Did You Know...
...that the video game, Pong, was invented by a guy who graduated at the bottom of his engineering class? Nolan Bushnell spent more time running the games at a local amusement park than he did on his studies at the University of Utah. His dreams of working for Disney's amusement empire were dashed when the company wouldn't hire him. Taking a boring job, Nolan daydreamed about electronic versions of popular games. He invented Pong, the first video game, and went on to found Atari Co.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 7430081 | Sub-micron adjustable mount for supporting a component and method An optical assembly includes a light path and at least one optic to be positioned in the path. A support arrangement supports the optic having a foot arrangement including at least one foot that receives a direct manipulation with the foot slidingly engaged against ... | 09/30/2008 |
| D555104 | CATV transmission system module | 11/13/2007 |
| 7291839 | Subcentimeter radiation detection and frequency domain spectroscopy A system, method and detection arrangement for investigation of a sample are described. A laser illumination arrangement generates (i) a source laser energy that is incident on a source to cause emission of subcentimeter radiation, at least a portion of which intera... | 11/06/2007 |
| D552552 | Serial to parallel electrical transceiver | 10/09/2007 |
| 7242824 | Flexible substrate for routing fibers in an optical transceiver An optical transceiver for converting and coupling an information-containing electrical signal with an optical fiber including a housing, an electro-optical subassembly in the housing for converting between an information-containing electrical signal and a modulated... | 07/10/2007 |
| 7198988 | Method for eliminating backside metal peeling during die separation A method of protecting metal traces and contacts on a fabricated semiconductor wafer from mechanical damage during dicing of the fabricated wafer, where the metal traces and contacts form electrical connections with an active device region of the semiconductor. The ... | 04/03/2007 |
| D537044 | CATV transmission system module | 02/20/2007 |
| 7137744 | Fiber optic transceiver module with rigid and flexible circuit boards An optical transceiver for converting and coupling an information-containing electrical signal with an optical fiber includes a housing and coupled rigid and flex printed circuit boards. The housing includes a fiber optic connector adapted for coupling with an exter... | 11/21/2006 |
| 7136552 | TO-packaged optic-fiber receiving interface and method An optical interface between an optical fiber and a photodiode is provided. The optical fiber has an end. The optical interface includes a lens located such that a chief ray of an optical signal outputted at said end traverses a center of the lens. The lens may be a... | 11/14/2006 |
| 7118292 | Coaxial cooled laser modules with integrated thermal electric cooler and optical components An opto-electric module adapted to be coupled with an optical fiber on a first side and a plurality of electrical conductors on a second side. The opto-electric module includes a header with a plurality of pins extending through the header a thermo-electric cooler w... | 10/10/2006 |
| 7115896 | Semiconductor structures for gallium nitride-based devices A nitride semiconductor is grown on a silicon substrate by depositing a few mono-layers of aluminum to protect the silicon substrate from ammonia used during the growth process, and then forming a nucleation layer from aluminum nitride and a buffer structure includi... | 10/03/2006 |
| 7083335 | Strength added epoxy fiber bonding in non-hermetic fiber optic packaging An optical fiber bonding scheme provides improved bonding properties and improved lifetime for non-hermetic fiber optic packages such as OSAs. The bonding scheme includes an optical fiber bonded to a substrate surface with an epoxy and a diffusion retarding plate co... | 08/01/2006 |
| 7075028 | Sub-micron adjustable mount for supporting a component and method Attaching an attachment surface of an electrically conductive workpiece to an electrically conductive support surface is described. In one aspect, a biasing force is distributed at least partially around a weld region of the workpiece to urge the attachment surface ... | 07/11/2006 |
| 7071407 | Method and apparatus of multiplejunction solar cell structure with high band gap heterojunction middle cell A method and a multijunction solar device having a high band gap heterojunction middle solar cell are disclosed. In one embodiment, a triple-junction solar device includes bottom, middle, and top cells. The bottom cell has a germanium (Ge) substrate and a buffer lay... | 07/04/2006 |
| 7070341 | High-density fiber-optic module with multi-fold flexible circuit A flexible printed circuit board (FPCB) for fiber optic modules includes a board with multiple bends, forming a structure with sides and a bottom. The traces in the FPCB traverse from the opto-electronic chips, through the sides of the FPCB, to the module interconne... | 07/04/2006 |
| 7042921 | Complex coupled single mode laser with dual active region A semiconductor complex coupled light emitting device is disclosed having a lower cladding layer, an optical cavity formed adjacent the lower cladding layer and an upper cladding layer formed adjacent the optical cavity. The optical cavity includes a lower multi-qua... | 05/09/2006 |
| 7021836 | Attenuator and conditioner An apparatus and method of attenuating and/or conditioning optical energy for an optical transmitter, receiver or transceiver module is disclosed. An apparatus for attenuating the optical output of an optoelectronic connector including: a mounting surface; an array ... | 04/04/2006 |
| 7023022 | Microelectronic package having improved light extraction A light-emitting package includes a substantially transparent substrate having a first surface and a second surface including a lens. The package also includes a light-emitting diode (LED) adapted to emit light having a predetermined wavelength, the LED being secure... | 04/04/2006 |
| 7011455 | Opto-electronic TO-package and method for laser An optical interface between an optical fiber and a laser is provided. The optical fiber has a core and an end. The optical interface includes a mirror that is capable of receiving an optical output of the laser and of reflecting the optical output to the end of the... | 03/14/2006 |
| D513252 | Electro-optical converter | 12/27/2005 |
