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Assignee: Dowa Mining Co., Ltd.


Location: Tokyo, JP
No. of patents: 206

1            
NumberTitleIssue Date
7820138Indium oxide powder and method for producing same
At least one basic precipitant selected from the group consisting of NaOH, KOH, NH4OH, NH3, NH4HCO3 and (NH4)2CO3 is added to an indium salt solution, which contains 0.1 to 3 M of indium, i...
10/26/2010
7722728Heat treatment method and heat treatment apparatus
In a heat treatment method for supplying transforming gas and enriched gas inside a furnace and heat treating a workpiece inside the furnace, feedback control of carbon potential is performed by operating a supply flow rate of the enriched gas based on carbon potent...
05/25/2010
7651785Tin-plated product
There is provided a tin-plated product which has a small deterioration of contact resistance with age, an excellent wear resistance and a low coefficient of friction. A coating of a composite material, which contains 0.1 to 1.0 wt % of carbon particles dispersed in ...
01/26/2010
7641817Silver powder and method for producing same
There is provided a method for producing a silver powder having excellent dispersibility and capable of forming a paste which do not form suspended matters by phase separation and which is printed on a substrate to form a film having a uniform thickness. In this met...
01/05/2010
7585588Battery positive electrode material
A material for the positive electrode of a silver oxide battery is provided that increases the discharge capacity of the battery. The positive electrode material is a conductive composite oxide represented by the general formula AgxNiyO2
09/08/2009
7575643Carburization treatment method
The invention provides a carburization treatment method in which the carburization treatment is conducted under a condition where an atmosphere within the furnace is maintained at a high carbon potential which is slightly blow a carbon solid solubility. Preferably, ...
08/18/2009
7481698Sintered rare earth magnetic alloy wafer surface grinding machine
A surface grinding machine for a sintered rare earth magnetic alloy wafer comprises a pair of disk-shaped grindstones that face each other across a prescribed gap to be rotatable in opposite directions about their center axes. The grinding surfaces of the pair of gr...
01/27/2009
7394024Oxide superconductor current lead and method of manufacturing the same, and superconducting system
An oxide superconductor current lead in which generation of Joule heat at joint portions with a system side conductor and a power supply side conductor is reduced with use of an oxide superconductor with less heat penetration into a super conducting equipment system...
07/01/2008
7393596Aluminum/ceramic bonding substrate and method for producing same
When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grai...
07/01/2008
7393473Method for producing a composite plated product
There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a large content of carbon and a large quantity of carbon particles on t...
07/01/2008
7387741Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member....
06/17/2008
7368665Circuit board and a power module employing the same
A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a lower part of adjacent elements of the pattern on the metal layer which...
05/06/2008
7351372Copper base alloy and method for producing same
As a raw material of a copper base alloy containing at least one of 0.2 to 12 wt % of tin and 8 to 45 wt % of zinc, at least one of a copper base alloy having a large surface area and containing carbon on the surface thereof, a copper base alloy having a liquidus li...
04/01/2008
7348493Metal-ceramic circuit board
A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stres...
03/25/2008
7345418Phosphor mixture and light emitting device using the same
A phosphor mixture containing four or more kinds of phosphors including a red phosphor, an orange phosphor, a blue phosphor, and a green phosphor, to produce emission having excellent color rendering of white light at a high color temperature, and emission in warm w...
03/18/2008
7332220Iron nitride magnetic powder and method of producing the powder
An iron nitride magnetic powder consisting primarily of Fe16N2 phase whose average particle diameter determined by particle size measurement using a TEM micrograph is 20 nm or less and whose geometric standard deviation of the particle diameter...
02/19/2008
7314666Iron nitride system magnetic powder having good storage stability
An iron nitride system magnetic powder comprising of particles comprised primarily of Fe16N2 (having an average particle diameter of up to 25 nm, for example) is provided, to which one or more elements selected from Si, P and Ti is adhered. The powder has...
01/01/2008
7304378Aluminum/ceramic bonding substrate
There is provided an aluminum/ceramic bonding substrate having a high reliability to high-temperature heat cycles. An aluminum member of an aluminum alloy having a Vickers hardness of 35 to 45 is bonded to a ceramic substrate having a flexural strength of 500 to 600...
12/04/2007
7276292Insulating substrate boards for semiconductor and power modules
An insulating substrate board for a semiconductor of the present invention comprises a ceramic substrate board (2) and a metal alloy layer (3) consisting of aluminum formed on one surface portion of the ceramic substrate board (2), wherein the V...
10/02/2007
7273568Phosphor and production method of the same, method of shifting emission wavelength of phosphor, and light source and LED
A phosphor including a main production phase of a phosphor expressed by a composition formula of MmAaBbOoNn:Zz (where an element M is one or more bivalent elements, an element A is one or more trivalent elements, an element B is one or more tetravalent elements, O i...
