Assignee: Endicott Interconnect Technologies, Inc.

Location: Endicott, NY
No. of patents: 123

Browse patents
Browse applications

Number	Title	Issue Date
8144480	Multi-layer embedded capacitance and resistance substrate core A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of ...	03/27/2012
8143530	Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates A substrate and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of polytetrafluoroethylene (PTFE) placed upon both sides of the CIC. A layer of etched copper foil is placed on the outer surface of e...	03/27/2012
8084863	Circuitized substrate with continuous thermoplastic support film dielectric layers A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned ...	12/27/2011
8063315	Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as...	11/22/2011
8028390	Spring actuated clamping mechanism A spring actuated clamping mechanism has a backer plate with an upper surface and a lower surface. A set of apertures is formed along the periphery of the backer plate. The upper surface of the backer plate has at least one backer plate recess, and preferably four r...	10/04/2011
7977034	Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through th...	07/12/2011
7972178	High density connector for interconnecting fine pitch circuit packaging structures A pinned interposer and mating sockets to facilitate removable mounting of high connection density micro devices between a pair of substrates in compact electronic circuit packages. The pinned interposer has an inner set of contacts, typically in a rectangular array...	07/05/2011
7931830	Dielectric composition for use in circuitized substrates and circuitized substrate including same A dielectric composition which is adapted for combining with a supporting material ( e.g., fiber-glass cloth) to form a dielectric layer usable in circuitized such as PCBs, chip carriers and the like. As such a layer, it includes a resin, a predetermined percentage ...	04/26/2011
7910156	Method of making circuitized substrate with selected conductors having solder thereon A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder cov...	03/22/2011
7897877	Capacitive substrate A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positione...	03/01/2011
7875811	High speed interposer A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned wit...	01/25/2011
7870664	Method of making circuitized substrate with a resistor A method of making a circuitized substrate including a resistor comprised of material which includes a polymer resin and a quantity of nano-powders including a mixture of at least one metal component and at least one ceramic component. The ceramic component may be a...	01/18/2011
7851906	Flexible circuit electronic package with standoffs A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexi...	12/14/2010
7841741	LED lighting assembly and lamp utilizing same An LED lighting assembly including a plurality of individual LEDs mounted on a common, bendable heat sinking member designed to remove heat from the LEDs during operation and also to be formed (bent) to provide the desired light direction and intensity. Several such...	11/30/2010
7838776	Circuitized substrates utilizing smooth-sided conductive layers as part thereof A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical proce...	11/23/2010
7827682	Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through th...	11/09/2010
7823274	Method of making multilayered circuitized substrate assembly A method of making a multilayered circuitized substrate assembly which includes bonding at least two circuitized substrates each including at least one layer of high temperature dielectric material, one of these layers in turn including at least one thru-hole therei...	11/02/2010
7814649	Method of making circuitized substrate with filled isolation border A method of making a circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantiall...	10/19/2010
7803688	Capacitive substrate and method of making same A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positione...	09/28/2010
7801833	Item identification control method A system and method for identifying and controlling the movement of various items, e.g., suitcases, associated with respective ones of various individuals, e.g., those desiring to travel on a selected means of transportation such as an airline, railway or the like. ...	09/21/2010
7800916	Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same A circuitized substrate assembly comprised of at least two circuitized substrates each including a thin dielectric layer and a conductive layer with a plurality of conductive members as part thereof, the conductive members of each substrate being electrically couple...	09/21/2010
7791897	Multi-layer embedded capacitance and resistance substrate core A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of ...	09/07/2010
7738631	Energy discriminating scatter imaging system A specimen inspection system includes a photon source for outputting photons along a transmission path and a conveyor for translating a specimen completely through the transmission path. A radiation detector is positioned offset with respect to the transmission path...	06/15/2010
7738249	Circuitized substrate with internal cooling structure and electrical assembly utilizing same An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and...	06/15/2010
7713767	Method of making circuitized substrate with internal optical pathway using photolithography A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The m...	05/11/2010
7712210	Method of providing a printed circuit board with an edge connection portion A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal a...	05/11/2010
7705320	Radiation detector with co-planar grid structure A semiconductor radiation detector (1′, 1″, 1′″, 1″″) includes a body of semiconducting material (2) responsive to ionizing radiation for generating electron-hole pairs in the bulk of said body (2). A conductive cathode (4	04/27/2010
7705319	CdZnTe device using constrained design for high-flux x-ray spectroscopic imaging applications A CdZnTe photon counting detector includes a core material of Cd1-xZnxTe, where (0≦x	04/27/2010
7687724	Circuitized substrate with internal resistor, method of making said circuitized substrate, and electrical assembly utilizing said circuitized substrate A circuitized substrate which utilizes at least one internal (embedded) resistor as part thereof, the resistor comprised of a material including resin and a quantity of powders of nano-particle and/or micro-particle sizes. The resistor serves to decrease the capacit...	03/30/2010
7687722	Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same A circuitized substrate including a composite layer comprising a first dielectric sub-layer comprised of a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particu...	03/30/2010
7679005	Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same A circuitized substrate in which selected ones of the signal conductors are substantially surrounded by shielding members which shield the conductors during passage of high frequency signals, e.g., to reduce noise. The shielding members may form solid members which ...	03/16/2010
7665207	Method of making a multi-chip electronic package having laminate carrier A method of making a multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurali...	02/23/2010
7646098	Multilayered circuitized substrate with p-aramid dielectric layers and method of making same A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fibergla...	01/12/2010
7638776	Staggered array imaging system using pixilated radiation detectors A radiation detection/imaging system includes a first set of radiation detectors spaced from each other in a first direction and a second set of radiation detectors spaced from each other in the first direction. The second set of radiation detectors is positioned la...	12/29/2009
7635552	Photoresist composition with antibacterial agent A photoresist composition, e.g., a positive acting resist, for use in the formation of circuit patterns and the like on printed circuit boards and the like circuitized substrates, the photoresist composition including a quantity of silver therein in a sufficient amo...	12/22/2009
7633068	Count uniformity correction in flux space for pixilated semiconducting radiation detectors In operation of a photon counting detecting system (10), a number of pulse counts output by least one pixel (20) of a photon counting detector in response to experiencing a photon flux density during a sample interval is acquired and a photon flux dens...	12/15/2009
7629684	Adjustable thickness thermal interposer and electronic package utilizing same An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively transferring heat from the chip to the heatsink. The interposer incl...	12/08/2009
7629559	Method of improving electrical connections in circuitized substrates A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series o...	12/08/2009
7629541	High speed interposer A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned wit...	12/08/2009
7627947	Method for making a multilayered circuitized substrate A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are...	12/08/2009

«First «Previous1 2 3 4 Next»Last»

PatentStorm

Bizarre Patents

PatentStorm News

Assignee: Endicott Interconnect Technologies, Inc.