/o... | 06/15/2010 |
| 7156602 | Mechanism for exchanging chip-carrier plates for use in a hybrid chip-bonding machine A mechanism for exchanging chip-carrier plates in a hybrid chip-bonding machine having a plurality of chip-carrier plates, a magazine to store the plurality of chip-carrier plates, and a transport arrangement having a first and second clamping device that are dispos... | 01/02/2007 |
| 6891730 | Circuit housing Miniaturized circuit housing to encapsulate and provide external contacts for at least one integrated circuit, in particular of the flip-chip or wafer-level-package type, with a housing floor, the lower surface of which bears housing contact elements for making exte... | 05/10/2005 |
| 6827248 | Cutting device for bonded wires Bond-wire cutting device for cutting off the part of a bond wire that extends beyond the bonding contact area after a bonded connection has been produced, with a knife that can be moved with a movement component perpendicular to the surface of a substrate and hence ... | 12/07/2004 |
| 6786320 | Chip-transferring station for a bonding machine A bonding machine chip-transferring station, with a multi-axial positioning mechanism and a suction-needle module mounted and positionable thereon, with a housing, a suction needle connected to a vacuum conduit, and a suction-needle conveyance unit, including a driv... | 09/07/2004 |
| 5979737 | Ultrasonic bonding head comprising a linear motor for adjusting the pressure according to a piezo detector A bonding head is provided for a wire bonding machine which comprises a capillary connected to a transducer for applying pressure and ultrasonic energy to a wire guided into contact with a surface to which a wire bond is to be formed. The transducer is bi... | 11/09/1999 |
| 5950903 | Bonding head A bonding head is provided for a wire bonding machine which includes a wedge (2) connected to a transducer (3) for applying pressure and ultrasonic energy to a wire (1) guided into contact with a substrate to which a bond is to be formed. A support system... | 09/14/1999 |
| 5906706 | Wire guide for a bonding machine A wire guide is provided for use in a wire bonding machine. The guide can be releasably attached to a bonding wedge and a transducer of the bonding head. The wire guide comprises guide members integrally formed with the wire guide body for feeding the bon... | 05/25/1999 |
