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Assignee: Etsu Handotai Co., Ltd.


Location: Tokyo, JP
No. of patents: 1

NumberTitleIssue Date
7364495Wafer double-side polishing apparatus and double-side polishing method
The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding ...
04/29/2008
 
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