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Felix Hoffmann, a German chemist, was searching for something to relieve his father's arthritis. In doing so, he "rediscovered" acetylsalicylic acid and in 1900, patented a stable process for developing it. Hence, we have aspirin.
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| Number | Title | Issue Date |
| 7944104 | Magnetic bearing apparatus A magnetic bearing apparatus supports a rotating object using magnetic levitation by a magnetic force of electromagnets. The magnetic bearing apparatus includes a PWM driver configured to supply exciting currents to the electromagnets, a driver power source configur... | 05/17/2011 |
| 7938619 | Turbo vacuum pump A turbo vacuum pump of the present invention includes a suction part for sucking gas in an axial direction; a discharge section in which rotating impellers and stationary impellers are alternately arranged; a rotating shaft for rotating the rotating impellers; and a... | 05/10/2011 |
| 7938130 | Substrate holding rotating mechanism, and substrate processing apparatus A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holdin... | 05/10/2011 |
| 7928382 | Detector and inspecting apparatus An inspecting apparatus for reducing a time loss associated with a work for changing a detector is characterized by comprising a plurality of detectors 11, 12 for receiving an electron beam emitted from a sample W to capture image data representative of the s... | 04/19/2011 |
| 7928378 | Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; ... | 04/19/2011 |
| 7918983 | Substrate plating method and apparatus A substrate plating method makes it possible to plate a metal, such as copper or a copper alloy, uniformly into fine recesses in a substrate without forming voids in the metal-filled recesses. The substrate plating method for filling a metal into fine recesses in a ... | 04/05/2011 |
| D634719 | Elastic membrane for semiconductor wafer polishing apparatus | 03/22/2011 |
| 7901551 | Substrate holder and plating apparatus The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate ... | 03/08/2011 |
| 7901550 | Plating apparatus A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so... | 03/08/2011 |
| 7897024 | Conducting belt for use with anode holder and anode holder A conducting belt is used with an anode holder for supplying an electric current to an anode for plating a surface of a substrate such as a semiconductor wafer. The anode and the substrate are vertically disposed so as to face each other in a plating tank of a plati... | 03/01/2011 |
| 7897007 | Substrate holding apparatus and substrate polishing apparatus A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged t... | 03/01/2011 |
| D633452 | Elastic membrane for semiconductor wafer polishing apparatus | 03/01/2011 |
| 7888642 | Electron beam apparatus and method of manufacturing semiconductor device using the apparatus The present invention provides an electron beam apparatus for irradiating a sample with primary electron beams to detect secondary electron beams generated from a surface of the sample by the irradiation for evaluating the sample surface. In the electron beam appara... | 02/15/2011 |
| 7886685 | Substrate holding apparatus, substrate holding method, and substrate processing apparatus A substrate holding apparatus can meet the request for a smaller-sized compact apparatus while ensuring a sufficient immersion depth of a substrate in a processing liquid. The substrate holding apparatus includes: a substrate holder for supporting a substrate (W) by... | 02/15/2011 |
| 7883394 | Substrate holding mechanism, substrate polishing apparatus and substrate polishing method A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the... | 02/08/2011 |
| 7878144 | Electroless plating apparatus and electroless plating method An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically re... | 02/01/2011 |
| 7875158 | Plating apparatus A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. ... | 01/25/2011 |
| 7874809 | Water-lifting pump apparatus and method for controlling operation thereof A water-lifting pump apparatus which is free of a discharge valve and a check valve, is low in cost, and is capable of reducing vibration and noise due to a waterfall after the end of water pumping operation. The water-lifting pump apparatus has a suction tank (1... | 01/25/2011 |
| 7867063 | Substrate holding apparatus and polishing apparatus A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a ... | 01/11/2011 |
| 7863580 | Electron beam apparatus and an aberration correction optical apparatus An electron beam apparatus for providing an evaluation of a sample, such as a semiconductor wafer, that includes a micro-pattern with a minimum line width not greater than 0.1 μm with high throughput. A primary electron beam generated by an electron gun is irradiat... | 01/04/2011 |
| 7862402 | Polishing apparatus and substrate processing apparatus The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing for forming a poli... | 01/04/2011 |