09/25/2007
7273405Sintered rare earth magnetic alloy wafer and wafer surface growing machine
A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily gr...
09/25/2007
7256353Metal/ceramic bonding substrate and method for producing same
There is provided a metal/ceramic bonding substrate capable of preventing the reverse thereof from greatly warping so as to be concave even if it is heated for soldering. In the metal/ceramic bonding substrate, a metal circuit plate 12 is bonded to one side o...
08/14/2007
7255931Aluminum/ceramic bonding substrate and method for producing same
When an aluminum plate is bonded directly to a ceramic substrate by cooling and solidifying molten aluminum which is injected into a mold so as to contact the ceramic substrate arranged in the mold, an additive, such as a TiB alloy, Ca or Sr, for decreasing the grai...
08/14/2007
7255807Bond magnet and ferrite magnetic powder for bond magnet
A ferrite magnetic powder for bond magnet that experiences only small decrease in coercivity when molded into a bond magnet is provided, which is a ferrite magnetic powder that includes an alkaline-earth metal constituent and exhibits a decrease in coercivity of not...
08/14/2007
7252788Phosphor, light source and LED
A phosphor with high efficiency having an excitation band corresponding to light of the ultraviolet-visible (300 to 550 nm) wavelength region emitted from a light emitting portion which emits blue or ultraviolet light is provided. A nitride of Ca, a nitride of Al, a...
08/07/2007
7241501Iron nitride magnetic powder and method of producing the powder
An iron nitride magnetic powder comprised primarily of Fe16N2 phase is characterized in that its coercive force Hc is 200 KA/m or greater and bulk switching field distribution BSDF is 2 or less. The magnetic powder can be produced by allowing a...
07/10/2007
7238438Powder for underlayer of coating-type magnetic recording medium
A powder for an underlayer of a coating-type magnetic recording medium, which powder comprises flat-acicular iron oxide particles having an average major axis length of 20–200 nm, a short axis cross-section taken perpendicularly to the long axis that has a long wi...
07/03/2007
7238432Metal member coated with metal layers
There is provided a metal member capable of realizing a corrosion resistance and wear resistance, which are equivalent to or better than those when expensive PdNi is used even if PdNi is not used, and of being produced at relatively low costs. A first layer essentia...
07/03/2007
7235119Copper particle clusters and powder containing the same suitable as conductive filler of conductive paste
Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excel...
06/26/2007
7235181Metal powder for decomposition of organic halogen and method for manufacturing the same
The present invention is to provide metal powder capable of decomposing and remedying various range of organic halogen compounds including organic halogen compounds which are difficult to be decomposed by a conventional decomposition and remediation method. Metal po...
06/26/2007
7226573Fine-grain silver oxide powder
A silver oxide powder that replaces silver powder as a silver conductive paste filler has a specific surface area measured by the BET method is 1.0–25.0 m2/g, average primary particle diameter is 1–50 nm, and average secondary particle diameter is 1â€...
06/05/2007
7219826Method for producing metal/ceramic bonding substrate
There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal 12 is a...
05/22/2007
7189449Metal/ceramic bonding substrate and method for producing same
In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided al...
03/13/2007
7180176Radiation plate and power semiconductor module IC package
Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to h...
02/20/2007
7166172Method of making ferromagnetic iron alloy powder for magnetic recording medium
A ferromagnetic iron alloy powder for a magnetic recording medium is composed of acicular iron-base particles of an average major axis length (X) of not less than 20 nm and not greater than 80 nm and have oxygen content of not less than 15 wt % and coercive force (H...
01/23/2007
7159310Electronic part mounting substrate and method for producing same
In a method for producing an electronic part mounting substrate wherein a heat sinking metal base plate 12 is bonded to one side of a ceramic substrate 10, and one side of a circuit forming metal plate 14 is bonded to the other side thereof, an ...
01/09/2007
7159757Metal/ceramic bonding article and method for producing same
After a metal member of an alloy containing copper and nickel is arranged on at least one side of a ceramic substrate, the metal member and the ceramic substrate are heated in an atmosphere of an inert gas or in vacuo at a temperature between solidus and liquidus li...
01/09/2007
7138756Phosphor for electron beam excitation and color display device using the same
A phosphor, which has less reduction in emission efficiency and is capable of keeping high luminance even when density of an electron beam for exciting the phosphor increases, is provided. As raw materials, Ca3N2 (2N), AlN (3N), Si3N...
11/21/2006
7131483Apparatus, mold, and method for manufacturing metal-ceramic composite member
A manufacturing apparatus capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefor. An apparatus for manufacturing a metal-ceramic composite member has a plurality of pro...
11/07/2006
7128844Metal/ceramic circuit board and method for producing same
A metal layer 12 of aluminum or an aluminum alloy is formed on at least one side of a ceramic substrate 10, and a resist 14 having a predetermined shape is formed on the metal layer 12. Then, an etchant of a mixed solution prepared by mix...
10/31/2006
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