Assignee: Electro Scientific Industries, Inc.

Location: Portland, OR
No. of patents: 218

Number	Title	Issue Date
RE43400	Laser segmented cutting, multi-step cutting, or both UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned within a first short segment (122) for a p...	05/22/2012
8178906	Laser chalcogenide phase change device A laser activated phase change device for use in an integrated circuit comprises a chalcogenide fuse configured to connect a first patterned metal line and a second patterned metal line and positioned between an inter layer dielectric and an over fuse dielectric. Th...	05/15/2012
8178818	Photonic milling using dynamic beam arrays A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet ...	05/15/2012
8173931	Automatic recipe management for laser processing a work piece To better address these problems, one or more characteristics are measured from a work piece (28). The measurement information is used to select a preferred predetermined laser processing recipe from a lookup table. The laser processing recipe is then used to...	05/08/2012
8148211	Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates ...	04/03/2012
8134760	Achieving convergent light rays emitted by planar array of light sources Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for...	03/13/2012
8132966	Rotary flexure and air bearing support for rotary indexing system A highly position-stabilized indexable table or “dial” in which the dial is supported relative to a steel surface on a frame by one or more air bearings. A flexure mechanically connects the indexing motor to the dial in such a way as to be torsionally non-compli...	03/13/2012
8124911	On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench widt...	02/28/2012
8117744	Process for forming an isolated electrically conductive contact through a metal package A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom su...	02/21/2012
8116341	Multiple laser wavelength and pulse width process drilling Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to...	02/14/2012
8110775	Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing A system determines relative positions of a semiconductor substrate and a plurality of laser beam spots on or within the semiconductor substrate in a machine for selectively irradiating structures on or within the substrate using a plurality of laser beams. The syst...	02/07/2012
8093532	Laser machining of fired ceramic and other hard and/or thick materials Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the ...	01/10/2012
8084896	Monolithic stage positioning system and method A magnetically levitated monolithic stage positioning system includes linear three phase motors and coil windings connected to the monolithic stage that interact with a ferromagnetic base. The linear three phase motors may be excited to provide motion in an X-axis d...	12/27/2011
8081668	High energy pulse suppression method A laser processes a workpiece with laser pulses delivered at random time intervals and at substantially constant energy levels by characterizing the laser cavity discharge behavior and utilizing that information for adjusting dummy pulse time periods to compensate f...	12/20/2011
8076605	Systems and methods for adapting parameters to increase throughput during laser-based wafer processing Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of w...	12/13/2011
8054085	Programmable gain trans-impedance amplifier overload recovery circuit Embodiments of an apparatus for measuring the leakage current of capacitive components is taught. One embodiment includes a first stage amplifier configured to receive an input from a serially-connected capacitive component at an inverting input and a feedback resis...	11/08/2011
8049135	Systems and methods for alignment of laser beam(s) for semiconductor link processing A method makes a discrete adjustment to static alignment of a laser beam in a machine for selectively irradiating conductive links on or within a semiconductor substrate using the laser beam. The laser beam propagates along a beam path having an axis extending from ...	11/01/2011
8048774	Methods and systems for laser machining a substrate A formation in a first surface of a substrate is machined by an ultraviolet or visible radiation laser, to a predetermined depth that is less than a full depth of the substrate; and material is removed from a second surface of the substrate opposed to the first surf...	11/01/2011
8026158	Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the s...	09/27/2011
8024060	Method for defining safe zones in laser machining systems A method for defining machine cutting path safety zones for use in laser machining devices. The method includes indentifying safety zone positional coordinates in a computer aided design model, using a machine vision system to image the modeled physical machining de...	09/20/2011
7989320	Die bonding A die bonding method and apparatus by which a wafer substrate 11 adhered to a carrier tape 13 by an adhesive layer 12 is laser machined through the wafer substrate and through the adhesive layer at most to scribe the carrier tape to form a singu...	08/02/2011