| 7855364 | Projection electronic microscope for reducing geometric aberration and space charge effect A projection electronic microscope is provided for improving geometric aberration and a space charge effect within a zooming range using a zoom type transfer lens system in a projection/image formation optical system. The projection electronic microscope comprises a... | 12/21/2010 |
| 7854646 | Substrate polishing apparatus and substrate polishing method The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing s... | 12/21/2010 |
| D629422 | Pump mount base for vacuum compression apparatus | 12/21/2010 |
| 7850817 | Polishing device and substrate processing device A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided ... | 12/14/2010 |
| 7850509 | Substrate holding apparatus The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a su... | 12/14/2010 |
| 7837534 | Apparatus for heating or cooling a polishing surface of a polishing apparatus The present invention provides an apparatus for heating or cooling a polishing surface. This apparatus includes a heat exchanger arranged so as to face the polishing surface when the workpiece is polished. The heat exchanger includes a medium passage through which a... | 11/23/2010 |
| 7833393 | Semiconductor wafer holder and electroplating system for plating a semiconductor wafer A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the s... | 11/16/2010 |
| 7830056 | Magnetic bearing device and method An energy-saving magnetic bearing device with no bias current for making the relation between the excitation current and the magnetic force of the electromagnet linear is provided. In a magnetic bearing device for supporting a rotor 1 serving as the magnetic ... | 11/09/2010 |
| 7829871 | Sheet beam-type testing apparatus An electron beam apparatus such as a sheet beam based testing apparatus has an electron-optical system for irradiating an object under testing with a primary electron beam from an electron beam source, and projecting an image of a secondary electron beam emitted by ... | 11/09/2010 |
| 7829853 | Sample surface observation method A surface of a sample is observed by acquiring an image of the surface of the sample. An electron beam I irradiated onto the surface of the sample in which wiring including an insulation material and an electrically conductive material is formed. Electrons that acqu... | 11/09/2010 |
| 7827821 | Absorption refrigerating machine To provide a highly efficient and compact absorption refrigerating machine with water heated from 60 to 70 degrees Celsius as the heat source. In an absorption refrigerating machine including a regenerator G, condenser C, an absorber A, an evaporator E, an auxiliary... | 11/09/2010 |
| 7827817 | Absorption heat pump An absorption heat pump, including: an evaporator which takes in a first heat source and evaporates refrigerant liquid into refrigerant vapor; an absorber which has a heat receiving medium passage and which takes in heat receiving medium liquid through a heat receiv... | 11/09/2010 |
| 7822500 | Polishing apparatus and polishing method A polishing apparatus has a polishing table (18) having a polishing surface (40) and a top ring (20) for pressing a substrate against the polishing surface (40) while independently controlling pressing forces applied to a plurality of are... | 10/26/2010 |
| 7807027 | Substrate holder, plating apparatus, and plating method A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for ... | 10/05/2010 |
| 7799425 | Composite nanoparticles method for producing the same A composite nanoparticle makes it possible to significantly lower the temperature to separate an organic substance from a core and uniformly sinter the cores, and can be applied to bonding that replaces soldering. The composite nanoparticle includes a metal componen... | 09/21/2010 |
| 7780503 | Polishing apparatus and polishing method A polishing apparatus makes it possible to polish and remove an extra conductive film while preventing the occurrence of erosion and without lowering of the throughput. The polishing apparatus includes: a polishing table having a polishing surface; a top ring for ho... | 08/24/2010 |
| 7776228 | Catalyst-aided chemical processing method A catalyst-aided chemical processing method is a novel processing method having a high processing efficiency and suited for processing in a space wavelength range of not less than several tens of μm. The catalyst-aided chemical processing method comprises: immersin... | 08/17/2010 |
| 7767472 | Substrate processing method and substrate processing apparatus A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of... | 08/03/2010 |
| 7745784 | Electron beam apparatus and method of manufacturing semiconductor device using the apparatus The present invention provides an electron beam apparatus for evaluating a sample surface, which has a primary electro-optical system for irradiating a sample with a primary electron beam, a detecting system, and a secondary electro-optical system for directing seco... | 06/29/2010 |
