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| Number | Title | Issue Date |
| 8163049 | Fluoride-modified silica sols for chemical mechanical planarization A chemical-mechanical planarization composition containing surface-modified abrasive particles such as silica where at least a portion of the surface of the particles has bound thereto a surface-modifying aluminum-containing stabilizer and fluoride that is used to p... | 04/24/2012 |
| 8057696 | Compositions and methods for rapidly removing overfilled substrates This invention relates to compositions and methods for removing overfilled substrates, preferably at a relatively high removal rates. Advantageously, a composition according to the invention can contain an oxidizer, preferably a per-type oxidizer such as a peroxide,... | 11/15/2011 |
| 7524346 | Compositions of chemical mechanical planarization slurries contacting noble-metal-featured substrates A composition for chemical-mechanical planarization comprises periodic acid and an abrasive present in a combined amount sufficient to planarize a substrate surface having a feature thereon comprising a noble metal, noble metal alloy, noble metal oxide, or any combi... | 04/28/2009 |
| 7514363 | Chemical-mechanical planarization composition having benzenesulfonic acid and per-compound oxidizing agents, and associated method for use A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains an abrasive, benzenesulfonic acid compound, a per-compound oxidizing agent, and water. The composition affords tunability of remova... | 04/07/2009 |
| 7513920 | Free radical-forming activator attached to solid and used to enhance CMP formulations A CMP composition having: a fluid comprising water and at least one oxidizing compound that produces free radicals when contacted with an activator; and a plurality of particles having a surface and comprising at least one activator selected from ions or compounds o... | 04/07/2009 |
| 7476620 | Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers A chemical mechanical polishing composition contains 1) water, 2) optionally an abrasive material, 3) an oxidizer, preferably a per-type oxidizer, 4) a small amount of soluble metal-ion oxidizer/polishing accelerator, a metal-ion polishing accelerator bound to parti... | 01/13/2009 |
| 7429338 | Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stab... | 09/30/2008 |
| 7427361 | Particulate or particle-bound chelating agents The invention generally relates to compositions and methods for chemically mechanically polishing a substrate, including a polishing accelerator, which is normally one or more oxidizers, an abrasive material, and chelating particles and/or metal-absorbent clay mater... | 09/23/2008 |
| 7427305 | Free radical-forming activator attached to solid and used to enhance CMP formulations This invention relates to a method of making selected oxidizers or other free radical-producing compounds become more effective chemical etchants and/or oxidizers for CMP activities by promoting the formation of the free radicals in a CMP composition with one or mor... | 09/23/2008 |
| 7351662 | Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishi... | 04/01/2008 |
| 7344988 | Alumina abrasive for chemical mechanical polishing Methods of manufacturing alumina abrasive for use in chemical mechanical polishing are described, wherein the abrasive is in a slurry having gamma alumina formed in a low temperature fuming process, water, an acid sufficient to maintain the pH below about 7, wherein... | 03/18/2008 |
| 7316976 | Polishing method to reduce dishing of tungsten on a dielectric The present invention relates generally to compositions and associated methods for chemical-mechanical polishing of substrate surfaces having at least one feature thereon comprising tungsten and at least one feature thereon comprising a dielectric material. The comp... | 01/08/2008 |
| 7314823 | Chemical mechanical polishing composition and process A composition for chemical mechanical polishing includes a slurry. A sufficient amount of a selectively oxidizing and reducing compound is provided in the composition to produce a differential removal of a metal and a dielectric material. A pH adjusting compound adj... | 01/01/2008 |
| 7276180 | Chemical mechanical polishing composition and process A composition for chemical mechanical polishing includes a slurry. A sufficient amount of a selectively oxidizing and reducing compound is provided in the composition to produce a differential removal of a metal and a dielectric material. A pH adjusting compound adj... | 10/02/2007 |
| 7247179 | Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two di... | 07/24/2007 |
| 7153335 | Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole A composition and associated method for chemical mechanical planarization (or other polishing) are described which afford high tantalum to copper selectivity in copper CMP and which are tunable (in relation to polishing performance). The composition comprises an abr... | 12/26/2006 |
| 7077880 | Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization A composition and an associated method for chemical mechanical planarization (or other polishing) are described. The composition includes a surface-modified abrasive modified with at least one stabilizer and at least one catalyst differing from the at least one stab... | 07/18/2006 |
| 7022255 | Chemical-mechanical planarization composition with nitrogen containing polymer and method for use A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an organometallic-modified colloidal abrasive and a nitrogen-containing polymer compound (e.g., a polyalkyleneimine, such as polya... | 04/04/2006 |
| 6979252 | Low defectivity product slurry for CMP and associated production method A low defectivity colloidal silica-based product slurry for use in chemical mechanical planarization (CMP) and an associated production method are described. The product slurry is produced using centrifugation of and optionally with addition of a surfactant to a sta... | 12/27/2005 |
| 6893476 | Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal A composition and associated methods for chemical mechanical planarization (or other polishing) are described. The composition may comprise an abrasive and a dispersed hybrid organic/inorganic particle. The composition may further comprise an alkyne compound. Two di... | 05/17/2005 |