7985942	Method of providing consistent quality of target material removal by lasers having different output performance characteristics Laser pulse energy adjustments are motivated by an understanding of the effect of laser pulse width variations among different lasers on satisfying a quality metric associated with a laser-processed target. In a preferred embodiment, the adjustments normalize this e...	07/26/2011
7982161	Method and apparatus for laser drilling holes with tailored laser pulses An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailor...	07/19/2011
7982160	Photonic clock stabilized laser comb processing Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compens...	07/19/2011
7977601	X and Y orthogonal cut direction processing with set beam separation using 45 degree beam split orientation apparatus and method An X & Y orthogonal cut apparatus for scribing a pair of parallel cuts on a planar workpiece, the workpiece plane having an X-axis and a Y-axis, where the apparatus includes a laser device generating at least two beams including a first beam and a second beam, the f...	07/12/2011
7977213	Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece A solution to failure mechanisms caused by mechanical sawing of a mechanical semiconductor workpiece entails use of a laser beam to cut and remove the electrically conductive and low-k dielectric material layers from a dicing street before saw dicing to separate sem...	07/12/2011
7968820	Method of producing a panel having an area with light transmissivity A method for producing an area of light transmissivity in a generally opaque panel comprises forming an area of reduced thickness in the panel, laser drilling an array of microscopic holes in the area and thereafter filling the holes with a light transmissive materi...	06/28/2011
7965091	Test plate for electronic handler A gap set device for an electronic component handler is provided. The electronic component handler includes a test module operative to load, test and unload electronic components. The electronic components are received in test pockets provided on a test plate. The t...	06/21/2011
7964819	Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target Various methods and systems measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processin...	06/21/2011
7947575	Laser machining A method of laser machining a feature in a substrate includes machining the substrate with a pulsed laser along a scan line so that the successive pulses 81 at the substrate do not overlap but are either contiguous or spaced apart. Pulses 82, 83, 84 in...	05/24/2011
7943862	Method and apparatus for optically transparent via filling A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via...	05/17/2011
7940058	Capacitive measurements with fast recovery current return An apparatus and method for measuring the leakage current of capacitive components. A switch that grounds a terminal of a component being tested is closed while the component is charged to a desired test voltage. When this charging is complete, the switch opens so t...	05/10/2011
7935941	Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates ...	05/03/2011
7929857	Optimizing use and performance of optical systems implemented with telecentric on-axis dark field illumination Systems and methods are provided for imaging a planar specular object such as a semiconductor wafer. In one embodiment, an imaging system for imaging a defect on a planar specular object includes a telecentric lens having a sufficiently aspherical surface such that ...	04/19/2011
7924033	Compensation tool for calibrating an electronic component testing machine to a standardized value A compensation tool and process is provided for calibrating each test position located at a plurality of test modules of an electronic testing machine to a standardized value. Each test module is located on an angularly spaced radial line extending from an associate...	04/12/2011
7923306	Semiconductor structure processing using multiple laser beam spots Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam th...	04/12/2011
7905471	Vacuum ring designs for electrical contacting improvement Recesses (72), surface contours, contact tip modifications (52, 56), and/or other methods of ensuring pressure between a bottom surface (50) of a test plate (5) and top surfaces (52) of electrical contacts (18) are employed ...	03/15/2011
7903701	Intracavity harmonic generation using a recycled intermediate harmonic Lasers configured for intracavity harmonic generation of second and higher order harmonic laser beam energy include mode-matching optics, such as a curved mirror, for recycling an unused portion of an intermediate harmonic laser beam energy (e.g., second harmonic la...	03/08/2011
7889322	Specimen inspection stage implemented with processing stage coupling mechanism A specimen inspection stage implemented with a processing stage coupling mechanism provides a capability to conduct with maximum efficiency post-processing specimen inspections on-board a processing platform. Heavy inspection equipment is mounted on a specimen inspe...	02/15/2011
7888949	Electrical tester setup and calibration device An electronic testing machine includes a plurality of test modules. Each test module has a plurality of contact pairs for testing electronic components. An apparatus and process for electrical test setup and calibration of the electronic testing machine includes a p...	02/15/2011

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Assignee: Electro Scientific Industries, Inc.