| 6958498 | Optimized contact design for flip-chip LED Light emitting diodes are provided with electrode and pad structures that facilitate current spreading and heat sinking. A light emitting diode may be formed as a die with a stacked structure having a first region and a mesa projecting from a surface of the first re... | 10/25/2005 |
| 6956997 | Methods for fabricating an aligned optoelectronic waveguide circuit Two techniques are disclosed for writing waveguides between laser diodes and an optical fiber such that the laser diodes are aligned with their respective waveguide facets. The first technique utilizes a light sensitive polymer, such as a ultra-violet (UV) cross-lin... | 10/18/2005 |
| 6952297 | Method of differentially connecting photonic devices A method and apparatus are provided for driving an electro-optic converter assembly with an information signal. The method includes the steps of disposing a resistor having a resistance substantially equal to a resistance of the electro-optic converter adjacent the ... | 10/04/2005 |
| 6946313 | Method of making an aligned electrode on a semiconductor structure A method of making an electrode on a semiconductor device including depositing metal on a top surface of a semiconductor structure, and defining a first region of the semiconductor structure for a first electrode by forming a mask over the metal. The mask has an ope... | 09/20/2005 |
| 6936483 | On-wafer burn-in of semiconductor devices using thermal rollover Apparatus and method for on-wafer burn-in of a semiconductor device. In a preferred embodiment, the present invention is realized using an auto-prober commonly used in scan-testing of semiconductor devices. Specifically, in one embodiment, the auto-prober is program... | 08/30/2005 |
| 6917764 | Predistortion circuit with combined odd-order and even-order correction An apparatus and associated method for generating predistortion IMD in a predistortion circuit. The method comprising adjusting the bias voltage, adjusting the bias current; adjusting the gain of the amplifier; and adjusting the differential bias current flowing thr... | 07/12/2005 |
| 6905260 | Method and apparatus for coupling optical elements to optoelectronic devices for manufacturing optical transceiver modules A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following... | 06/14/2005 |
| 6902990 | Semiconductor device separation using a patterned laser projection A method for separating a semiconductor wafer into several thousand devices or dies by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a ... | 06/07/2005 |
| 6892010 | Photodetector/optical fiber apparatus with enhanced optical coupling efficiency and method for forming the same An optical thick film formed on a photodetector improves the optical coupling efficiency between the optical fiber and photodetector which are optically coupled. The optical thick film has a refractive index that is between the refractive index of air and the refrac... | 05/10/2005 |
| 6863453 | Method and apparatus for parallel optical transceiver module assembly An apparatus and method of modular manufacturing process for a parallel optical transmitter, receiver and/or transceiver is disclosed. The modular process assembles an array of optoelectronic devices to an array header to form an optoelectronic array package. Once t... | 03/08/2005 |
| 6864414 | Apparatus and method for integral bypass diode in solar cells A solar cell having a multijunction solar cell structure with a bypass diode is disclosed. The bypass diode provides a reverse bias protection for the multijunction solar cell structure. In one embodiment, the multifunction solar cell structure includes a substrate,... | 03/08/2005 |
| 6822879 | Embedded electromagnetic interference shield An improved electromagnetic interference shield for a module includes springs in which the compression force pushes the springs in a direction that is approximately parallel to the optic axis. The springs allow significantly looser tolerances on the placement of the... | 11/23/2004 |
| 6799902 | Optoelectronic mounting structure An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit h... | 10/05/2004 |
| 6765242 | Npn double heterostructure bipolar transistor with ingaasn base region An NPN double heterostructure bipolar transistor (DHBT) is disclosed with a base region comprising a layer of p-type-doped indium gallium arsenide nitride (InGaAsN) sandwiched between n-type-doped collector and emitter regions. The use of InGaAsN for the base region... | 07/20/2004 |
| 6746889 | Optoelectronic device with improved light extraction An improved method for producing optoelectronic devices such as light emitting diodes or laser diodes is provided. Light emitting diodes or laser diodes are provided with improved light extraction. Epitaxial layers including a light emitting p-n junction are deposit... | 06/08/2004 |
| 6728277 | Envelope biasing for laser transmitters A laser transmitter is configured to use a dynamic bias signal in place of a conventional dc bias current. In particular, the envelope of the applied RF signal is detected and the envelope used to dynamically adjust the laser bias. In this manner, clipping of the la... | 04/27/2004 |
| 6726769 | Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition The invention describes a CVD reactor on solid substrates and a related method of deposition of epitaxial layers on the wafers. In the reactor of the invention, the wafer carrier is transported between a loading position and a deposition position. In the deposition ... | 04/27/2004 |
| 6727167 | Method of making an aligned electrode on a semiconductor structure A method of making a transparent electrode for a light-emitting diode includes depositing metal on a top surface of a semiconductor structure, and defining a first region of the semiconductor structure for a first electrode by forming a mask over the metal, the mask... | 04/27/2004 |
| 6685774 | Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition A method of growing epitaxial layers on a wafer is provided and includes providing a wafer carrier having a surface for retaining the wafer; placing the wafer on the wafer-retaining surface of the wafer carrier while the wafer carrier is in a loading posi... | 02/03/2004 |
| 6680432 | Apparatus and method for optimizing the efficiency of a bypass diode in multijunction solar cells Apparatus and Method for Optimizing the Efficiency of a Bypass Diode in Solar Cells. In a preferred embodiment, a layer of TiAu is placed in an etch in a solar cell with a contact at a doped layer of GaAs. Electric current is conducted through a diode and... | 01/20/2004 |
